X-On Electronics has gained recognition as a prominent supplier of EMD4E001G16G2-150CAS2 MRAM across the USA, India, Europe, Australia, and various other global locations. EMD4E001G16G2-150CAS2 MRAM are a product manufactured by Everspin. We provide cost-effective solutions for MRAM, ensuring timely deliveries around the world.

EMD4E001G16G2-150CAS2 Everspin

EMD4E001G16G2-150CAS2 electronic component of Everspin
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Part No.EMD4E001G16G2-150CAS2
Manufacturer: Everspin
Category: MRAM
Description: MRAM 1Gb Non-Volatile ST-DDR4 Spin-transfer Torque MRAM
Datasheet: EMD4E001G16G2-150CAS2 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
380: USD 139.4875 ea
Line Total: USD 53005.25 
Availability - 0
MOQ: 380  Multiples: 380
Pack Size: 380
Availability Price Quantity
0
Ship by Thu. 05 Sep to Mon. 09 Sep
MOQ : 380
Multiples : 380
380 : USD 122.0324
570 : USD 118.6508

   
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We are delighted to provide the EMD4E001G16G2-150CAS2 from our MRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the EMD4E001G16G2-150CAS2 and other electronic components in the MRAM category and beyond.

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EMD4E001GAS2 FEATURES 1Gb Non-Volatile ST-DDR4 Spin-transfer Torque MRAM 128Mb x8, 64Mb x16 Organization Supports most DDR4 features Page size of 1024 bits for x8, 2048 bits for x16 VDD = VDDQ = 1.2v VPP = 2.5V Operating Temperature of 0C to 85 C 667MHz clock frequency (fCK) On-Device Termination Multipurpose register READ and WRITE capability Per-Device addressability (PDA) Connectivity Test On-Chip DLL aligns DQ, DQS, DQS transition with CK transition Burst lengths of 8 addresses All addresses and control inputs are latched on rising edge of the clock -11 Bit Error Rate (BER) = 1 x 10 Data Retention = 3 months at 70C 10 Cycle Endurance = 1 x 10 Standard FBGA package options (Pb-free): 78-ball (10mm x 13mm) package (x8) 96-ball (10mm x 13mm) package (x16) Timing cycle time: 1.5ns CL = 10 (ST-DDR4 1333) 1.5ns CWL = 9 (ST-DDR4 1333) 2020 Everspin Technologies 1 EMD4E001GAS2 Revision 1.2 08/2020 All Rights Reserved EMD4E001GAS2 TABLE of CONTENTS 1. CONVENTIONS, DEFINITIONS AND COPYRIGHTS .................................................................... 10 1.1 Signal Naming Convention ............................................................................................. 10 1.2 Device Pin Signal Level ................................................................................................... 10 1.3 Bus Signal Level .............................................................................................................. 10 2. FUNCTIONAL DESCRIPTION .................................................................................................... 11 3. ST-DDR4 SPECIFICATION ENHANCEMENTS, DEVIATIONS & UNSUPPORTED OPTIONS ......... 11 4. SIMPLIFIED STATE DIAGRAM .................................................................................................. 17 5. FUNCTIONAL BLOCK DIAGRAM .............................................................................................. 19 5.1 Available Speed Bins ...................................................................................................... 21 5.2 Addressing Scheme ........................................................................................................ 21 6. PACKAGING and SIGNAL DESCRIPTIONS ................................................................................. 22 7. ELECTRICAL SPECIFICATIONS .................................................................................................. 27 7.1 Absolute Maximum Ratings ........................................................................................... 27 7.2 Operating Temperature Range ...................................................................................... 28 7.3 AC/DC OPERATING CONDITIONS ................................................................................... 28 7.4 VREFCA Supply ............................................................................................................... 29 7.5 V Supply and Calibration Ranges ............................................................................ 30 REFDQ 7.6 VREFDQ Ranges .............................................................................................................. 30 7.7 SPEED BIN OPERATING CONDITIONS ............................................................................. 32 8. I , I AND I SPECIFICATION PARAMETERS ....................................................................... 33 DD PP DDQ 8.1 Current Specifications Patterns and Test Conditions .................................................. 33 9. ELECTRICAL CHARACTERISTICS AND AC TIMING PARAMETERS ............................................. 50 10. POWER UP INITIALIZATION SEQUENCE .................................................................................. 59 10.1 Default Values ................................................................................................................ 59 10.2 Power Up Initialization Sequence .................................................................................. 59 10.3 Reset with Stable Power ................................................................................................ 62 10.4 Uncontrolled Power Down Sequence ............................................................................ 63 11. MODE REGISTERS .................................................................................................................... 63 11.1 Programing the Mode Registers .................................................................................... 63 11.2 Mode Register Structure ................................................................................................ 66 11.3 MPR Reads...................................................................................................................... 75 11.4 MPR Readout Format ..................................................................................................... 76 11.5 MPR Readout Serial Format ........................................................................................... 76 2020 Everspin Technologies 2 EMD4E001GAS2 Revision 1.2 08/2020 All Rights Reserved

Tariff Desc

8542.32.00 33 No ..Memory cards (other than "smart" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)

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