Future Technology Devices International Ltd. V2DIP2-64 VNCL2-64Q Development Module Datasheet Document Reference No.: FT 000166 Version 1.0 Issue Date: 2010-04-19 Future Technology Devices International Ltd (FTDI) Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom Tel.: +44 (0) 141 429 2777 Fax: + 44 (0) 141 429 2758 E-Mail (Support): support1 ftdichip.com Web: Document Reference No.: FT 000166 V2DIP2-64 VNCL2-64Q Development Module Datasheet Version 1.0 Clearance No.: FTDI 155 1 Introduction V2DIP2-64 module is designed to allow rapid development of designs using the VNC2-64Q IC. The V2DIP2-64 is supplied as a PCB designed to fit into a 60 pin 0.8 wide, 0.1 pitch DIP socket.The module provides access to the UART, parallel FIFO, and SPI interface pins of the VNC2-64Q device, via its IO bus pins. Two USB ports are accessed via type A USB connectors. Figure 1.1 - V2DIP2-64 The VNC2 is one of the family of Vinculum devices from FTDI : the second of FTDIs Vinculum family of Embedded dual USB host controller integrated circuit devices. The device is capable of handling the USB Host Interface for a variety of different USB device classes, e.g. BOMS (bulk only mass storage), Printer, HID (human interface device) etc. When interfacing to mass storage devices such as USB Flash drives, VNC2 also transparently handles the FAT File structure. Communication with non USB devices such as a low cost microcontroller is accomplished via either UART, SPI or parallel FIFO interfaces using a simple to implement command set. VNC2 provides a new cost effective solution for providing USB Host capability into products that previously did not have the hardware resources available. The device comes with a Debugger interface with bus master functionality and suite of tools which allows customers to create their own firmware (Compiler Linker Debugger AssemblerIDE). The Vinculum-II VNC2 family of devices are available in Pb-free (RoHS compliant) 32-lead LQFP, 32-lead QFN, 48-lead LQFP, 48-lead QFN, 64-Lead lQFP and 64-lead QFN packages Copyright 2010 Future Technology Devices International Limited 1