X-On Electronics has gained recognition as a prominent supplier of G2R1000MT17D SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. G2R1000MT17D SiC MOSFETs are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

G2R1000MT17D GeneSiC Semiconductor

G2R1000MT17D electronic component of GeneSiC Semiconductor
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Part No.G2R1000MT17D
Manufacturer: GeneSiC Semiconductor
Category: SiC MOSFETs
Description: SiC MOSFETs 1700V 1000mohm TO-247-3 G2R SiC MOSFET
Datasheet: G2R1000MT17D Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 5.324 ea
Line Total: USD 5.32 
Availability - 2465
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2465
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 5.324
10 : USD 4.84
30 : USD 4.675
120 : USD 4.444
270 : USD 4.246
510 : USD 4.147
1020 : USD 4.147
2520 : USD 4.081
5010 : USD 3.949

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Package / Case
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the G2R1000MT17D from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the G2R1000MT17D and other electronic components in the SiC MOSFETs category and beyond.

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TM G2R1000MT17D 1700 V 1000 m SiC MOSFET Silicon Carbide MOSFET VDS = 1700 V N-Channel Enhancement Mode DS(ON)(Typ.) R = 1000 m ID (TC = 100C) = 3 A Features Package D G2R Technology Softer RDS(ON) v/s Temperature Dependency LoRing - Electromagnetically Optimized Design G RoHS Smaller RG(INT) and Lower QG Low Device Capacitances (C , C ) OSS RSS S Superior Cost-Performance Index D = Drain Robust Body Diode with Low VF and Low QRR G = Gate TO-247-3 Industry-Leading UIL & Short-Circuit Robustness S = Source REACH Advantages Applications Compatible with Commercial Gate Drivers Auxiliary Power Supply Low Conduction Losses at all Temperatures Solar Inverters (String and Central) Reduced Ringing Infrastructure Chargers Faster and More Efficient Switching Industrial Motors (AC Servos) Lesser Switching Spikes and Lower Losses General Purpose Inverters Better Power Density and System Efficiency Pulsed Power Ease of Paralleling without Thermal Runaway Piezo Drivers Higher System Reliability Ion Beam Generators Absolute Maximum Ratings (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Drain-Source Voltage V V = 0 V, I = 100 A 1700 V DS(max) GS D Gate-Source Voltage (Dynamic) VGS(max) -10 / +25 V Gate-Source Voltage (Static) V Recommended Operation -5 / +20 V GS(op) T = 25C, V = -5 / +20 V 5 C GS Continuous Forward Current ID TC = 100C, VGS = -5 / +20 V 3 A Fig. 15 TC = 135C, VGS = -5 / +20 V 3 Pulsed Drain Current I t 3s, D 1%, V = 20 V, Note 1 8 A Fig. 14 D(pulse) P GS Power Dissipation P T = 25C 44 W Fig. 16 D c Non-Repetitive Avalanche Energy EAS L = 90 mH, IAS = 1.0 A 45 mJ Operating and Storage Temperature T , T -55 to 175 C j stg Thermal/Package Characteristics Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 2.97 3.41 C/W Fig. 13 thJC Weight WT 6.1 g Mounting Torque T Screws to Heatsink 1.1 Nm M Note 1: Pulse Width t Limited by T P j(max) Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G2R1000MT17D/G2R1000MT17D.pdf Page 1 of 14TM G2R1000MT17D 1700 V 1000 m SiC MOSFET Electrical Characteristics (At T = 25C Unless Otherwise Stated) C Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Drain-Source Breakdown Voltage V V = 0 V, I = 100 A 1700 V DSS GS D Zero Gate Voltage Drain Current I V = 1700 V, V = 0 V 1 A DSS DS GS V = 0 V, V = 25 V 100 DS GS Gate Source Leakage Current IGSS nA V = 0 V, V = -10 V -100 DS GS VDS = VGS, ID = 2.0 mA 2.0 3.00 Gate Threshold Voltage V V Fig. 9 GS(th) VDS = VGS, ID = 2.0 mA, Tj = 175C 2.00 V = 10 V, I = 2 A 0.76 DS D Transconductance g S Fig. 4 fs V = 10 V, I = 2 A, T = 175C 0.84 DS D j V = 20 V, I = 2 A 1000 1250 GS D Drain-Source On-State Resistance R m Fig. 5-8 DS(ON) V = 20 V, I = 2 A, T = 175C 1479 GS D j Input Capacitance Ciss 111 Output Capacitance C 19 pF Fig. 11 oss Reverse Transfer Capacitance C 5.0 rss Coss Stored Energy Eoss 10 J Fig. 12 V = 1000 V, V = 0 V DS GS C Stored Charge Q 23 nC oss oss f = 1 MHz, VAC = 25mV Effective Output Capacitance (Energy Co(er) 20 Related) pF Note 2 Effective Output Capacitance (Time Co(tr) 23 Related) Gate-Source Charge Q 2 gs V = 1000 V, V = -5 / +20 V DS GS Gate-Drain Charge Q I = 2 A 7 nC Fig. 10 gd D Per IEC607478-4 Total Gate Charge Q 11 g Internal Gate Resistance R f = 1 MHz, V = 25 mV 5.0 G(int) AC Turn-On Switching Energy EOn 50 (Body Diode) T = 25C, V = -5/+20V, R = 8 , L = j GS G(ext) J Fig. 22,26 1000.0 H, I = 2 A, V = 1200 V Turn-Off Switching Energy D DD EOff 16 (Body Diode) Turn-On Delay Time t 7 d(on) V = 1200 V, V = -5/+20V DD GS Rise Time tr 13 RG(ext) = 8 , L = 1000.0 H, ID = 2 A ns Fig. 24 Turn-Off Delay Time t 9 d(off) Timing relative to V , Inductive load DS Fall Time t 8 f *The chip technology was characterized up to 200 V/ns. The measured dV/dt was limited by measurement test setup and package. Note 2: C , a lumped capacitance that gives same stored energy as C while V is rising from 0 to 1000V. o(er) OSS DS C , a lumped capacitance that gives same charging times as C while V is rising from 0 to 1000V. o(tr) OSS DS Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G2R1000MT17D/G2R1000MT17D.pdf Page 2 of 14

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
GENESIC SEMICONDUCTOR INC.
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