X-On Electronics has gained recognition as a prominent supplier of G3R160MT17D SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. G3R160MT17D SiC MOSFETs are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

G3R160MT17D GeneSiC Semiconductor

G3R160MT17D electronic component of GeneSiC Semiconductor
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Part No.G3R160MT17D
Manufacturer: GeneSiC Semiconductor
Category: SiC MOSFETs
Description: SiC MOSFETs 1700V 160mohm TO-247-3 G3R SiC MOSFET
Datasheet: G3R160MT17D Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 11.253 ea
Line Total: USD 11.25 
Availability - 1668
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1668
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 11.253
10 : USD 10.23
30 : USD 10.142
120 : USD 10.142
270 : USD 9.9

570
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 13.426
2 : USD 11.648
5 : USD 11.018
120 : USD 10.626

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Package / Case
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the G3R160MT17D from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the G3R160MT17D and other electronic components in the SiC MOSFETs category and beyond.

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TM G3R160MT17D 1700 V 160 m SiC MOSFET Silicon Carbide MOSFET VDS = 1700 V N-Channel Enhancement Mode DS(ON)(Typ.) R = 160 m ID (TC = 100C) = 12 A Features Package D G3R Technology with +15 V Gate Drive Softer RDS(ON) v/s Temperature Dependency LoRing - Electromagnetically Optimized Design G RoHS Smaller RG(INT) and Lower QG Low Device Capacitances (C , C ) OSS RSS S Superior Cost-Performance Index D = Drain Robust Body Diode with Low VF and Low QRR G = Gate TO-247-3 Industry-Leading UIL & Short-Circuit Robustness S = Source REACH Advantages Applications Compatible with Commercial Gate Drivers Solar Inverter Low Conduction Losses at all Temperatures EV Fast Charging Reduced Ringing Switched Mode Power Supply (SMPS) Faster and More Efficient Switching Auxiliary Power Supply Lesser Switching Spikes and Lower Losses High Voltage Converter Better Power Density and System Efficiency Pulsed Power Ease of Paralleling without Thermal Runaway Higher System Reliability Absolute Maximum Ratings (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Drain-Source Voltage V V = 0 V, I = 100 A 1700 V DS(max) GS D Gate-Source Voltage (Dynamic) VGS(max) -10 / +20 V Gate-Source Voltage (Static) V Recommended Operation -5 / +15 V GS(op) T = 25C, V = -5 / +15 V 17 C GS Continuous Forward Current ID TC = 100C, VGS = -5 / +15 V 12 A Fig. 15 TC = 135C, VGS = -5 / +15 V 9 Pulsed Drain Current I t 3s, D 1%, V = 15 V, Note 1 32 A Fig. 14 D(pulse) P GS Power Dissipation P T = 25C 138 W Fig. 16 D c Non-Repetitive Avalanche Energy EAS L = 12.6 mH, IAS = 5.0 A 158 mJ Operating and Storage Temperature T , T -55 to 175 C j stg Thermal/Package Characteristics Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 0.85 1.09 C/W Fig. 13 thJC Weight WT 6.1 g Mounting Torque T Screws to Heatsink 1.1 Nm M Note 1: Pulse Width t Limited by T P j(max) Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R160MT17D/G3R160MT17D.pdf Page 1 of 14TM G3R160MT17D 1700 V 160 m SiC MOSFET Electrical Characteristics (At T = 25C Unless Otherwise Stated) C Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Drain-Source Breakdown Voltage V V = 0 V, I = 100 A 1700 V DSS GS D Zero Gate Voltage Drain Current I V = 1700 V, V = 0 V 1 A DSS DS GS V = 0 V, V = 20 V 100 DS GS Gate Source Leakage Current IGSS nA V = 0 V, V = -10 V -100 DS GS VDS = VGS, ID = 10.0 mA 1.8 2.70 Gate Threshold Voltage V V Fig. 9 GS(th) VDS = VGS, ID = 10.0 mA, Tj = 175C 1.90 V = 10 V, I = 10 A 4.6 DS D Transconductance g S Fig. 4 fs V = 10 V, I = 10 A, T = 175C 4.8 DS D j V = 15 V, I = 10 A 160 224 GS D Drain-Source On-State Resistance R m Fig. 5-8 DS(ON) V = 15 V, I = 10 A, T = 175C 321 GS D j Input Capacitance Ciss 854 Output Capacitance C 23 pF Fig. 11 oss Reverse Transfer Capacitance C 4.1 rss Coss Stored Energy Eoss 15 J Fig. 12 V = 1000 V, V = 0 V DS GS C Stored Charge Q 46 nC oss oss f = 1 MHz, VAC = 25mV Effective Output Capacitance (Energy Co(er) 30 Related) pF Note 2 Effective Output Capacitance (Time Co(tr) 46 Related) Gate-Source Charge Q 9 gs V = 1000 V, V = -5 / +15 V DS GS Gate-Drain Charge Q I = 10 A 9 nC Fig. 10 gd D Per IEC607478-4 Total Gate Charge Q 29 g Internal Gate Resistance R f = 1 MHz, V = 25 mV 1.6 G(int) AC Turn-On Switching Energy EOn 128 (Body Diode) T = 25C, V = -5/+15V, R = 8 , L = j GS G(ext) J Fig. 22,26 220.0 H, I = 10 A, V = 1200 V Turn-Off Switching Energy D DD EOff 45 (Body Diode) Turn-On Delay Time t 22 d(on) V = 1200 V, V = -5/+15V DD GS Rise Time tr 12 RG(ext) = 8 , L = 220.0 H, ID = 10 A ns Fig. 24 Turn-Off Delay Time t 17 d(off) Timing relative to V , Inductive load DS Fall Time t 10 f *The chip technology was characterized up to 200 V/ns. The measured dV/dt was limited by measurement test setup and package. Note 2: C , a lumped capacitance that gives same stored energy as C while V is rising from 0 to 1000V. o(er) OSS DS C , a lumped capacitance that gives same charging times as C while V is rising from 0 to 1000V. o(tr) OSS DS Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R160MT17D/G3R160MT17D.pdf Page 2 of 14

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
GENESIC SEMICONDUCTOR INC.
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