X-On Electronics has gained recognition as a prominent supplier of G3R75MT12K SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. G3R75MT12K SiC MOSFETs are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

G3R75MT12K GeneSiC Semiconductor

G3R75MT12K electronic component of GeneSiC Semiconductor
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Part No.G3R75MT12K
Manufacturer: GeneSiC Semiconductor
Category: SiC MOSFETs
Description: SiC MOSFETs 1200V 75mohm TO-247-4 G3R SiC MOSFET
Datasheet: G3R75MT12K Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 10.725 ea
Line Total: USD 10.72 
Availability - 1641
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1641
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 10.725
10 : USD 9.768
30 : USD 9.526
120 : USD 8.943
270 : USD 8.822
510 : USD 8.822
1020 : USD 8.668
2520 : USD 8.316

513
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 18.354
2 : USD 12.782
4 : USD 12.082

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Package / Case
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the G3R75MT12K from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the G3R75MT12K and other electronic components in the SiC MOSFETs category and beyond.

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TM G3R75MT12K 1200 V 75 m SiC MOSFET Silicon Carbide MOSFET VDS = 1200 V N-Channel Enhancement Mode DS(ON)(Typ.) R = 75 m ID (TC = 100C) = 22 A Features Package D G3R Technology with +15 V Gate Drive Softer RDS(ON) v/s Temperature Dependency LoRing - Electromagnetically Optimized Design G RoHS Smaller RG(INT) and Lower QG KS Low Device Capacitances (C , C ) OSS RSS S Superior Cost-Performance Index D = Drain Robust Body Diode with Low VF and Low QRR G = Gate TO-247-4 100% Avalanche (UIL) Tested S = Source REACH KS = Kelvin Source Advantages Applications Compatible with Commercial Gate Drivers Solar Inverters Low Conduction Losses at all Temperatures EV/HEV Charging Reduced Ringing UPS Faster and More Efficient Switching High Voltage DC-DC Converters Lesser Switching Spikes and Lower Losses Switched Mode Power Supplies Better Power Density and System Efficiency Motor Drives Ease of Paralleling without Thermal Runaway Smart Grid Transmission and Distribution Superior Robustness and System Reliability Induction Heating and Welding Absolute Maximum Ratings (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Drain-Source Voltage V V = 0 V, I = 100 A 1200 V DS(max) GS D Gate-Source Voltage (Dynamic) VGS(max) -10 / +20 V Gate-Source Voltage (Static) V Recommended Operation -5 / +15 V GS(op) T = 25C, V = -5 / +15 V 31 C GS Continuous Forward Current ID TC = 100C, VGS = -5 / +15 V 22 A Fig. 15 TC = 135C, VGS = -5 / +15 V 16 Pulsed Drain Current I t 3s, D 1%, V = 15 V, Note 1 70 A Fig. 14 D(pulse) P GS Power Dissipation P T = 25C 137 W Fig. 16 D c Non-Repetitive Avalanche Energy EAS L = 4.0 mH, IAS = 10.0 A 199 mJ Operating and Storage Temperature T , T -55 to 175 C j stg Thermal/Package Characteristics Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 0.89 1.1 C/W Fig. 13 thJC Weight WT 6.2 g Mounting Torque T Screws to Heatsink 1.1 Nm M Note 1: Pulse Width t Limited by T P j(max) Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R75MT12K/G3R75MT12K.pdf Page 1 of 14TM G3R75MT12K 1200 V 75 m SiC MOSFET Electrical Characteristics (At T = 25C Unless Otherwise Stated) C Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Drain-Source Breakdown Voltage V V = 0 V, I = 100 A 1200 V DSS GS D Zero Gate Voltage Drain Current I V = 1200 V, V = 0 V 1 A DSS DS GS V = 0 V, V = 20 V 100 DS GS Gate Source Leakage Current IGSS nA V = 0 V, V = -10 V -100 DS GS VDS = VGS, ID = 10.0 mA 1.8 2.70 Gate Threshold Voltage V V Fig. 9 GS(th) VDS = VGS, ID = 10.0 mA, Tj = 175C 2.05 V = 10 V, I = 20 A 9.0 DS D Transconductance g S Fig. 4 fs V = 10 V, I = 20 A, T = 175C 10.1 DS D j V = 15 V, I = 20 A 75 97 GS D Drain-Source On-State Resistance R m Fig. 5-8 DS(ON) V = 15 V, I = 20 A, T = 175C 106 GS D j Input Capacitance Ciss 1545 Output Capacitance C 46 pF Fig. 11 oss Reverse Transfer Capacitance C 3.8 rss Coss Stored Energy Eoss 18 J Fig. 12 V = 800 V, V = 0 V DS GS C Stored Charge Q 68 nC oss oss f = 1 MHz, VAC = 25mV Effective Output Capacitance (Energy Co(er) 56 Related) pF Note 2 Effective Output Capacitance (Time Co(tr) 85 Related) Gate-Source Charge Q 15 gs V = 800 V, V = -5 / +15 V DS GS Gate-Drain Charge Q I = 20 A 16 nC Fig. 10 gd D Per IEC607478-4 Total Gate Charge Q 47 g Internal Gate Resistance R f = 1 MHz, V = 25 mV 1.3 G(int) AC Turn-On Switching Energy EOn 151 (Body Diode) T = 25C, V = -5/+15V, R = 8 , L = j GS G(ext) J Fig. 22,26 80.0 H, I = 20 A, V = 800 V Turn-Off Switching Energy D DD EOff 37 (Body Diode) Turn-On Delay Time t 28 d(on) V = 800 V, V = -5/+15V DD GS Rise Time tr 15 RG(ext) = 8 , L = 80.0 H, ID = 20 A ns Fig. 24 Turn-Off Delay Time t 17 d(off) Timing relative to V , Inductive load DS Fall Time t 10 f *The chip technology was characterized up to 200 V/ns. The measured dV/dt was limited by measurement test setup and package. Note 2: C , a lumped capacitance that gives same stored energy as C while V is rising from 0 to 800V. o(er) OSS DS C , a lumped capacitance that gives same charging times as C while V is rising from 0 to 800V. o(tr) OSS DS Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R75MT12K/G3R75MT12K.pdf Page 2 of 14

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
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