X-On Electronics has gained recognition as a prominent supplier of GD5F1GQ4UEYIHY NAND Flash across the USA, India, Europe, Australia, and various other global locations. GD5F1GQ4UEYIHY NAND Flash are a product manufactured by Gigadevice. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

GD5F1GQ4UEYIHY Gigadevice

Name: GD5F1GQ4UEYIHY
Brand: Gigadevice
SKU: GD5F1GQ4UEYIHY_Gigadevice
Availability: OutOfStock
Rating: 5 (11 reviews)

GD5F1GQ4UEYIHY electronic component of Gigadevice

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Part No.	GD5F1GQ4UEYIHY
Manufacturer:	Gigadevice
Category:	NAND Flash
Description:	NAND Flash
Datasheet:	GD5F1GQ4UEYIHY Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

GD5F1GQ4UEYIHY More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 4800 Multiples : 4800	4800 : USD 2.0271		N/A Obsolete

We are delighted to provide the GD5F1GQ4UEYIHY from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GD5F1GQ4UEYIHY and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

SPI(x1/x2/x4) NAND Flash 1G GD5F1GQ4xExIS DATASHEET 1 SPI(x1/x2/x4) NAND Flash 1G Contents 1 FEATURE ........................................................................................................................................................... 4 2 GENERAL DESCRIPTION ............................................................................................................................... 5 2.1 PRODUCT LIST ............................................................................................................................................................... 6 2.2 CONNECTION DIAGRAM .................................................................................................................................................. 6 2.3 PIN DESCRIPTION ........................................................................................................................................................... 7 2.4 BLOCK DIAGRAM ........................................................................................................................................................... 8 3 ARRAY ORGANIZATION ................................................................................................................................. 9 3.1 MEMORY MAPPING ..................................................................................................................................................... 10 4 DEVICE OPERATION ..................................................................................................................................... 11 4.1 SPI MODES ................................................................................................................................................................ 11 4.2 HOLD MODE ............................................................................................................................................................. 12 4.3 WRITE PROTECTION ..................................................................................................................................................... 12 5 COMMANDS DESCRIPTION ......................................................................................................................... 13 6 WRITE OPERATIONS .................................................................................................................................... 14 6.1 WRITE ENABLE (WREN) (06H) ..................................................................................................................................... 14 6.2 WRITE DISABLE (WRDI) (04H) ..................................................................................................................................... 14 7 FEATURE OPERATIONS ............................................................................................................................... 15 7.1 GET FEATURES (0FH) AND SET FEATURES (1FH) ............................................................................................................... 15 8 READ OPERATIONS ...................................................................................................................................... 17 8.1 PAGE READ ................................................................................................................................................................. 17 8.2 PAGE READ TO CACHE (13H) ......................................................................................................................................... 17 8.3 READ FROM CACHE (03H OR 0BH) ................................................................................................................................ 18 8.4 READ FROM CACHE X2 (3BH) ........................................................................................................................................ 18 8.5 READ FROM CACHE X4 (6BH) ........................................................................................................................................ 19 8.6 READ FROM CACHE DUAL IO (BBH) ............................................................................................................................... 19 8.7 READ FROM CACHE QUAD IO (EBH) ............................................................................................................................... 20 9 READ ID ........................................................................................................................................................... 21 9.1 READ ID (9FH) ........................................................................................................................................................... 21 9.2 READ UID .................................................................................................................................................................. 22 9.3 READ CID................................................................................................................................................................... 25 9.4 READ PARAMETER PAGE ............................................................................................................................................... 26 10 PROGRAM OPERATIONS ......................................................................................................................... 31 10.1 PAGE PROGRAM ........................................................................................................................................................ 31 10.2 PROGRAM LOAD (PL) (02H) ....................................................................................................................................... 32 2

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Gigadevice may also be referenced as

GigaDevice Semicon Beijing

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Manufacturer Gigadevice Gigadevice
Product Category NAND Flash NAND Flash
Mounting Style SMD/SMT SMD/SMT
Package / Case WSON - 8 WSON - 8
Series GD5F1GQ4UE GD5F1GQ4UE
Memory Size 1 Gbit 1 Gbit
Interface Type SPI SPI
Organisation 128 M x 8 128 M x 8
Data Bus Width 8 bit 8 bit
Supply Voltage - Min 2.7 V 2.7 V
Supply Voltage - Max 3.6 V 3.6 V
Supply Current - Max 40 mA 40 mA
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Packaging Tray Tray
Hts Code 8542390001 8542390001