X-On Electronics has gained recognition as a prominent supplier of S34MS04G100TFI000 NAND Flash across the USA, India, Europe, Australia, and various other global locations. S34MS04G100TFI000 NAND Flash are a product manufactured by SkyHigh Memory. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

S34MS04G100TFI000 SkyHigh Memory

S34MS04G100TFI000 electronic component of SkyHigh Memory
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Part No.S34MS04G100TFI000
Manufacturer: SkyHigh Memory
Category: NAND Flash
Description: Flash 4Gb, 1.8V, 45ns NAND Flash
Datasheet: S34MS04G100TFI000 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 8.558 ea
Line Total: USD 8.56 
Availability - 3
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 8.558
10 : USD 7.876
25 : USD 7.535
96 : USD 6.787
288 : USD 6.6
576 : USD 6.303
1056 : USD 6.094
2592 : USD 5.907
5088 : USD 5.654

   
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We are delighted to provide the S34MS04G100TFI000 from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the S34MS04G100TFI000 and other electronic components in the NAND Flash category and beyond.

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S34MS01G1 S34MS02G1 S34MS04G1 1-bit ECC, x8 and x16 I/O, 1.8V V CC SLC NAND Flash for Embedded Distinctive Characteristics Density NAND flash interface 1 Gb / 2 Gb / 4 Gb Open NAND Flash Interface (ONFI) 1.0 compliant Address, Data, and Commands multiplexed Architecture Input / Output Bus Width: 8 bits / 16 bits Supply voltage Page size: 1.8-V device: Vcc = 1.7 V ~ 1.95 V 8 = 2112 (2048 + 64) bytes 64 bytes is spare area Security 16 = 1056 (1024 + 32) words 32 words is spare area One Time Programmable (OTP) area Block size: 64 pages Hardware program/erase disabled during power transition 8 = 128 KB + 4 KB Additional features 16 = 64k + 2k words 2 Gb and 4 Gb parts support Multiplane Program and Erase Plane size: commands 1 Gb / 2 Gb: 1024 Blocks per Plane Supports Copy Back Program 8 = 128 MB + 4 MB 2 Gb and 4 Gb parts support Multiplane Copy Back Program 16 = 64M + 2M words Supports Read Cache 4 Gb: 2048 blocks per plane Electronic signature 8 = 256 MB + 8 MB Manufacturer ID: 01h 16 = 128M + 4M words Device size: Operating temperature 1 Gb: 1 Plane per Device or 128 MB Industrial: 40 C to 85 C 2 Gb: 2 Planes per Device or 256 MB Industrial Plus: 40 C to 105 C 4 Gb: 2 Planes per Device or 512 MB Performance Page Read / Program Reliability Random access: 25 s (Max) 100,000 Program / Erase cycles (Typ) (with 1-bit ECC per 528 bytes (8) or 264 words (16)) Sequential access: 45 ns (Min) 10-year Data retention (Typ) Program time / Multiplane Program time: 250 s (Typ) For one plane structure (1-Gb density) Block Erase (S34MS01G1) Block zero is valid and will be valid for at least 1,000 program- Block Erase time: 2.0 ms (Typ) erase cycles with ECC Block Erase / Multiplane Erase (S34MS02G1, S34MS04G1) For two plane structures (2-Gb and 4-Gb densities) Block Erase time: 3.5 ms (Typ) Blocks zero and one are valid and will be valid for at least 1,000 program-erase cycles with ECC Package options Pb-free and Low Halogen 48-Pin TSOP 12 x 20 x 1.2 mm 63-Ball BGA 9 x 11 x 1 mm Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 002-00330 Rev. *K Revised April 20, 2017S34MS01G1 S34MS02G1 S34MS04G1 Contents Distinctive Characteristics .................................................. 1 5.7 Program / Erase Characteristics................................... 36 Performance.......................................................................... 1 6. Timing Diagrams......................................................... 37 6.1 Command Latch Cycle.................................................. 37 1. General Description..................................................... 3 6.2 Address Latch Cycle..................................................... 38 1.1 Logic Diagram................................................................ 4 6.3 Data Input Cycle Timing................................................ 38 1.2 Connection Diagram ...................................................... 5 6.4 Data Output Cycle Timing (CLE=L, WE =H, ALE=L, 1.3 Pin Description............................................................... 6 WP =H) ........................................................................ 39 1.4 Block Diagram................................................................ 7 6.5 Data Output Cycle Timing (EDO Type, CLE=L, WE =H, 1.5 Array Organization......................................................... 8 ALE=L).......................................................................... 39 1.6 Addressing..................................................................... 9 6.6 Page Read Operation ................................................... 40 1.7 Mode Selection ............................................................ 12 6.7 Page Read Operation (Interrupted by CE ).................. 41 2. Bus Operation ............................................................ 13 6.8 Page Read Operation Timing with CE Dont Care...... 42 2.1 Command Input ........................................................... 13 6.9 Page Program Operation.............................................. 42 2.2 Address Input............................................................... 13 6.10 Page Program Operation Timing with CE Dont Care. 43 2.3 Data Input .................................................................... 13 6.11 Page Program Operation with Random Data Input ...... 43 2.4 Data Output.................................................................. 13 6.12 Random Data Output In a Page ................................... 44 2.5 Write Protect ................................................................ 13 6.13 Multiplane Page Program Operation S34MS02G1 and 2.6 Standby........................................................................ 13 S34MS04G1 ................................................................. 44 6.14 Block Erase Operation.................................................. 45 3. Command Set............................................................. 14 6.15 Multiplane Block Erase S34MS02G1 and S34MS04G1 3.1 Page Read................................................................... 15 46 3.2 Page Program.............................................................. 15 6.16 Copy Back Read with Optional Data Readout.............. 47 3.3 Multiplane Program S34MS02G1 and S34MS04G1 16 6.17 Copy Back Program Operation With Random Data Input.. 3.4 Page Reprogram S34MS02G1 and S34MS04G1... 16 47 3.5 Block Erase.................................................................. 17 6.18 Multiplane Copy Back Program S34MS02G1 and 3.6 Multiplane Block Erase S34MS02G1 and S34MS04G1 S34MS04G1 ................................................................. 48 18 6.19 Read Status Register Timing........................................ 49 3.7 Copy Back Program..................................................... 18 6.20 Read Status Enhanced Timing ..................................... 50 3.8 EDC Operation S34MS02G1 and S34MS04G1...... 19 6.21 Reset Operation Timing................................................ 50 3.9 Read Status Register................................................... 21 6.22 Read Cache.................................................................. 51 3.10 Read Status Enhanced S34MS02G1 and S34MS04G1 6.23 Cache Program............................................................. 53 21 6.24 Multiplane Cache Program S34MS02G1 and 3.11 Read Status Register Field Definition.......................... 22 S34MS04G1 ................................................................. 54 3.12 Reset............................................................................ 22 6.25 Read ID Operation Timing ............................................ 56 3.13 Read Cache................................................................. 22 6.26 Read ID2 Operation Timing .......................................... 56 3.14 Cache Program............................................................ 23 6.27 Read ONFI Signature Timing........................................ 57 3.15 Multiplane Cache Program S34MS02G1 and 6.28 Read Parameter Page Timing ...................................... 57 S34MS04G1 ................................................................ 24 6.29 OTP Entry Timing ......................................................... 58 3.16 Read ID........................................................................ 25 6.30 Power On and Data Protection Timing ......................... 58 3.17 Read ID2...................................................................... 27 6.31 WP Handling............................................................... 59 3.18 Read ONFI Signature .................................................. 27 7. Physical Interface ....................................................... 60 3.19 Read Parameter Page ................................................. 28 3.20 One-Time Programmable (OTP) Entry ........................ 30 7.1 Physical Diagram.......................................................... 60 4. Signal Descriptions ................................................... 30 8. System Interface ......................................................... 62 4.1 Data Protection and Power On / Off Sequence ........... 30 9. Error Management ...................................................... 64 4.2 Ready/Busy.................................................................. 31 9.1 System Bad Block Replacement................................... 64 4.3 Write Protect Operation ............................................... 32 9.2 Bad Block Management................................................ 65 5. Electrical Characteristics.......................................... 33 10. Ordering Information.................................................. 66 5.1 Valid Blocks ................................................................. 33 11. Document History....................................................... 67 5.2 Absolute Maximum Ratings ......................................... 33 5.3 AC Test Conditions...................................................... 33 5.4 AC Characteristics ....................................................... 34 5.5 DC Characteristics....................................................... 35 5.6 Pin Capacitance........................................................... 35 Document Number: 002-00330 Rev. *K Page 2 of 71

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
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