X-On Electronics has gained recognition as a prominent supplier of GS72116AGU-12 SRAM across the USA, India, Europe, Australia, and various other global locations. GS72116AGU-12 SRAM are a product manufactured by GSI Technology. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

GS72116AGU-12 GSI Technology

GS72116AGU-12 electronic component of GSI Technology
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See Product Specifications
Part No.GS72116AGU-12
Manufacturer: GSI Technology
Category: SRAM
Description: SRAM 3.3V 128K x 16 2M C Temp
Datasheet: GS72116AGU-12 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 9.891
25 : USD 3.8556
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Memory Size
Organization
Access Time
Interface Type
Supply Voltage - Max
Supply Voltage - Min
Maximum Operating Temperature
Minimum Operating Temperature
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Supply Current - Max
Memory Type
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Cnhts
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the GS72116AGU-12 from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS72116AGU-12 and other electronic components in the SRAM category and beyond.

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GS72116AGP/U 7, 8, 10, 12 ns TSOP, FP-BGA 128K x 16 3.3 V V DD Commercial Temp 2Mb Asynchronous SRAM Center V and V Industrial Temp DD SS Features Fine Pitch BGA 128K x 16-Bump Configuration Fast access time: 7, 8, 10, 12 ns 1 2 3 4 5 6 CMOS low power operation: 145/125/100/85 mA at minimum cycle time Single 3.3 V power supply LB OE A0 A1 A2 NC A All inputs and outputs are TTL-compatible Byte control B DQ16 UB A3 A4 CE DQ1 Fully static operation Industrial Temperature Option: 40 to 85C C DQ14 DQ15 A5 A6 DQ2 DQ3 Package line up V V D DQ13 NC A7 DQ4 SS DD GP: RoHS-compliant 400 mil, 44-pin TSOP Type II package V V E DQ12 NC A16 DQ5 DD SS U: 6 mm x 8 mm Fine Pitch Ball Grid Array package GU: RoHS-compliant 6 mm x 8 mm Fine Pitch Ball Grid F DQ11 DQ10 A8 A9 DQ7 DQ6 Array package G DQ9 NC A10 A11 WE DQ8 Description H NC A12 A13 A14 A15 NC The GS72116A is a high speed CMOS Static RAM organized as 131,072 words by 16 bits. Static design eliminates the need for external clocks or timing strobes. The GS operates on a 6 mm x 8 mm, 0.75 mm Bump Pitch single 3.3 V power supply and all inputs and outputs are TTL- Top View compatible. The GS72116A is available in a 6 mm x 8 mm Package U Fine Pitch BGA and 400 mil TSOP Type-II packages. TSOP-II 128K x 16-Pin Configuration 44 A4 1 A5 Pin Descriptions 43 A3 2 A6 42 3 A2 A7 Symbol Description 41 4 A1 OE Top view 40 5 A0 UB A0A16 Address input 39 CE 6 LB DQ1DQ16 Data input/output 38 DQ1 7 DQ16 37 DQ2 8 DQ15 CE Chip enable input 36 9 DQ3 DQ14 Lower byte enable input 35 10 DQ4 LB DQ13 44-pin (DQ1 to DQ8) 34 11 V DD V SS 33 12 Upper byte enable input V V SS DD UB TSOP II 32 13 (DQ9 to DQ16) DQ5 DQ12 31 14 DQ6 DQ11 WE Write enable input 30 15 DQ7 DQ10 OE Output enable input 29 16 DQ8 DQ9 28 17 WE NC V +3.3 V power supply DD 27 18 A15 A8 V Ground 26 A14 19 A9 SS 25 20 A13 A10 NC No connect 21 24 A11 A12 22 23 A16 NC Package TP Rev: 1.11 1/2013 1/13 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS72116AGP/U Block Diagram A0 Row Memory Array Decoder Address Input Buffer Column A16 Decoder CE WE I/O Buffer Control OE UB DQ16 DQ1 Truth Table CE OE WE LB UB DQ1 to DQ8 DQ9 to DQ16 VDD Current H X X X X Not Selected Not Selected ISB1, ISB2 L L Read Read L L H L H Read High Z H L High Z Read L L Write Write IDD L X L L H Write Not Write, High Z H L Not Write, High Z Write L H H X X High Z High Z L X X H H High Z High Z Note: X: H or L Rev: 1.11 1/2013 2/13 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
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