X-On Electronics has gained recognition as a prominent supplier of GS81302DT37GE-300 SRAM across the USA, India, Europe, Australia, and various other global locations. GS81302DT37GE-300 SRAM are a product manufactured by GSI Technology. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

GS81302DT37GE-300 GSI Technology

GS81302DT37GE-300 electronic component of GSI Technology
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Part No.GS81302DT37GE-300
Manufacturer: GSI Technology
Category: SRAM
Description: SRAM Chip Sync Dual 1.8V 144M-Bit 4M x 36 0.45ns 165-Pin FBGA
Datasheet: GS81302DT37GE-300 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
10: USD 179.1648 ea
Line Total: USD 1791.65 
Availability - 0
MOQ: 10  Multiples: 10
Pack Size: 10
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0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 10
Multiples : 10
10 : USD 179.1648

   
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We are delighted to provide the GS81302DT37GE-300 from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS81302DT37GE-300 and other electronic components in the SRAM category and beyond.

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GS81302DT07/10/19/37E-450/400/350/333/300 450 MHz300 MHz 165-Bump BGA TM 144Mb SigmaQuad-II+ 1.8 V V Commercial Temp DD Industrial Temp Burst of 4 SRAM 1.8 V and 1.5 V I/O are just one element in a family of low power, low voltage Features HSTL I/O SRAMs designed to operate at the speeds needed to 2.0 clock Latency implement economical high performance networking systems. Simultaneous Read and Write SigmaQuad Interface JEDEC-standard pinout and package Dual Double Data Rate interface Clocking and Addressing Schemes Byte Write controls sampled at data-in time Burst of 4 Read and Write The GS81302DT07/10/19/37E SigmaQuad-II+ SRAMs are Dual-Range On-Die Termination (ODT) on Data (D), Byte synchronous devices. They employ two input register clock Write (BW), and Clock (K, K) inputs inputs, K and K. K and K are independent single-ended clock 1.8 V +100/100 mV core power supply inputs, not differential inputs to a single differential clock input 1.5 V or 1.8 V HSTL Interface buffer. Pipelined read operation Fully coherent read and write pipelines Each internal read and write operation in a SigmaQuad-II+ B4 ZQ pin for programmable output drive strength RAM is four times wider than the device I/O bus. An input Data Valid Pin (QVLD) Support data bus de-multiplexer is used to accumulate incoming data IEEE 1149.1 JTAG-compliant Boundary Scan before it is simultaneously written to the memory array. An 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package output data multiplexer is used to capture the data produced RoHS-compliant 165-bump BGA package available from a single memory array read and then route it to the appropriate output drivers as needed. Therefore the address field of a SigmaQuad-II+ B4 RAM is always two address pins SigmaQuad Family Overview less than the advertised index depth (e.g., the 16M x 8 has a The GS81302DT07/10/19/37E are built in compliance with 4M addressable index). the SigmaQuad-II+ SRAM pinout standard for Separate I/O synchronous SRAMs. They are 150,994,944-bit (144Mb) SRAMs. The GS81302DT07/10/19/37E SigmaQuad SRAMs Parameter Synopsis -450 -400 -350 -333 -300 tKHKH 2.2 ns 2.5 ns 2.86 ns 3.0 ns 3.3 ns tKHQV 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns Rev: 1.00b 8/2017 1/30 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS81302DT07/10/19/37E-450/400/350/333/300 16M x 8 SigmaQuad-II SRAMTop View 1 2 3 4 5 6 7 8 9 10 11 A CQ SA SA W NW1 K SA R SA SA CQ NC/SA B NC NC NC SA K NW0 SA NC NC Q3 (288Mb) C NC NC NC V SA NC SA V NC NC D3 SS SS D NC D4 NC V V V V V NC NC NC SS SS SS SS SS E NC NC Q4 V V V V V NC D2 Q2 DDQ SS SS SS DDQ F NC NC NC V V V V V NC NC NC DDQ DD SS DD DDQ G NC D5 Q5 V V V V V NC NC NC DDQ DD SS DD DDQ H Doff V V V V V V V V V ZQ REF DDQ DDQ DD SS DD DDQ DDQ REF J NC NC NC V V V V V NC Q1 D1 DDQ DD SS DD DDQ K NC NC NC V V V V V NC NC NC DDQ DD SS DD DDQ L NC Q6 D6 V V V V V NC NC Q0 DDQ SS SS SS DDQ M NC NC NC V V V V V NC NC D0 SS SS SS SS SS N NC D7 NC V SA SA SA V NC NC NC SS SS P NC NC Q7 SA SA QVLD SA SA NC NC NC R TDO TCK SA SA SA ODT SA SA SA TMS TDI 11 x 15 Bump BGA15 x 17 mm Body1 mm Bump Pitch Notes: 1. NW0 controls writes to D0:D3. NW1 controls writes to D4:D7. 2. B5 is the expansion address. Rev: 1.00b 8/2017 2/30 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

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