GS81302Q36GE-300I GSI Technology

GS81302Q08/09/18/36E-300/250 300 MHz250 MHz TM 165-Bump BGA 144Mb SigmaQuad -II 1.8 V V DD Commercial Temp Burst of 2 SRAM 1.8 V and 1.5 V I/O Industrial Temp Features Clocking and Addressing Schemes Simultaneous Read and Write SigmaQuad Interface The GS81302Q08/09/18/36E SigmaQuad-II SRAMs are JEDEC-standard pinout and package synchronous devices. They employ two input register clock Dual Double Data Rate interface inputs, K and K. K and K are independent single-ended clock Byte Write controls sampled at data-in time inputs, not differential inputs to a single differential clock input Burst of 2 Read and Write buffer. The device also allows the user to manipulate the 1.8 V +100/100 mV core power supply output register clock inputs quasi independently with the C and 1.5 V or 1.8 V HSTL Interface C clock inputs. C and C are also independent single-ended Pipelined read operation clock inputs, not differential inputs. If the C clocks are tied Fully coherent read and write pipelines high, the K clocks are routed internally to fire the output ZQ pin for programmable output drive strength registers instead. IEEE 1149.1 JTAG-compliant Boundary Scan Pin-compatible with present 144 Mb devices Each internal read and write operation in a SigmaQuad-II B2 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package RAM is two times wider than the device I/O bus. An input data RoHS-compliant 165-bump BGA package available bus de-multiplexer is used to accumulate incoming data before it is simultaneously written to the memory array. An output data multiplexer is used to capture the data produced from a SigmaQuad Family Overview single memory array read and then route it to the appropriate The GS81302Q08/09/18/36E are built in compliance with the output drivers as needed. Therefore the address field of a SigmaQuad-II SRAM pinout standard for Separate I/O SigmaQuad-II B2 RAM is always one address pin less than the synchronous SRAMs. They are 150,994,944-bit (144Mb) advertised index depth (e.g., the 16M x 8 has an 8M SRAMs. The GS81302Q08/09/18/36E SigmaQuad SRAMs addressable index). are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems. Parameter Synopsis -300 -250 tKHKH 3.3 ns 4.0 ns tKHQV 0.45 ns 0.45 ns Rev: 1.04d 8/2017 1/33 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS81302Q08/09/18/36E-300/250 4M x 36 SigmaQuad-II SRAMTop View 1 2 3 4 5 6 7 8 9 10 11 NA/SA A CQ SA W BW2 K BW1 R SA SA CQ (288Mb) B Q27 Q18 D18 SA BW3 K BW0 SA D17 Q17 Q8 C D27 Q28 D19 V SA SA SA V D16 Q7 D8 SS SS D D28 D20 Q19 V V V V V Q16 D15 D7 SS SS SS SS SS E Q29 D29 Q20 V V V V V Q15 D6 Q6 DDQ SS SS SS DDQ F Q30 Q21 D21 V V V V V D14 Q14 Q5 DDQ DD SS DD DDQ G D30 D22 Q22 V V V V V Q13 D13 D5 DDQ DD SS DD DDQ H Doff V V V V V V V V V ZQ REF DDQ DDQ DD SS DD DDQ DDQ REF J D31 Q31 D23 V V V V V D12 Q4 D4 DDQ DD SS DD DDQ K Q32 D32 Q23 V V V V V Q12 D3 Q3 DDQ DD SS DD DDQ L Q33 Q24 D24 V V V V V D11 Q11 Q2 DDQ SS SS SS DDQ M D33 Q34 D25 V V V V V D10 Q1 D2 SS SS SS SS SS N D34 D26 Q25 V SA SA SA V Q10 D9 D1 SS SS P Q35 D35 Q26 SA SA C SA SA Q9 D0 Q0 R TDO TCK SA SA SA C SA SA SA TMS TDI 2 11 x 15 Bump BGA15 x 17 mm Body1 mm Bump Pitch Notes: 1. BW0 controls writes to D0:D8; BW1 controls writes to D9:D17; BW2 controls writes to D18:D26; BW3 controls writes to D27:D35. 2. A2 is the expansion address. Rev: 1.04d 8/2017 2/33 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see