X-On Electronics has gained recognition as a prominent supplier of GS8161Z36DGD-200IV SRAM across the USA, India, Europe, Australia, and various other global locations. GS8161Z36DGD-200IV SRAM are a product manufactured by GSI Technology. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

GS8161Z36DGD-200IV GSI Technology

GS8161Z36DGD-200IV electronic component of GSI Technology
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Part No.GS8161Z36DGD-200IV
Manufacturer: GSI Technology
Category: SRAM
Description: SRAM 1.8/2.5V 512K x 36 18M
Datasheet: GS8161Z36DGD-200IV Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 40.359 ea
Line Total: USD 40.36 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 40.359
10 : USD 37.84
18 : USD 36.476
54 : USD 35.574
108 : USD 32.78
252 : USD 32.78
504 : USD 32.406
1008 : USD 31.515

   
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We are delighted to provide the GS8161Z36DGD-200IV from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS8161Z36DGD-200IV and other electronic components in the SRAM category and beyond.

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GS8161ZxxD(GT/D)-xxxV 333 MHz150 MHz 100-Pin TQFP & 165-Bump BGA 18Mb Pipelined and Flow Through 1.8 V or 2.5 V V DD Commercial Temp 1.8 V or 2.5 V I/O Industrial Temp Synchronous NBT SRAM Because it is a synchronous device, address, data inputs, and Features read/ write control inputs are captured on the rising edge of the User-configurable Pipeline and Flow Through mode input clock. Burst order control (LBO) must be tied to a power NBT (No Bus Turn Around) functionality allows zero wait rail for proper operation. Asynchronous inputs include the read-write-read bus utilization Sleep mode enable, ZZ and Output Enable. Output Enable can Fully pin-compatible with both pipelined and flow through be used to override the synchronous control of the output NtRAM, NoBL and ZBT SRAMs drivers and turn the RAM s output drivers off at any time. IEEE 1149.1 JTAG-compatible Boundary Scan Write cycles are internally self-timed and initiated by the rising 1.8 V or 2.5 V core power supply edge of the clock input. This feature eliminates complex off- 1.8 V or 2.5 V I/O supply chip write pulse generation required by asynchronous SRAMs LBO pin for Linear or Interleave Burst mode and simplifies input signal timing. Pin-compatible with 2Mb, 4Mb, 8Mb, 36Mb, 72Mb and 144Mb devices The GS8161ZxxD(GT/D)-xxxV may be configured by the user Byte write operation (9-bit Bytes) to operate in Pipeline or Flow Through mode. Operating as a 3 chip enable signals for easy depth expansion pipelined synchronous device, in addition to the rising-edge- ZZ pin for automatic power-down triggered registers that capture input signals, the device JEDEC-standard 165-bump BGA package incorporates a rising-edge-triggered output register. For read RoHS-compliant 100-pin TQFP and BGA packages available cycles, pipelined SRAM output data is temporarily stored by the edge triggered output register during the access cycle and Functional Description then released to the output drivers at the next rising edge of The GS8161ZxxD(GT/D)-xxxV is an 18Mbit Synchronous clock. Static SRAM. GSI s NBT SRAMs, like ZBT, NtRAM, NoBL or other pipelined read/double late write or flow through read/ The GS8161ZxxD(GT/D)-xxxV is implemented with GSI s single late write SRAMs, allow utilization of all available bus high performance CMOS technology and is available in bandwidth by eliminating the need to insert deselect cycles JEDEC-standard 165-bump FP-BGA package. when the device is switched from read to write cycles. Parameter Synopsis -333 -250 -200 -150 Unit t 3.0 3.0 3.0 3.8 ns KQ 3.0 4.0 5.0 6.7 ns Pipeline tCycle 3-1-1-1 Curr (x18) 305 245 205 175 mA Curr (x36) 360 285 235 195 mA t 5.0 5.5 6.5 7.5 ns KQ Flow 5.0 5.5 6.5 7.5 ns tCycle Through Curr (x18) 235 215 205 190 mA 2-1-1-1 Curr (x36) 265 245 225 205 mA Rev: 1.03b 9/2013 1/36 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS8161ZxxD(GT/D)-xxxV GS8161Z18DT-xxxV Pinout (Package T) 10099 989796959493929190898887868584838281 A NC 1 80 NC NC 2 79 NC NC 3 78 V V DDQ 4 77 DDQ V V 5 76 SS SS NC NC 6 75 DQPA 7 NC 74 DQA DQB 8 73 DQA DQB 9 72 1M x 18 V V 10 71 SS SS V V 11 Top View 70 DDQ DDQ DQA DQB 12 69 DQA5 13 DQB 68 V 14 FT 67 SS NC V 15 66 DD V NC 16 65 DD ZZ V 17 64 SS DQA DQB 18 63 DQA 19 62 DQB V V 20 61 DDQ DDQ V V 21 60 SS SS DQA 22 DQB 59 23 DQA DQB 58 NC DQPB 24 57 NC 25 56 NC V 26 55 V SS SS V 27 54 V DDQ DDQ NC 28 53 NC 29 52 NC NC 30 NC NC 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Rev: 1.03b 9/2013 2/36 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
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