GS8162Z18/36D(B/D)-400/375/333/250/200/150 400 MHz150 MHz 119 & 165 BGA 18Mb Pipelined and Flow Through 2.5 V or 3.3 V V Commercial Temp DD Synchronous NBT SRAM Industrial Temp 2.5 V or 3.3 V I/O Because it is a synchronous device, address, data inputs, and Features read/write control inputs are captured on the rising edge of the NBT (No Bus Turn Around) functionality allows zero wait input clock. Burst order control (LBO) must be tied to a power Read-Write-Read bus utilization fully pin-compatible with rail for proper operation. Asynchronous inputs include the both pipelined and flow through NtRAM, NoBL and Sleep mode enable (ZZ) and Output Enable. Output Enable can ZBT SRAMs be used to override the synchronous control of the output 2.5 V or 3.3 V +10%/10% core power supply drivers and turn the RAM s output drivers off at any time. 2.5 V or 3.3 V I/O supply Write cycles are internally self-timed and initiated by the rising User-configurable Pipeline and Flow Through mode edge of the clock input. This feature eliminates complex off- ZQ mode pin for user-selectable high/low output drive chip write pulse generation required by asynchronous SRAMs IEEE 1149.1 JTAG-compatible Boundary Scan and simplifies input signal timing. LBO pin for Linear or Interleave Burst mode Pin-compatible with 2Mb, 4Mb, 8Mb, 36Mb, 72Mb and The GS8162Z18/36D may be configured by the user to operate 144Mb devices in Pipeline or Flow Through mode. Operating as a pipelined Byte write operation (9-bit Bytes) synchronous device, in addition to the rising-edge-triggered 3 chip enable signals for easy depth expansion registers that capture input signals, the device incorporates a ZZ Pin for automatic power-down rising edge triggered output register. For read cycles, pipelined JEDEC-standard 119-bump and 165-bump BGA packages SRAM output data is temporarily stored by the edge-triggered RoHS-compliant packages available output register during the access cycle and then released to the output drivers at the next rising edge of clock. Functional Description The GS8162Z18/36D is an 18Mbit Synchronous Static SRAM. The GS8162Z18/36D is implemented with GSI s high GSI s NBT SRAMs, like ZBT, NtRAM, NoBL or other performance CMOS technology and is available in a JEDEC- pipelined read/double late write or flow through read/single standard 119-bump or 165-bump BGA package. late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched from read to write cycles. Parameter Synopsis -400 -375 -333 -250 -200 -150 Unit t 2.5 2.5 2.5 2.5 3.0 3.8 ns KQ 2.5 2.66 3.3 4.0 5.0 6.7 ns Pipeline tCycle 3-1-1-1 Curr (x18) 370 350 310 250 210 185 mA Curr (x36) 430 410 365 290 240 200 mA t 4.0 4.2 4.5 5.5 6.5 7.5 ns KQ Flow 4.0 4.2 4.5 5.5 6.5 7.5 ns tCycle Through Curr (x18) 275 265 255 220 205 190 mA 2-1-1-1 Curr (x36) 315 300 285 250 225 205 mA Rev: 1.03b 9/2013 1/37 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS8162Z18/36D(B/D)-400/375/333/250/200/150 GS8162Z36B Pad Out119-Bump BGATop View (Package B) 1 2 3 4 5 6 7 V V A A A A A A A DDQ DDQ B NC E2 A ADV A E3 NC B V C NC A A A A NC C DD V V D DQC DQPC ZQ DQPB DQB D SS SS V V E DQC DQC E1 DQB DQB E SS SS V V V V F DQC G DQB F DDQ SS SS DDQ G DQC DQC BC A BB DQB DQB G V V H DQC DQC W DQB DQB H SS SS V V V V V J NC NC J DDQ DD DD DD DDQ V V K DQD DQD CK DQA DQA K SS SS L DQD DQD BD NC BA DQA DQA L V V V V M DQD CKE DQA M DDQ SS SS DDQ V V N DQD DQD A1 DQA DQA N SS SS P DQD DQPD V A0 V DQPA DQA P SS SS V R NC A LBO FT A NC R DD T NC NC A A A NC ZZ T V V U TMS TDI TCK TDO NC U DDQ DDQ 2 7 x 17 Bump BGA14 x 22 mm Body1.27 mm Bump Pitch Rev: 1.03b 9/2013 2/37 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see