X-On Electronics has gained recognition as a prominent supplier of GS8322Z36AD-200 SRAM across the USA, India, Europe, Australia, and various other global locations. GS8322Z36AD-200 SRAM are a product manufactured by GSI Technology. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

GS8322Z36AD-200 GSI Technology

GS8322Z36AD-200 electronic component of GSI Technology
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Part No.GS8322Z36AD-200
Manufacturer: GSI Technology
Category: SRAM
Description: SRAM 2.5 or 3.3V 1M x 36 32M
Datasheet: GS8322Z36AD-200 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 39.93 ea
Line Total: USD 39.93 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 39.93
10 : USD 37.444
28 : USD 36.091
56 : USD 35.2
112 : USD 34.177
252 : USD 33.385
504 : USD 32.439
1008 : USD 32.439
2506 : USD 32.439

   
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We are delighted to provide the GS8322Z36AD-200 from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS8322Z36AD-200 and other electronic components in the SRAM category and beyond.

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GS8322Z18/36A(B/D)-400/375/333/250/200/150 400 MHz150 MHz 119 & 165 BGA 36Mb Pipelined and Flow Through 2.5 V or 3.3 V V Commercial Temp DD Synchronous NBT SRAM Industrial Temp 2.5 V or 3.3 V I/O Features Because it is a synchronous device, address, data inputs, and NBT (No Bus Turn Around) functionality allows zero wait read/write control inputs are captured on the rising edge of the Read-Write-Read bus utilization fully pin-compatible with input clock. Burst order control (LBO) must be tied to a power both pipelined and flow through NtRAM, NoBL and rail for proper operation. Asynchronous inputs include the ZBT SRAMs Sleep mode enable (ZZ) and Output Enable. Output Enable can 2.5 V or 3.3 V +10%/10% core power supply be used to override the synchronous control of the output 2.5 V or 3.3 V I/O supply drivers and turn the RAM s output drivers off at any time. User-configurable Pipeline and Flow Through mode Write cycles are internally self-timed and initiated by the rising ZQ mode pin for user-selectable high/low output drive edge of the clock input. This feature eliminates complex off- IEEE 1149.1 JTAG-compatible Boundary Scan chip write pulse generation required by asynchronous SRAMs LBO pin for Linear or Interleave Burst mode and simplifies input signal timing. Pin-compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices Byte write operation (9-bit Bytes) The GS8322Z18/36A may be configured by the user to 3 chip enable signals for easy depth expansion operate in Pipeline or Flow Through mode. Operating as a ZZ Pin for automatic power-down pipelined synchronous device, in addition to the rising-edge- JEDEC-standard 119-bump and 165-bump BGA packages triggered registers that capture input signals, the device RoHS-compliant packages available incorporates a rising edge triggered output register. For read cycles, pipelined SRAM output data is temporarily stored by Functional Description the edge-triggered output register during the access cycle and The GS8322Z18/36A is a 36Mbit Synchronous Static SRAM. then released to the output drivers at the next rising edge of GSI s NBT SRAMs, like ZBT, NtRAM, NoBL or other clock. pipelined read/double late write or flow through read/single The GS8322Z18/36A is implemented with GSI s high late write SRAMs, allow utilization of all available bus performance CMOS technology and is available in a JEDEC- bandwidth by eliminating the need to insert deselect cycles standard 119-bump or 165-bump BGA package. when the device is switched from read to write cycles. Parameter Synopsis -400 -375 -333 -250 -200 -150 Unit t 2.5 2.5 2.5 2.5 3.0 3.8 ns KQ 2.5 2.66 3.3 4.0 5.0 6.7 ns Pipeline tCycle 3-1-1-1 Curr (x18) 395 390 355 280 240 205 mA Curr (x36) 475 455 415 335 280 230 mA t 4.0 4.2 4.5 5.5 6.5 7.5 ns KQ Flow 4.0 4.2 4.5 5.5 6.5 7.5 ns tCycle Through Curr (x18) 290 275 260 235 200 190 mA 2-1-1-1 Curr (x36) 335 320 305 270 240 220 mA Rev: 1.03 8/2013 1/37 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS8322Z18/36A(B/D)-400/375/333/250/200/150 GS8322Z36B Pad Out119-Bump BGATop View (Package B) 1 2 3 4 5 6 7 V V A A A A A A A DDQ DDQ B NC E2 A ADV A E3 NC B V C NC A A A A NC C DD V V D DQC DQPC ZQ DQPB DQB D SS SS V V E DQC DQC E1 DQB DQB E SS SS V V V V F DQC G DQB F DDQ SS SS DDQ G DQC DQC BC A BB DQB DQB G V V H DQC DQC W DQB DQB H SS SS V V V V V J NC NC J DDQ DD DD DD DDQ V V K DQD DQD CK DQA DQA K SS SS L DQD DQD BD NC BA DQA DQA L V V V V M DQD CKE DQA M DDQ SS SS DDQ V V N DQD DQD A1 DQA DQA N SS SS P DQD DQPD V A0 V DQPA DQA P SS SS V R NC A LBO FT A NC R DD T NC NC A A A A ZZ T V V U TMS TDI TCK TDO NC U DDQ DDQ 2 7 x 17 Bump BGA14 x 22 mm Body1.27 mm Bump Pitch Rev: 1.03 8/2013 2/37 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
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