X-On Electronics has gained recognition as a prominent supplier of GS842Z18CGB-150 SRAM across the USA, India, Europe, Australia, and various other global locations. GS842Z18CGB-150 SRAM are a product manufactured by GSI Technology. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

GS842Z18CGB-150 GSI Technology

GS842Z18CGB-150 electronic component of GSI Technology
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Part No.GS842Z18CGB-150
Manufacturer: GSI Technology
Category: SRAM
Description: SRAM 2.5 or 3.3V 256K x 18 4M
Datasheet: GS842Z18CGB-150 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 10.994 ea
Line Total: USD 10.99

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 05 Aug to Wed. 07 Aug
MOQ : 1
Multiples : 1
1 : USD 9.7865
10 : USD 9.223
25 : USD 9.016
84 : USD 8.096
252 : USD 7.705
504 : USD 7.6245
1008 : USD 7.6245
2520 : USD 7.59
5040 : USD 7.3255

   
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We are delighted to provide the GS842Z18CGB-150 from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS842Z18CGB-150 and other electronic components in the SRAM category and beyond.

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GS842Z18CB/GS842Z36CB 250 MHz100 MHz 119-Bump BGA 4Mb Pipelined and Flow Through 3.3 V V DD Commercial Temp 2.5 V and 3.3 V V Synchronous NBT SRAMs DDQ Industrial Temp Because it is a synchronous device, address, data inputs, and Features read/ write control inputs are captured on the rising edge of the 256K x 18 and 128K x 36 configurations input clock. Burst order control (LBO) must be tied to a power User configurable Pipeline and Flow Through mode rail for proper operation. Asynchronous inputs include the NBT (No Bus Turn Around) functionality allows zero wait sleep mode enable (ZZ) and Output Enable. Output Enable can read-write-read bus utilization be used to override the synchronous control of the output Fully pin compatible with both pipelined and flow through drivers and turn the RAM s output drivers off at any time. NtRAM, NoBL and ZBT SRAMs Write cycles are internally self-timed and initiated by the rising Pin-compatible with 2Mb, 9Mb, and 18Mb devices edge of the clock input. This feature eliminates complex off- 3.3 V +10%/10% core power supply chip write pulse generation required by asynchronous SRAMs 2.5 V or 3.3 V I/O supply and simplifies input signal timing. LBO pin for Linear or Interleave Burst mode Byte write operation (9-bit Bytes) The GS842Z18/36CB may be configured by the user to operate 3 chip enable signals for easy depth expansion in Pipeline or Flow Through mode. Operating as a pipelined Clock Control, registered address, data, and control synchronous device, in addition to the rising-edge-triggered ZZ Pin for automatic power-down registers that capture input signals, the device incorporates a JEDEC-standard 119-bump BGA package rising-edge-triggered output register. For read cycles, pipelined RoHS-compliant package available SRAM output data is temporarily stored by the edge triggered output register during the access cycle and then released to the Functional Description output drivers at the next rising edge of clock. The GS842Z18/36CB is a 4Mbit Synchronous Static SRAM. The GS842Z18/36CB is implemented with GSI s high GSI s NBT SRAMs, like ZBT, NtRAM, NoBL or other performance CMOS technology and is available in a JEDEC- pipelined read/double late write or flow through read/single standard 119-bump BGA package. late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched from read to write cycles. Parameter Synopsis 250 200 166 150 100 tCycle 4.0 ns 5.5 ns 6.0 ns 6.7 ns 10 ns Pipeline tKQ 2.5 ns 3.0 ns 3.5 ns 3.8 ns 4.5 ns 3-1-1-1 IDD TBD TBD TBD TBD TBD Flow tKQ 5.5 ns 6.5 ns 7.0 ns 7.5 ns 12 ns tCycle 5.5 ns 6.5 ns 7.0 ns 7.5 ns 12 ns Through 2-1-1-1 IDD TBD TBD TBD TBD TBD Rev: 1.01 8/2011 1/29 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS842Z18CB/GS842Z36CB GS842Z18C Pad Out119-Bump BGATop View (Packge B) 1234567 A V AA NC AA V DDQ DDQ B NC E2 AADV A E3 NC C NC A A V AA NC DD D DQB NC V ZQ V DQPA NC SS SS E NC DQB V E1 V NC DQA SS SS F V NC V G V DQA V DDQ SS SS DDQ G NC DQB BB NC NC NC DQA H DQB NC V W V DQA NC SS SS J V V NC V NC V V DDQ DD DD DD DDQ K NC DQB V CK V NC DQA SS SS L DQB NC NC NC BA DQA NC M V DQB V CKE V NC V DDQ SS SS DDQ N DQB NC V A1 V DQA NC SS SS P NC DQPB V A0 V NC DQA SS SS R NC A LBO V FT ANC DD T NC A A NC A A ZZ U V TMS TDI TCK TDO NC V DDQ DDQ Rev: 1.01 8/2011 2/29 2011, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

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