X-On Electronics has gained recognition as a prominent supplier of GS8644Z36GE-200 SRAM across the USA, India, Europe, Australia, and various other global locations. GS8644Z36GE-200 SRAM are a product manufactured by GSI Technology. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

GS8644Z36GE-200 GSI Technology

GS8644Z36GE-200 electronic component of GSI Technology
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Part No.GS8644Z36GE-200
Manufacturer: GSI Technology
Category: SRAM
Description: SRAM 2.5 or 3.3V 2M x 36 72M
Datasheet: GS8644Z36GE-200 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
15: USD 83.49 ea
Line Total: USD 1252.35 
Availability - 0
MOQ: 15  Multiples: 15
Pack Size: 15
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 15
Multiples : 15
15 : USD 83.49
30 : USD 82.984

   
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We are delighted to provide the GS8644Z36GE-200 from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS8644Z36GE-200 and other electronic components in the SRAM category and beyond.

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GS8644Z18E/GS8644Z36E 250 MHz133MHz 165-Pin BGA 72Mb Pipelined and Flow Through 2.5 V or 3.3 V V Commercial Temp DD Synchronous NBT SRAM Industrial Temp 2.5 V or 3.3 V I/O Features Because it is a synchronous device, address, data inputs, and NBT (No Bus Turn Around) functionality allows zero wait read/write control inputs are captured on the rising edge of the Read-Write-Read bus utilization fully pin-compatible with input clock. Burst order control (LBO) must be tied to a power both pipelined and flow through NtRAM, NoBL and rail for proper operation. Asynchronous inputs include the ZBT SRAMs Sleep mode enable (ZZ) and Output Enable. Output Enable can 2.5 V or 3.3 V +10%/10% core power supply be used to override the synchronous control of the output 2.5 V or 3.3 V I/O supply drivers and turn the RAM s output drivers off at any time. User-configurable Pipeline and Flow Through mode Write cycles are internally self-timed and initiated by the rising ZQ mode pin for user-selectable high/low output drive edge of the clock input. This feature eliminates complex off- IEEE 1149.1 JTAG-compatible Boundary Scan chip write pulse generation required by asynchronous SRAMs LBO pin for Linear or Interleave Burst mode and simplifies input signal timing. Pin-compatible with 9Mb, 18Mb, and 36Mb devices The GS8644Z18/36 may be configured by the user to operate Byte write operation (9-bit Bytes) in Pipeline or Flow Through mode. Operating as a pipelined 3 chip enable signals for easy depth expansion synchronous device, in addition to the rising-edge-triggered ZZ Pin for automatic power-down registers that capture input signals, the device incorporates a JEDEC-standard 165-BGA package rising edge triggered output register. For read cycles, pipelined RoHS-compliant 165-bump BGA package available SRAM output data is temporarily stored by the edge-triggered output register during the access cycle and then released to the Functional Description output drivers at the next rising edge of clock. The GS8644Z18/36 is a 72Mbit Synchronous Static SRAM. The GS8644Z18/36 is implemented with GSI s high GSI s NBT SRAMs, like ZBT, NtRAM, NoBL or other performance CMOS technology and is available in a JEDEC- pipelined read/double late write or flow through read/single standard 165-bump BGA package. late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched from read to write cycles. Parameter Synopsis -250 -225 -200 -166 -150 -133 Unit t (x18/x36) 2.5 2.7 3.0 3.5 3.8 4.0 ns KQ 3.0 3.0 3.0 3.5 3.8 4.0 ns t (x72) KQ 4.0 4.4 5.0 6.0 6.7 7.5 ns Pipeline tCycle 3-1-1-1 Curr (x18) 385 360 335 305 295 265 mA Curr (x36) 450 415 385 345 325 295 mA Curr (x72) 540 505 460 405 385 345 mA t 6.5 6.5 6.5 7.0 7.5 8.5 ns KQ 6.5 6.5 6.5 7.0 7.5 8.5 ns Flow tCycle Through Curr (x18) 265 265 265 255 240 225 mA 2-1-1-1 Curr (x36) 290 290 290 280 265 245 mA Curr (x72) 345 345 345 335 315 300 mA Rev: 1.05b 5/2010 1/31 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see GS8644Z18E/GS8644Z36E 165 Bump BGAx18 Common I/OTop View (Package E) 1 2 3 4 5 6 7 8 9 10 11 A NC A E1 BB NC E3 CKE ADV A A A A B NC A E2 NC BA CK W G A A NC B C NC NC V V V V V V V NC DQPA C DDQ SS SS SS SS SS DDQ D NC DQB V V V V V V V NC DQA D DDQ DD SS SS SS DD DDQ E NC DQB V V V V V V V NC DQA E DDQ DD SS SS SS DD DDQ F NC DQB V V V V V V V NC DQA F DDQ DD SS SS SS DD DDQ G NC DQB V V V V V V V NC DQA G DDQ DD SS SS SS DD DDQ H FT MCH NC V V V V V NC ZQ ZZ H DD SS SS SS DD J DQB NC V V V V V V V DQA NC J DDQ DD SS SS SS DD DDQ K DQB NC V V V V V V V DQA NC K DDQ DD SS SS SS DD DDQ L DQB NC V V V V V V V DQA NC L DDQ DD SS SS SS DD DDQ M DQB NC V V V V V V V DQA NC M DDQ DD SS SS SS DD DDQ N DQPB NC V V NC NC NC V V NC NC N DDQ SS SS DDQ P NC A A A TDI A1 TDO A A A NC P R LBO A A A TMS A0 TCK A A A A R 11 x 15 Bump BGA15 mm x 17 mm Body1.0 mm Bump Pitch Rev: 1.05b 5/2010 2/31 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see

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