FX11A-80P/8-SV0.5(71) Hirose

0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections FX11 Series Stacking height : 2mm Stacking height : 2.5mm, 3mm 10 Signal: 1 Ground Arrangement Features 1. Low Profile Design The board-to-board mating height of 2mm, 2.5mm and 3mm suits smaller, thinner case designs. (Fig.2) 2. Improved Transmission Efficiency Between Boards Ground Plate Transmission characteristics have been improved through a design Signal contact Housing that fixes ground plates to both sides of the header and receptacle. 3. 10 Signal:1 Ground Arrangement Metal fitting Signal and ground are arranged in a ratio of 10:1 with the ground plate connected to the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1) Ground plate and metal fitting make contact Fig.1 4. Metal Fittings for Added Strength Stacking Height Variation Metal fittings provide for greater adhesion to the board, which protects the connector against sheaning forces. The unique connector design provides a connection between the fitting and the * ! ( '# ground plate for a stronger ground. bb 'bb 5. Suited to High-Density Applications The signal contact pitch of 0.5mm affords a compact connector, Note: 2.0mm type product cannot be used or interchanged with the 2.5mm or 3.0mm type product. and reduces mounting space on the board. Fig.2 6. Structure Prevents Solder Wicking Structure Prevent Solder Wicking A solder gap has been designed into the contact SMT portion to prevent solder wicking. (Fig.3) HdaYZg\Veedgi^dc 7. High Contact Reliability 7dVgYbdjci^c\edgi^dc Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm, 8dciVXi hjg[VXZ AVcY 3mm height) for signal contacts. 8. Optional Ground Plate Fig.3 An alternate style is also available without the ground plate. The space provided by the absence of the ground plate is filled with additional signal contacts. Signal Integrity Features Insertion-Loss-to-Crosstalk Ratio (ICR) Impedance 3mm(Without GND) 120 The insertion-loss-to-crosstalk ICR 3mm(Without GND) 60 115 ratio (ICR) with five differential FEXT aggressors meets the 110 50 extrapolated IEEE802.3ap 105 + 40 specification to 10 Gbps. 100 30 95 Differential Impedance 20 90 The differential impedance is 10 + 100 /- 10 for FX11 at 50 ps 85 ICR FX11-3mm DifferentialTDR IEEEspec rise time(20% to 80%). 0 80 0 1 2 3 4 5 6 7 8 9 10 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 Time(ns) Frequency(GHz) 1 2015.4w 0.75mm 0.5mm 0.75mm ICR(dB) Z()FX11 Series0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections BStacking height variation With ground plate Header FX11L#-*P / *-SV Receptacle FX11L#-*S / *-SV 2mm Header FX11#-*P / *-SV FX11#-*P / *-SV0.5 Receptacle FX11#-*S / *-SV 2.5mm 3mm Without ground plate Header FX11L#-*P-SV Receptacle FX11L#-*S-SV 2mm Header FX11#-*P-SV FX11#-*P-SV0.5 Receptacle FX11#-*S-SV 2.5mm 3mm Note 1: The thickness of the solder paste is not included in the stacking height. Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other. BCross section of mating Stacking height : 2mm H^\cVaedgi^dc <gdjcYedgi^dc =ZVYZg :[[ZXi^kZl^eZaZc\i] %#** :[[ZXi^kZbVi^c\aZc\i] %#** GZXZeiVXaZ Stacking height : 2.5mm, 3mm H^\cVaedgi^dc <gdjcYedgi^dc =ZVYZg :[[ZXi^kZl^eZaZc\i] & :[[ZXi^kZbVi^c\aZc\i] %#. GZXZeiVXaZ (Shown for stacking height 2.5mm type.) 2