Card Bus Socket Connectors
IC9 Series
Features
1. Compliant with PC Card Standards
Complies with latest requirements of PC Card
Standard.
2. Repairable
Repairable terminations of connector solder
joints after installation on the board.
3. Lead Offset
Available with two board mounting levels of
terminations, to allow use of different height
components.
Product Specifications
Current rating 0.5 A Operating temperature Storage temperature
-55 to +85 (Note 1) -10 to +60 (Note 2)
Ratings
Voltage rating 125 V AC Operating humidity 95% R.H. or less (No condensation) Storage humidity 40 to 70% (Note 2)
Item Specification Conditions
1. Insulation resistance 1000M ohms min. 500 V DC
2. Withstanding voltage No flashover or insulation breakdown. 500 V AC / 1 minute
3. Contact resistance 40 m max. (initial value) 1 mA
No electrical discontinuity of 100ns or Frequency: 10 to 2000 Hz, single amplitude of 0.75 mm or
4. Vibration
2
more acceleration of 147 m/s (peak), 4 hours in each of the 3 directions.
5. Humidity (Steady state) Insulation resistance: 100 M min. 96 hours at temperature of 40 and humidity of 90% to 95%
-55, 30 min/15 to 30, within 5 min/8530 min
6. Temperature cycle No damage, cracks, or parts looseness.
/15 to 35, within 5 min, for 5 cycles
7. Durability Change of contact resistance from the
10000 cycles at 400 to 600 cycles per hour
(Insertion/withdrawal) start should be 20 m max.
Reflow: At the recommended temperature profile
8. Resistance to
No deformation of components
soldering heat affecting performance.
Manual soldering: 300 for 3 seconds
Note 1: Includes temperature rise caused by current flow.
Note 2: The termstorag refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
Materials
Part Material Finish Notes
Insulator PA Black UL94V-0
Contact Area : gold plating
Contact Phosphor bronze -----------------
Lead Area : solder plating
Contact Area : gold plating
Ground plate Brass -----------------
Lead Area : solder plating
A69 Ordering Information
IC9 - 68 R D - 0.635 SFA
1 2 3 4 5 6
1 Series name : IC9
2 Number of contacts : 68
3 R : card connector
4
D : 2-row alignment
5 Lead pitch : 0.635 mm
6 Offset type
SF : 0.3 mm offset
SFA : 0.9 mm offset
BLead Offset
Type with 0.3 mm offset Type with 0.9 mm offset
BMounting Method
1. Place and solder the connector without the ground plate as shown in fig.(a).
2. Place the ground plate over the connector as shown in Fig.(b), making sure that the locking tabs are correctly
aligned with the slots on both sides of the insulator. Press firmly at both ends to assure secure lock.
Note: Care should be taken that the termination leads of the ground plate are not deformed or damaged during
this operation.
3. Solder the termination leads of the ground plate to the board.
A70