CY3250-LED08 Infineon

Release Notes CY3250 QFN POD Kits Release Date: December 11, 2009 Thank you for your interest in this CY3250 QFN Emulation POD Kit. This document lists known issues with this family of kits. Kit Overview Emulation PODs are designed to connect to the In-Circuit Emulator (CY3215-DK) to allow debugging capability. They can also function as a standalone device without debugging capability. The Emulation POD has a unique interface on the bottom side for connecting with specially designedfee boards. The feet can be soldered to the target board in place of the device being emulated. Known Issues and Workarounds The following table captures the known issues with the CY3250 QFN style emulation POD kits. Items Affected Items Revision Workaround/Fix Status Customers can purchase a 0.050 size hex key from 1. Strain relief standoff screws may QFN Emulation McMaster-Carr website ALL be difficult to screw in by hand. PODs (All) SCOPE OF IMPACT Users of the strain relief standoff screws included with QFN style PODs. WORKAROUND/FIX Customers can purchase a 0.050 size hex key from McMaster-Carr by visiting their website at