PRELIMINARY CYW20732Y
Bluetooth Low Energy SiP Module
General Description
The Cypress CYW20732Y is a Bluetooth Low-Energy (BLE)-only System-in-Package (SiP). The CYW20732Y radio has been
designed to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz
unlicensed Industrial, Scientific, and Medical (ISM) band.
The highly integrated module requires minimal external components to make a standalone 32-bit ARM Cortex M3 and 1 Mbit
EEPROM BLE SiP module. The CYW20732Y is available in a 27-pin 3.5 mm 3.2 mm x 1.0 mm maximum 27-LGA package.
Features
Bluetooth Low-Energy (BLE)-compliant 32-bit ARM Cortex M3 microcontroller unit
(MCU)
Infrared modulator
2
Embedded 1 Mbit I C Memory capacity
IR learning
EEPROM memory capacity
Supports Adaptive Frequency Hopping (AFH)
UART diverse serial interface
Excellent receiver sensitivity
2
Sensor applications support for I C, GPIO, and
10-bit auxiliary ADC with nine analog channels
PCM
On-chip support for serial peripheral interface
MAC/BB/RF functionality on a single chip
(master and slave modes)
2.4 GHz frequency band support
Broadcom Serial Control (BSC) interface (com-
2
BLE network standard compliance with Bluetooth
patible with NXP I C slaves)
Special Interest Group (SIG) requirements
Programmable output power control
Compliance with Moisture Sensitivity Level
Integrated ARM Cortex-M3 based microproces-
(MSL) 3 for semiconductor packaging and han-
sor core
dling precautions
On-chip power-on reset (POR)
FCC and CE certification and compliance
Support for EEPROM and serial flash interfaces
RoHS compliant
Integrated Low Drop Out (LDO) regulator
Satisfies MSL3 and J-STD-020 specification
requirements (peak temperature 260 C) and is
On-chip, software controlled power management
capable of 260 C peak reflow.
unit
Satisfies Restriction of Hazardous Substances
Programmable key scan matrix interface, up to
(RoHS) Directive 2002/95/EC and 2011/65/EU.
8 20 key-scanning matrix
27-pin 27-Land Grid Array (LGA) (3.5 mm 3.2
mm x 1.0 mm) package.
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document No. 002-14838 Rev. *C Revised November 9, 2017PRELIMINARY
CYW20732Y
Figure 1. Functional Block Diagram
VBAT VDDC VDBL
UART interface
BT_RF
2
I C
CYW20732Y
VDBL_EE
GPIOs
with ARM Cortex M3
microprocessor core
PCM
2.4 MHz XTAL
Flash
1 Mbit I2C
Introduction
This data sheet provides a description of the major blocks, interfaces, pin assignments, and specifications of the CYW20732Y single-
chip Bluetooth low energy (BLE) SoC. This is a required document for designers responsible for adding the CYW20732Y BLE SoC
to wireless input device applications including heart-rate monitors, blood-pressure monitors, proximity sensors, temperature sensors,
and battery monitors.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Cypress to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number Cypress Part Number
BCM20732Y CYW20732Y
BCM20732YB3ISLGH (T) CYW20732YB3ISLGH (T)
Acronyms and Abbreviations
In most cases, acronyms and abbreviations are defined upon first use. For a more complete list of acronyms and other terms used in
Cypress documents, go to: