IR2085STRPbF Infineon

Data Sheet No. PD60206 Rev.D IR2085S & (PbF) HIGH SPEED, 100V, SELF OSCILLATING 50% DUTY CYCLE, HALF-BRIDGE DRIVER Product Summary Features Simple primary side control solution to enable half-bridge DC-Bus Topology Half-Bridge Converters for 48V distributed systems with reduced component count and board space V 100 V OFFSET Integrated 50% duty cycle oscillator & half-bridge driver I & I (typical) 1.0A & 1.0A o+ o- IC in a single SO-8 package Programmable switching frequency with up to 500kHz f (max) 500kHz OSC max per channel +/- 1A drive current capability optimized for low charge Deadtime 50ns 200ns MOSFETs HO/LO Pulse Adjustable dead-time 50ns 200ns +/- 25ns Matching Floating channel designed for bootstrap operation up to +100Vdc High and low side pulse width matching to +/- 25ns Package Adjustable overcurrent protection Undervoltage lockout and internal soft start Also available Leadfree 8 - Lead SOIC Description The IR2085S is a self-oscillating half-bridge driver IC with 50% duty cycle ideally suited for 36V 75V half- bridge DC-bus converters. This product is also suitable for push-pull converters without restriction on input voltage. Each channel frequency is equal to f which can be set by selecting R & C where f = 1/(2*R .C ). OSC, T T, OSC T T Dead-time can be controlled through proper selection of C and can range from 50ns to 200ns. Internal T soft-start increases the pulse width during power up and maintains pulse width matching for the high and low outputs throughout the start up cycle. The IR2085S initiates a soft start at power up and after every overcurrent condition. Undervoltage lockout prevents operation if V is less than 7.5V. CC Typical Connection Diagram www.irf.com 1 IR2085S & (PbF) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param- eters are absolute voltages referenced to COM. All currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V High side floating supply voltage -0.3 150 b V Low side supply voltage 25 CC V High side floating supply offset voltage V - 25 V + 0.3 S b b V V High side floating output voltage V - 0.3 V + 0.3 HO b b V Low side output voltage -0.3 V + 0.3 LO CC OSC OSC pin voltage -0.3 V + 0.3 CC V Cs pin voltage -0.3 V + 0.3 CS CC dV /dt Allowable offset voltage slew rate -50 +50 V/ns S I Supply current 20 mA CC P Package power dissipation 1.0 W D Rth Thermal resistance, junction to ambient 200 C/W JA T Junction temperature -55 150 J T Storage temperature -55 150 C S T Lead temperature (soldering, 10 seconds) 300 L Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. Symbol Definition Min. Max. Units Vb High side floating supply voltage V -0.7 15 dd V Steady state high side floating supply offset voltage -5 100 S Vdc V Supply voltage 10 15 CC I Supply current (Note 2) 5 mA CC R Timing resistor 10 100 K T C Timing capacitor 47 1000 pF T fosc(max) Operating frequency (per channel) 500 KHz T Junction temperature -40 125 C J Note1: Care should be taken to avoid output switching conditions where the Vs node flies inductively below ground by more than 5V. www.irf.com 2