Data Sheet PD No.60226 revB IR2086S(PbF) HIGH SPEED, 100V, SELF OSCILLATING 50% DUTY CYCLE, FULL-BRIDGE DRIVER Features Product Summary Simple primary side control solution to enable full-bridge DC-Bus Converters for 48V distributed systems with reduced V 25V CC (max) component count and board space. Frequency and dead time set by two external components V 100Vdc offset(max) Maximum 500KHz per channel output with 50% duty cycle High/low side Adjustable dead time 50nsec ~ 200nsec output freq (f ) 500kHz Floating channel designed for bootstrap operation up to +100Vdc osc High and low side pulse width matching to +/- 25nsec Output Current (I ) +/-1.2A O Overcurrent protection with adjustable hiccup period. High/low side pulse Undervoltage lockout and internal soft start edge matching +/- 25ns Part also available leadfree Description Package The IR2086S(PbF) is a self oscillating full-bridge controller and driver IC with 50% duty cycle ideally suited for 36V-75V full-bridge DC Bus Converters. Dead time can be controlled through proper selection of C and can range T from 50 to 200nsec. Internal soft start increases pulse width on power up and maintains equal pulse widths for the high and low outputs throughout the start up cycle. Undervoltage lockout prevents operation if Vcc is less than 7.5 Vdc. Over current shutdown occurs when the voltage on the Cs pin exceeds 200mV. Restart after overcurrent trip can be delayed by adjusting 16-Lead SOIC the external capacitor. The delay time ranges from 10 s to 1s. VBUSS (100 VDC MAX) Typical VCC (9 ~15V) Connection IR2086S VB1 CS HO1 RT VS1 DELAY CT COM2* COM1 LO2 (Refer to Lead Assign- VS2 LO1 ments for correct pin CT VCC HO2 CD** configuration). This/ VB2 These diagram(s) show electrical connec- RSENSE tions only. Please refer to our Application Notes and DesignTips for proper circuit board *COM2 must be shorted to COM1 for proper operation layout. **CD is optionalIR2086S(PbF) Absolute Maximum Ratings V (V , V ) = 12V, C = 1000 pF, and T = 25C unless otherwise specified. BIAS CC BS L A Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. All currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V Low side supply voltage -0.3 25 CC V High side floating supply voltage -0.3 150 B1,2 V High side floating supply offset voltage V - 25 V + 0.3 S1,2 B1,2 B1,2 Vdc V High side floating output voltage V - 0.3 V + 0.3 HO1,2 B1,2 B1,2 V Low side output voltage -0.3 V + 0.3 LO1,2 CC V CT pin voltage -0.3 V + 0.3 CT CC V Cs pin voltage -0.3 V + 0.3 CS CC V Delay pin voltage -0.3 V + 0.3 DELAY CC dV /dt Allowable offset voltage slew rate -50 +50 V/ns S I Supply current 40 mA CC P Package power dissipation W (16-lead SOIC) 1.0 D Rth Thermal resistance, junction to ambient (16-lead SOIC) 200 C/W JA T Junction temperature -55 150 J T Storage temperature -55 150 S C T Lead temperature (soldering, 10 seconds) 300 L Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. Symbol Definition Min. Max. Units 9.5 15 V High side floating supply voltage B1,2 V Steady state high side floating supply offset voltage -5 100 Vdc S1,2 V Supply voltage 9.5 15 CC I Supply current 1 mA CC R Timing resistor 10 100 Kohms T C Timing capacitor 47 1000 pF T fmax Operating frequency (per channel) 500 KHz T Junction temperature -40 125 C j Note1: Care should be taken to avoid output switching conditions where the Vs node flies inductively below ground by more than 5V. www.irf.com 2