Data Sheet No. PD60194 revD ( ) ( ) IR21592 S & PbF ( ) ( ) IR21593 S & PbF DIMMING BALLAST CONTROL IC Features Full lamp fault protection Ballast control and half-bridge driver in one IC Brown-out protection Transformer-less lamp power sensing Automatic restart Closed-loop lamp power control Micro-power startup Closed-loop preheat current control Zener clamped Vcc Programmable preheat time Over-temperature protection Programmable preheat current 16-pin DIP and SOIC package types Lamp ignition detection Programmable ignition-to-dim time 0.5 to 5VDC dimming control input Min and max lamp power adjustments Programmable minimum frequency Internal current sense blanking Description Description: The IR21592/IR21593 are complete dimming ballast controllers and 600V Packages half-bridge drivers all in one IC. The architecture includes phase control for trans- former-less lamp power sensing and regulation which minimizes changes needed to adapt non-dimming ballasts for dimming. Externally programmable features such as preheat time and current, ignition-to-dim time, and a complete dimming interface with 16 Lead SOIC minimum and maximum settings provide a high degree of flexibility for the ballast (narrow body) design engineer. Protection from failure of a lamp to strike, filament failures, thermal overload, or lamp failure during normal operation, as well as an automatic restart function, have been included in the design. The heart of this control IC is a voltage- controlled oscillator with externally programmable minimum frequency. The IR21592/ IR21593 are available in both 16 pin DIP and 16 pin narrow body SOIC packages. 16 Lead PDIP Typical Connection + Rectified AC Line Single Lamp Dimmable + DC Bus R VAC R PULL-UP R VDC C VDC 1 16 VDC HO C VCO 2 15 VCO VS C PH 3 14 CPH VB R DIM 4 13 DIM VCC 0.5 to 5VDC R MAX 5 12 MAX COM R MIN 6 11 MIN LO R FMIN 7 10 FMIN CS R IPH 8 9 IPH SD R CS - DC Bus www.irf.com 1( ) ( ) IR21592/IR21593 S & PbF Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V High side floating supply voltage -0.3 625 B V High side floating supply offset voltage V - 25 V + 25 S B B V V High side floating output voltage V - 0.3 V + 0.3 HO S B V Low side output voltage -0.3 V + 0.3 LO CC I Maximum allowable output current (either output) -500 500 OMAX mA due to external power transistor miller effect V Voltage controlled oscillator input voltage -0.3 6.0 V VCO I CPH current -5 5 mA CPH V IPH voltage -0.3 5.5 IPH V Dimming control pin input voltage -0.3 5.5 DIM V Maximum lamp power setting pin input voltage -0.3 5.5 MAX V V Minimum lamp power setting pin input voltage -0.3 5.5 MIN V Current sense input voltage -0.3 5.5 CS I Shutdown pin current -5 5 SD mA I Supply current (note 1) 25 CC dV/dt Allowable offset voltage slew rate -50 50 V/ns P Package power dissipation T +25C (16 pin DIP) 1.60 D A W P = (T -T )/Rth (16 pin SOIC) 1.25 D JMAX A JA Rth Thermal resistance, junction to ambient (16 pin DIP) 75 JA o C/W (16 pin SOIC) 115 T Junction temperature -55 150 J T Storage temperature -55 150 S o C T Lead temperature (soldering, 10 seconds) 300 L Note 1: This IC contains a zener clamp structure between the chip V and COM which has a nominal breakdown CC voltage of 15.6V (V ). Please note that this supply pin should not be driven by a DC, low impedance CLAMP power source greater than the diode clamp voltage (V ) as specified in the Electrical Characteristics CLAMP section. 2 www.irf.com