Data Sheet No. PD60194 revD
( ) ( )
IR21592 S & PbF
( ) ( )
IR21593 S & PbF
DIMMING BALLAST CONTROL IC
Features
Full lamp fault protection
Ballast control and half-bridge driver in one IC
Brown-out protection
Transformer-less lamp power sensing
Automatic restart
Closed-loop lamp power control
Micro-power startup
Closed-loop preheat current control
Zener clamped Vcc
Programmable preheat time
Over-temperature protection
Programmable preheat current
16-pin DIP and SOIC package types
Lamp ignition detection
Programmable ignition-to-dim time
0.5 to 5VDC dimming control input
Min and max lamp power adjustments
Programmable minimum frequency
Internal current sense blanking
Description
Description: The IR21592/IR21593 are complete dimming ballast controllers and 600V Packages
half-bridge drivers all in one IC. The architecture includes phase control for trans-
former-less lamp power sensing and regulation which minimizes changes needed to
adapt non-dimming ballasts for dimming. Externally programmable features such as
preheat time and current, ignition-to-dim time, and a complete dimming interface with
16 Lead SOIC
minimum and maximum settings provide a high degree of flexibility for the ballast
(narrow body)
design engineer. Protection from failure of a lamp to strike, filament failures, thermal
overload, or lamp failure during normal operation, as well as an automatic restart
function, have been included in the design. The heart of this control IC is a voltage-
controlled oscillator with externally programmable minimum frequency. The IR21592/
IR21593 are available in both 16 pin DIP and 16 pin narrow body SOIC packages.
16 Lead PDIP
Typical Connection
+ Rectified AC Line
Single Lamp Dimmable
+ DC Bus
R
VAC
R
PULL-UP
R
VDC
C
VDC
1 16
VDC HO
C
VCO
2 15
VCO VS
C
PH
3 14
CPH VB
R
DIM
4 13
DIM VCC
0.5 to 5VDC
R
MAX 5 12
MAX COM
R
MIN
6 11
MIN LO
R
FMIN
7 10
FMIN CS
R
IPH
8 9
IPH SD
R
CS
- DC Bus
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IR21592/IR21593 S & PbF
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V High side floating supply voltage -0.3 625
B
V High side floating supply offset voltage V - 25 V + 25
S B B
V
V High side floating output voltage V - 0.3 V + 0.3
HO S B
V Low side output voltage -0.3 V + 0.3
LO CC
I Maximum allowable output current (either output) -500 500
OMAX
mA
due to external power transistor miller effect
V Voltage controlled oscillator input voltage -0.3 6.0 V
VCO
I CPH current -5 5 mA
CPH
V IPH voltage -0.3 5.5
IPH
V Dimming control pin input voltage -0.3 5.5
DIM
V Maximum lamp power setting pin input voltage -0.3 5.5
MAX
V
V Minimum lamp power setting pin input voltage -0.3 5.5
MIN
V Current sense input voltage -0.3 5.5
CS
I Shutdown pin current -5 5
SD
mA
I Supply current (note 1) 25
CC
dV/dt Allowable offset voltage slew rate -50 50 V/ns
P Package power dissipation @ T +25C (16 pin DIP) 1.60
D A
W
P = (T -T )/Rth (16 pin SOIC) 1.25
D JMAX A JA
Rth Thermal resistance, junction to ambient (16 pin DIP) 75
JA
o
C/W
(16 pin SOIC) 115
T Junction temperature -55 150
J
T Storage temperature -55 150
S
o
C
T Lead temperature (soldering, 10 seconds) 300
L
Note 1: This IC contains a zener clamp structure between the chip V and COM which has a nominal breakdown
CC
voltage of 15.6V (V ). Please note that this supply pin should not be driven by a DC, low impedance
CLAMP
power source greater than the diode clamp voltage (V ) as specified in the Electrical Characteristics
CLAMP
section.
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