IR2161STRPBF Infineon

IR2161 Data Sheet No. PD60219 rev C IR2161(S) & (PbF) HALOGEN CONVERTOR CONTROL IC Packages Features Intelligent half-bridge driver % & () 8-Lead SOIC &*+,, ) 8-Lead PDIP IR2161S - IR2161 . / 0 1 0( - ( 2 03 & ) Description ( 4565 ( 7 0 ( 7 & )/ ( / ( / / ( / ( 4565 ( & )/ 1 0( - ( 2 8 / Typical Connections RD C1 RS R1 DCP1 CD DB DCP2 DS Q1 D1 D2 CSNUB VCC VB LF 1 8 CVCC1 COM HO 2 7 CVCC2 T1 AC LINE CB CLF CSD VS 3 6 INPUT VZ CS LO C3 C4 Q2 4 5 D3 D4 R2 C2 RL 12VAC CSD CCS RCS OUTPUT % & ( www.irf.com 1S IR2161( ) & (PbF) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V High side floating supply voltage -0.3 625 B V High side floating supply offset voltage V - 25 V + 0.3 S B B V V High side floating output voltage V - 0.3 V + 0.3 HO S B V Low side output voltage -0.3 V + 0.3 LO CC IO Maximum allowable output current (HO,LO) due to external -500 500 MAX mA power transistor miller effect V CSD pin voltage -0.3 V + 0.3 CSDMAX CC V V Current sense pin voltage -0.3 V + 0.3 CS CC I Current sense pin current -5 5 CS mA I Supply current (Note 1) -20 20 CC dV/dt Allowable offset voltage slew rate -50 50 V/ns P Maximum power dissipation T +25 C (8 Lead DIP) 1 D A W PD = (T -T )/Rth (8 Lead SOIC) 0.625 JMAX A JA Rth Thermal resistance, junction to ambient (8 Lead DIP) 125 JA C/W (8 Lead SOIC) 200 T Junction temperature -55 150 J T Storage temperature -55 150 C S T Lead temperature (soldering, 10 seconds) 300 L Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. Symbol Definition Min. Max. Units V High side floating supply voltage V - 0.7 V BS CC CLAMP V Minimum required VBS voltage for proper HO functionality 4.3 BSMIN V V Steady state high-side floating supply offset voltage -1 600 S V Supply voltage V V CC CCUV+ CLAMP I Supply current (Note 2) 10 mA CC C CSD pin external capacitor 47 nF SD I Current sense pin current -1 1 mA CS T Junction temperature -25 125 C J Note 1: This IC contains a zener clamp structure between the chip V and COM which has a nominal breakdown CC voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the V specified in the Electrical Characteristics section. CLAMP Note 2: Enough current should be supplied into the V pin to keep the internal 15.6V zener clamp diode on this pin CC regulating its voltage, V . CLAMP 2 www.irf.com