Data Sheet No. PD60198 revF IR2166(S) & (PbF) PFC & BALLAST CONTROL IC Features Programmable dead time PFC, Ballast control and half-bridge driver in one IC Internal ignition ramp Critical conduction mode boost type PFC Internal fault counter No PFC current sense resistor required DC bus under-voltage reset Programmable preheat frequency Shutdown pin with hysteresis Programmable preheat time Internal 15.6V zener clamp diode on Vcc Programmable run frequency Micropower startup (150 A) Programmable over-current protection Latch immunity and ESD protection Programmable end-of-life protection Parts also available LEAD-FREE Description Packages The IR2166 is a fully integrated, fully protected 600V ballast control IC designed to drive all types of fluorescent lamps. PFC circuitry operates in critical conduction mode and provides for high PF, low THD and DC Bus regulation. The IR2166 features in- clude programmable preheat and run frequencies, programmable preheat time, pro- 16-Lead SOIC grammable dead-time, programmable over-current protection, and programmable end- (narrow body) of-life protection. Comprehensive protection features such as protection from failure of a lamp to strike, filament failures, end-of-life protection, DC bus undervoltage reset as well as an automatic restart function, have been included in the design. The IR2166 is available in both 16-lead PDIP and 16-lead (narrow body) SOIC packages. 16-Lead PDIP IR2166 Application Diagram D BUS + Rectified AC Line R BUS R SUPPLY C VDC R VBUS HO GHS 1 16 M1 R VDC CPH CBLOCK L VS RES 2 15 + C C C R VB BOOT PH T RT BUS 3 14 C SNUB D RPH VCC BOOT D CP1 4 13 R 5 R C C C T PH COM VCC1 VCC2 CT 5 12 R C 3 R RES 6 C R COMP LO GLS COMP M2 76 11 D CP2 R R R 1 ZX CS 2 7 DZ COMP 7 10 D PFC SD/EOL 1 R 4 M3 9 8 R GPFC R CS C C C D D C R SD1 CS SD2 2 3 EOL 8 - Rectified AC Line *Please note that this data sheet contains advanced information that could change before the product is released to production. www.irf.com 1 IR2166 +IR2166 & (PbF) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V High side floating supply voltage -0.3 625 B V High side floating supply offset voltage V - 25 V + 0.3 S B B V High side floating output voltage V - 0.3 V + 0.3 V HO S B V Low side output voltage -0.3 V + 0.3 LO CC V PFC gate driver output voltage -0.3 V + 0.3 PFC CC I Maximum allowable output current (HO, LO, PFC) -500 500 OMAX mA due to external power transistor miller effect V V pin voltage -0.3 V + 0.3 BUS BUS CC V V CT pin voltage -0.3 V + 0.3 CT CC I CPH pin current -5 5 CPH mA I RPH pin current -5 5 RPH V RPH pin voltage -0.3 V + 0.3 V RPH CC I RT pin current -5 5 mA RT V RT pin voltage -0.3 V + 0.3 RT CC V V Current sense pin voltage -0.3 5.5 CS I Current sense pin current -5 5 CS I Shutdown pin current -5 5 SD/EOL I Supply current (Note 1) -20 20 CC mA I PFC inductor current, zero crossing detection input current -5 5 ZX I PFC error compensation current -5 5 COMP dV/dt Allowable offset voltage slew rate -50 50 V/ns P Package power dissipation T +25C (16-Pin PDIP) 1.80 D A W P = (T -T )/Rth (16-Pin SOIC) 1.40 D JMAX A JA Rth Thermal resistance, junction to ambient (16-Pin PDIP) 70 JA o C/W (16-Pin SOIC) 86 T Junction temperature -55 150 J o T Storage temperature -55 150 C S T Lead temperature (soldering, 10 seconds) 300 L Note 1: This IC contains a zener clamp structure between the chip V and COM which has a nominal breakdown CC voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the V specified in the Electrical Characteristics section. CLAMP 2 www.irf.com