Data Sheet No. PD60192 revG ( ) IMPORTANT NOTICE: IR2171/IR2172 S For new designs we recommend IRs new products IR2175, IR2177, IR21771, IR2277 or IR22771. LINEAR CURRENT SENSING IC Features Product Summary Floating channel up to +600V V 600Vmax Monolithic integration OFFSET Linear current feedback through shunt resistor I 1mA QBS Direct digital PWM output for easy interface V +/-260mVmax in Low IQBS allows the boot strap power supply o Independent fast overcurrent trip signal Gain temp.drift 20ppm/ C (typ.) High common mode noise immunity f 40kHz (typ.) o Input overvoltage protection for IGBT short circuit condition Overcurrent trip 1.5usec (typ) Open Drain outputs signal delay (IR2172) Overcurrent trip level +/-260mV (typ.) Description IR2171/IR2172 are monolithic current sensing IC Packages designed for motor drive applications. It senses the motor phase current through an external shunt resistor, converts from analog to digital signal, and transfers the signal to the low side. IRs proprietary high voltage iso- lation technology is implemented to enable the high bandwidth signal processing. The output format is dis- crete PWM to eliminate need for the A/D input interface for the IR2172. The dedicated overcurrent trip (OC) sig- 8-Lead SOIC nal facilitates IGBT short circuit protection. The open- 8-Lead PDIP drain outputs make easy for any interface from 3.3V to 15V. Block Diagram Up to 600V 15V VCC V+ PWM Output PO V- IR2171/ IR2172 GND COM VB VS Overcurrent NC (OC 2172) To Motor Phase (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.IR2171/IR2172 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V High side offset voltage -0.3 600 S V High side floating supply voltage -0.3 25 BS V Low side and logic fixed supply voltage -0.3 25 CC V V Maximum input voltage between V V -5 5 IN IN+ and IN- V Digital PWM output voltage COM -0.3 VCC +0.3 PO V Overcurrent output voltage (IR2172) COM -0.3 VCC +0.3 OC V V input voltage (note 1) V -5 V IN- IN- S B+ 0.3 dV/dt Allowable offset voltage slew rate 50 V/ns P Package power dissipation T +25C 8 lead SOIC .625 D A W 8 lead PDIP 1.0 Rth Thermal resistance, junction to ambient 8 lead SOIC 200 JA C/W 8 lead PDIP 125 T Junction temperature 150 J C T Storage temperature -55 150 S T Lead temperature (soldering, 10 seconds) 300 L Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins. Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom- mended conditions. Symbol Definition Min. Max. Units V High side floating supply voltage V +13.0 V +20 B S S V High side floating supply offset voltage 0.3 600 S V Digital PWM output voltage COM VCC PO V V Overcurrent output voltage COM VCC OC V Low side and logic fixed supply voltage 9.5 20 CC V Input voltage between V and V -260 +260 mV IN IN+ IN- T Ambient temperature -40 125 C A www.irf.com 2