IRS2166D Data Sheet No. PD60292 IRS2166D(S)PbF PFC + BALLAST CONTROL IC Features End-of-life window comparator pin PFC, ballast control and 600 V half-bridge driver in one IC Internal up/down current-sense fault counter Critical-conduction mode boost-type PFC DC bus undervoltage reset Programmable half-bridge over-current protection Lamp removal/auto-restart shutdown pin Programmable preheat frequency Internal bootstrap MOSFET Programmable deadtime Internal 15.6 V zener clamp diode on V CC Programmable preheat time Micropower startup (250 A) Programmable run frequency Latch immunity and ESD protection RoHS compliant Description System Features The IRS2166D is a fully integrated, fully protected 600 V Improved V regulation voltage tolerance BUS ballast control IC designed to drive all types of fluorescent Increased SD pin shutdown voltage threshold hysteresis lamps. The IRS2166D is based on the popular IR2166 Changed EOL pin internal 2.0 V bias to a +/-10 A OTA control IC with additional improvements to increase ballast Internal bootstrap MOSFET performance. PFC circuitry operates in critical conduction mode and provides high PF, low THD, and DC bus Packages regulation. The IRS2166D features include programmable preheat and run frequencies, programmable preheat time, and programmable end-of-life protection. Comprehensive protection features such as protection from failure of a lamp to strike, filament failures, end-of-life protection, DC bus undervoltage reset as well as an automatic restart function, have been included in the design. 16-Lead PDIP 16-Lead SOIC IRS2166DPbF IRS2166DSPbF Application Diagram (Typical Only) LPFC DPFC RBUS F1 RV1 RSUPPLY L RVDC C1 L1 RH CVDC N VBUS HO BR1 O MHS CBUS 1 16 LRES CDC CPH CPH VS 2 15 GND CBOOT RDC RT VB CSNUB CY 3 14 RT DCP2 RPH VCC REOL1 4 13 CVCC1 C2 CRES CVCC2 RPH CT COM CT 5 12 REOL2 RL CCOMP COMP LO O ML 6 11 S RLIM RPU RZX ZX CS REOL3 DCP1 7 10 DSD SD/EOL PFC RSD 8 9 DCOMP IC BALLAST CEOL CSD1 CSD2 CCS RCS REOL4 RPFC MPFC Note: Thick traces represent high-frequency, high-current paths. Lead lengths should be minimized and power and IC grounds should be separated to avoid high-frequency noise problems. www.irf.com Page 1 IRS2166D(S)PbF Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V High-side floating supply voltage -0.3 625 B V High-side floating supply offset voltage V 25 V + 0.3 S B B V High-side floating output voltage V - 0.3 V + 0.3 V HO S B V Low-side output voltage -0.3 V + 0.3 LO CC V PFC gate driver output voltage -0.3 V + 0.3 PFC CC Maximum allowable output current (HO, LO, PFC) due to external I -500 500 mA O,MAX power transistor miller effect V VBUS pin voltage -0.3 V + 0.3 BUS CC V CPH pin voltage -0.3 V + 0.3 CPH CC V V RT pin voltage -0.3 V + 0.3 RT CC V RPH pin voltage -0.3 V + 0.3 RPH CC I RT pin current -5 5 RT mA I RPH pin current -5 5 RPH V CT pin voltage -0.3 V + 0.3 V CT CC I COM pin current -5 5 COMP I ZX pin current -5 5 mA ZX I VCC pin current (see Note 1) -25 25 CC V SD/EOL pin voltage -0.3 V + 0.3 V SD/EOL CC I SD/EOL pin current -5 5 mA SD/EOL V CS pin voltage -0.3 V + 0.3 V CS CC I CS pin current -5 5 mA CS dV/dt Allowable V offset voltage slew rate -50 50 V/ns S (16-Pin DIP) --- 1.8 Package power dissipation T +25 C A P W D -T )/R PD = (T JMAX A JA (16-Pin SOIC) --- 1.4 (16-Pin DIP) --- 70 R Thermal resistance, junction to ambient C/W JA (16-Pin SOIC) --- 82 T Junction temperature -55 150 J T Storage temperature -55 150 C S T Lead temperature (soldering, 10 seconds) --- 300 L Note 1: This IC contains a zener clamp structure between the chip V and COM which has a nominal breakdown CC voltage of 15.6 V. This supply pin should not be driven by a DC, low impedance power source greater than the V CLAMP specified in the electrical characteristics section. Recommended Operating Conditions For proper operation the device should be used within the recommended conditions. Symbol Definition Min. Max. Units V -V High side floating supply voltage V V B S BSUV+ CLAMP V Steady state high-side floating supply offset voltage -1 600 V S V Supply voltage V V CC CCUV+ CLAMP I V supply current (see Note 2) Note 2 20 mA CC CC C CT pin capacitance 220 --- pF T I SD/EOL pin current SD/EOL I CS pin current -1 1 mA CS I ZX pin current ZX T Junction temperature -25 125 C J Note 2: Enough current should be supplied into the V pin to keep the internal 15.6 V zener clamp diode on this pin CC regulating its voltage, V . CLAMP www.irf.com Page 2