Data Sheet No. PD60310 IRS2168D(S)PbF ADVANCED PFC + BALLAST CONTROL IC Features Fixed internal 1.6 s HO and LO deadtime PFC, ballast control and 600 V half-bridge driver in one IC Voltage-controlled oscillator (VCO) Critical-conduction mode boost-type PFC End-of-life window comparator pin Programmable PFC over-current protection Internal 65-event current sense up/down fault counter Programmable half-bridge over-current protection DC bus undervoltage reset Programmable preheat frequency Lamp removal/auto-restart shutdown pin Programmable preheat time Internal bootstrap MOSFET Programmable ignition ramp Internal 15.6 V Zener clamp diode on V cc Programmable run frequency Micropower startup (250 A) Closed-loop ignition current regulation Latch immunity and ESD protection RoHs compliant System Features Description One-chip ballast control solution The IRS2168D is a fully integrated, fully protected 600 V Wide range PFC for universal input and multi-lamp ballasts ballast control IC designed to drive all types of fluorescent Ultra low THD lamps. The IRS2168D is based on the popular IR2166 Closed-loop ignition regulation for reliable lamp ignition control IC with additional improvements to increase ballast End-of-Life window comparator with internal OTA performance. The PFC circuitry operates in critical Lamp removal/auto-restart function conduction mode and provides high PF, low THD and DC Fault counter for robust noise immunity bus regulation. The IRS2168D features include Brown-out protection and reset programmable preheat and run frequencies, programmable Internal bootstrap MOSFET preheat time, programmable PFC over-current protection, closed-loop half-bridge ignition current regulation, and Packages programmable end-of-life protection. Comprehensive protection features such as protection from failure of a lamp to strike, filament failures, end-of-life protection, DC bus undervoltage reset as well as an automatic restart function, have been included in the design. 16-Lead PDIP 16-Lead SOIC IRS2168DPbF IRS2168DSPbF Application Diagram (Typical Only) D BUS + Rectified AC Line R VBUS1 R SUPPLY C R VBUS CPH R VBUS HO GHS 1 16 M1 R C L VBUS C BLOCK PH RES CPH VS 2 15 + C C BOOT C VCO VCO VB BUS 3 14 C SNUB R D RPH CP1 R VCC FMIN FMIN 13 4 R 6 C C C COMP COM VCC1 VCC2 COMP 5 12 C RES R R R 4 7 R ZX 1 LO GLS 6 11 M2 7 D CP2 R R R 8 GPFC PFC CS 3 M3 7 10 D R OC SD/EOL 1 R 2 5 8 9 R CS R OC C OC C D D C C SD2 2 3 C SD1 CS EOL R 9 - Rectified AC Line * Please note that this datasheet contains advanced information that could change before the product is released to production. www.irf.com Page 1 IRS2168D +IRS2168D(S)PbF Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defned positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V V pin high-side floating supply voltage -0.3 625 B B V V pin high-side floating supply offset voltage V 25 V + 0.3 S S B B V V HO pin high-side floating output voltage V - 0.3 V + 0.3 S B HO V LO pin low-side output voltage LO -0.3 V + 0.3 CC V PFC gate driver output voltage PFC Maximum allowable output current (HO, LO, PFC) due to external I O, -500 500 MAX power transistor miller effect mA I V current (see Note 1) -25 25 CC CC V VBUS pin voltage BUS V CPH pin voltage CPH V COMP pin voltage COMP V ZX pin voltage -0.3 V + 0.3 V ZX CC V OC pin voltage OC V SD/EOL pin voltage SD/EOL V CS pin voltage CS V VCO pin voltage -0.3 6 V VCO I CPH pin current CPH I VCO pin current VCO I FMIN pin current FMIN I COMP pin current COMP -5 5 mA I ZX pin current ZX I OC pin current OC I SD/EOL pin current SD/EOL I CS pin current CS dV/dt Allowable V pin offset voltage slew rate -50 50 V/ns S Package power dissipation T +25 C (16-Pin DIP) --- 1.8 A P W D PD = (T T )/R - (16-Pin SOIC) --- 1.4 JMAX JA A (16-Pin DIP) --- 70 R Thermal resistance, junction to ambient C/W JA (16-Pin SOIC) --- 86 T Junction temperature -55 150 J T Storage temperature -55 150 S C T Lead temperature (soldering, 10 seconds) --- 300 L Note 1: This IC contains a Zener clamp structure between the chip V and COM which has a nominal breakdown CC voltage of 15.6 V. This supply pin should not be driven by a DC, low impedance power source greater than the V CLAMP specified in the Electrical Characteristics section. www.irf.com Page 2