X-On Electronics has gained recognition as a prominent supplier of S71KS512SC0BHB000 Multichip Packages across the USA, India, Europe, Australia, and various other global locations. S71KS512SC0BHB000 Multichip Packages are a product manufactured by Infineon. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

S71KS512SC0BHB000 Infineon

S71KS512SC0BHB000 electronic component of Infineon
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Part No.S71KS512SC0BHB000
Manufacturer: Infineon
Category: Multichip Packages
Description: Multichip Packages Nor
Datasheet: S71KS512SC0BHB000 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 19.404 ea
Line Total: USD 19.4 
Availability - 677
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
677
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 19.404
10 : USD 17.501
25 : USD 17.248
50 : USD 16.907
100 : USD 16.621
250 : USD 16.599
676 : USD 16.577
2704 : USD 16.566

   
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We are delighted to provide the S71KS512SC0BHB000 from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the S71KS512SC0BHB000 and other electronic components in the Multichip Packages category and beyond.

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S71KS512SC0 S71KL256SC0 SUPPLEMENT S71KL512SC0 HyperFlash and HyperRAM Multi-Chip Package 1.8V/3V HyperFlash and HyperRAM Multi-Chip Package 3 V Distinctive Characteristics HyperFlash and HyperRAM in Multi-Chip Package (MCP) Optional Signals 1.8V, 512 Mb HyperFlash and 64 Mbit HyperRAM Reset (S71KS512SC0) INT output to generate external interrupt 3.0V, 512 Mb HyperFlash and 64 Mbit HyperRAM Busy to Ready Transition (S71KL512SC0) RSTO Output to generate system level Power-On Reset 3.0V, 256 Mb HyperFlash and 64 Mbit HyperRAM (POR) (S71KL256SC0) User configurable RSTO Low period FBGA 24-ball, 6 8 1.0 mm package High Performance HyperBus Interface Double-Data Rate (DDR) 1.8V I/O, 12 bus signals Two data transfers per clock Differential clock (CK/CK ) Up to 166-MHz clock rate (333 MB/s) at 1.8V V CC 3.0V I/O, 11 bus signals Up to 100-MHz clock rate (200 MB/s) at 3.0V V CC Single ended clock (CK) Chip Select (CS ) 8-bit data bus (DQ 7:0 ) Read-Write Data Strobe (RWDS) Bidirectional Data Strobe/Mask Output at the start of all transactions to indicate refresh latency Output during read transactions as Read Data Strobe Input during write transactions as Write Data Mask (Hyper- RAM only) Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 002-03902 Rev. *D Revised February 23, 2017S71KS512SC0 S71KL256SC0 SUPPLEMENT S71KL512SC0 Contents General Description .........................................................3 Ordering Part Numbers .................................................. 11 HyperBus MCP Family with HyperFlash Valid Combinations - Standard .................................. 11 and HyperRAM ............................................................3 Valid Combinations Automotive Grade / HyperBus MCP 3 V Signal Descriptions .........................4 AEC-Q100 .................................................................12 HyperBus MCP Block Diagram .......................................5 Document History Page ................................................. 13 Physical Interface .............................................................6 Sales, Solutions, and Legal Information ...................... 14 HyperBus MCP FBGA 24-Ball, Worldwide Sales and Design Support ....................... 14 5x5 Array Footprint ......................................................6 Products ....................................................................14 Physical Diagram ........................................................7 PSoC Solutions ...................................................... 14 Electrical Specifications ..................................................8 Cypress Developer Community ................................. 14 Absolute Maximum Ratings .........................................8 Technical Support ..................................................... 14 DC Characteristics ......................................................8 Document Number: 002-03902 Rev. *D Page 2 of 14

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION
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