X-On Electronics has gained recognition as a prominent supplier of ISP130301-BM-ST Bluetooth Modules - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ISP130301-BM-ST Bluetooth Modules - 802.15.1 are a product manufactured by Insight SiP. We provide cost-effective solutions for Bluetooth Modules - 802.15.1, ensuring timely deliveries around the world.

ISP130301-BM-ST Insight SiP

Name: ISP130301-BM-ST
Brand: Insight SiP
SKU: ISP130301BMST_Insight SiP
Availability: OutOfStock
Rating: 5 (11 reviews)

ISP130301-BM-ST electronic component of Insight SiP

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Part No.	ISP130301-BM-ST
Manufacturer:	Insight SiP
Category:	Bluetooth Modules - 802.15.1
Description:	Bluetooth Modules (802.15.1) ISP130301-BM BLE Module with Antenna 256 KFlash/ 16K Ram - standard tray or cut and tape
Datasheet:	ISP130301-BM-ST Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

ISP130301-BM-ST More Buying Options & Price Grid(s)

Availability	Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 15.3605 10 : USD 13.7579 25 : USD 12.6709 50 : USD 12.5831 100 : USD 12.0011 250 : USD 11.7157 500 : USD 10.9361 1000 : USD 10.9361 2500 : USD 10.6616	N/A Obsolete

0 MOQ : 1 Multiples : 1	1 : USD 18.7388 3 : USD 17.0574	N/A Obsolete

We are delighted to provide the ISP130301-BM-ST from our Bluetooth Modules - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ISP130301-BM-ST and other electronic components in the Bluetooth Modules - 802.15.1 category and beyond.

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Additional Infomation About Product

ISP130301 (1) High Performance Bluetooth V4.2 & ANT Low Energy Module with MCU and Antenna This tiny LGA module, 8 x 11 x 1.2 mm, is based on the nRF51 series Chip. Its powerful Cortex M0 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. All chip digital and analogue interfaces are available and give optimum capabilities for sensor integration. Key Features Applications Single Mode BLE V4.2 Compliant Connected sensors for medical devices, healthcare, sport, fitness, industrial (1) ANT+ protocol in option IoT applications, connected objects IPv6 Connectivity Wearable technology ECDH Encryption Home automation Based on Nordic Semiconductor nRF51 Beacons 2.4GHz low energy RF Transceiver 32bit ARM Cortex M0 CPU 256 kB Flash 16 kB or 32 kB SRAM in option 30 GPIOs including 6 ADC inputs and / or Certifications 2 ADC reference Ultra Low Power Consumption Bluetooth SIG certified QDL listing Single 1.8 to 3.6 V supply Fully CE certified module Very small size 8.0 x 11.0 x 1.2 mm Fully FCC certified module Temperature -40 to +85 C Fully IC certified module Fully integrated RF matching and Antenna Fully IMOC certified module Integrated 16 MHz Clock Fully TELEC certified module Integrated 32.768 kHz Synchronization RoHS compliant DC-DC loading circuit fully integrated January 16, 2017 Document Ref: isp ble DS130301 R13.docx Page 1/24 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice. BLE MODULE ISP130301 Contents 1. Block Diagram ............................................................................................................................................................ 3 2. Specifications ............................................................................................................................................................. 4 2.1. Absolute Maximum Ratings ........................................................................................................................... 4 2.2. Operating Conditions ..................................................................................................................................... 4 2.3. Power Consumption ...................................................................................................................................... 5 2.4. Clock Sources ............................................................................................................................................... 5 2.5. Radio Specifications ...................................................................................................................................... 5 2.6. Electrical Schematic ...................................................................................................................................... 8 3. Pin Description ........................................................................................................................................................... 9 4. Mechanical Outlines ................................................................................................................................................ 11 4.1. Mechanical Dimensions .............................................................................................................................. 11 4.2. SMT Assembly Guidelines .......................................................................................................................... 12 4.3. Antenna Keep-Out Zone ............................................................................................................................. 13 5. Product Development Tools .................................................................................................................................. 14 5.1. Hardware ..................................................................................................................................................... 14 5.2. Firmware ...................................................................................................................................................... 14 5.3. Development Tools ..................................................................................................................................... 15 6. Reference Designs .................................................................................................................................................. 16 6.1. Sensor Board Design .................................................................................................................................. 16 6.2. Beacon Design ............................................................................................................................................ 17 7. Packaging & Ordering information ....................................................................................................................... 18 7.1. Marking ........................................................................................................................................................ 18 7.2. Prototype Packaging ................................................................................................................................... 18 7.3. Jedec Trays ................................................................................................................................................. 18 7.4. Tape and Reel ............................................................................................................................................. 19 7.5. Ordering Information ................................................................................................................................... 20 8. Storage & Soldering information .......................................................................................................................... 21 8.1. Storage and Handling .................................................................................................................................. 21 8.2. Moisture Sensitivity ..................................................................................................................................... 21 8.3. Soldering information .................................................................................................................................. 22 9. Quality & User information..................................................................................................................................... 23 9.1. Certifications ................................................................................................................................................ 23 9.2. USA User information ............................................................................................................................... 23 9.3. Canada User information ......................................................................................................................... 23 9.4. Discontinuity ................................................................................................................................................ 24 9.5. Disclaimer .................................................................................................................................................... 24 January 16, 2017 Document Ref: isp ble DS130301 R13.docx Page 2/24 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.

HS Compliance

Tariff Desc

8542.3 - Electronic integrated circuits:
8542.31.00 -- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
.Digital:
61 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
62 No ..Other
63 No Hybrid integrated circuits
64 No Multichip integrated circuits

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Manufacturer Insight SiP Insight SiP
Product Category Bluetooth Modules - 802.15.1 Bluetooth Modules - 802.15.1
RoHS - XON Y Y
Series Isp130301 Isp130301
Protocol Bluetooth 4.2 Bluetooth 4.2
Class Bluetooth Low Energy (Ble) Bluetooth Low Energy (Ble)
Interface Type I2c, Spi, Uart I2c, Spi, Uart
Output Power 4 dBm 4 dBm
Data Rate 2 Mb/S 2 Mb/S
Frequency 2.4 GHz 2.4 GHz
Operating Supply Voltage 1.9 v to 3.6 V 1.9 v to 3.6 V
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Packaging Tray Tray
Antenna Integrated Integrated
Frequency Range 2.402 GHz to 2.48 GHz 2.402 GHz to 2.48 GHz
Height 1.2 mm 1.2 mm
Length 11 mm 11 mm
Product Bluetooth Modules Bluetooth Modules
Sensitivity - 93 Dbm - 93 Dbm
Width 8 mm 8 mm
Brand Insight Sip Insight Sip
Mounting Style Smd/Smt Smd/Smt
Product Type Bluetooth Modules Bluetooth Modules
Factory Pack Quantity : 10 10
Subcategory Wireless & Rf Modules Wireless & Rf Modules
Supply Current Receiving 12.6 mA 12.6 mA
Supply Current Transmitting 10.5 mA , 16 mA 10.5 mA , 16 mA
Version Bluetooth 4.2 Bluetooth 4.2
Hts Code 8517620090 8517620090
Taric 8517620000 8517620000