IS43/46TR16128C, IS43/46TR16128CL,
IS43/46TR82560C, IS43/46TR82560CL
256Mx8, 128Mx16 2Gb DDR3 SDRAM JUNE 2017
FEATURES
Standard Voltage: V and V = 1.5V 0.075V Refresh Interval:
DD DDQ
7.8 us (8192 cycles/64 ms) Tc= -40C to 85C
Low Voltage (L): V and V = 1.35V + 0.1V, -0.067V
DD DDQ
3.9 us (8192 cycles/32 ms) Tc= 85C to 105C
- Backward compatible to 1.5V
Partial Array Self Refresh
High speed data transfer rates with system
frequency up to 933 MHz
Asynchronous RESET pin
8 internal banks for concurrent operation
TDQS (Termination Data Strobe) supported (x8
only)
8n-Bit pre-fetch architecture
OCD (Off-Chip Driver Impedance Adjustment)
Programmable CAS Latency
Dynamic ODT (On-Die Termination)
Programmable Additive Latency: 0, CL-1,CL-2
Driver strength : RZQ/7, RZQ/6 (RZQ = 240 )
Programmable CAS WRITE latency (CWL) based
on tCK
Write Leveling
Programmable Burst Length: 4 and 8
Up to 200 MHz in DLL off mode
Programmable Burst Sequence: Sequential or
Operating temperature:
Interleave
Commercial (T = 0C to +95C)
C
BL switch on the fly
Industrial (T = -40C to +95C)
C
Auto Self Refresh(ASR)
Automotive, A1 (T = -40C to +95C)
C
Self Refresh Temperature(SRT)
Automotive, A2 (T = -40C to +105C)
C
ADDRESS TABLE
OPTIONS
Parameter 256Mx8 128Mx16
Configuration:
Row Addressing A0-A14 A0-A13
256Mx8
Column Addressing A0-A9 A0-A9
128Mx16
Bank Addressing BA0-2 BA0-2
Package:
Page size 1KB 2KB
96-ball BGA (9mm x 13mm) for x16
Auto Precharge
78-ball BGA (8mm x 10.5mm) for x8 A10/AP A10/AP
Addressing
BL switch on the fly A12/BC# A12/BC#
SPEED BIN
Speed Option 15H 125K 107M
Units
JEDEC Speed Grade DDR3-1333H DDR3-1600K DDR3-1866M
CL-nRCD-nRP 9-9-9 11-11-11 13-13-13 tCK
tRCD,tRP(min) 13.5 13.75 13.91 ns
Note: Faster speed options are backward compatible to slower speed options.
Copyright 2017 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product
can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use
in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. www.issi.com 1
Rev. E
06/12/2017 IS43/46TR16128C, IS43/46TR16128CL,
IS43/46TR82560C, IS43/46TR82560CL
1. DDR3 PACKAGE BALLOUT
1.1 DDR3 SDRAM package ballout 78-ball BGA x8
1 2 3 4 5 6 7 8 9
A
VSS VDD NC NU/TDQS# VSS VDD
B
VSS VSSQ DQ0 DM/TDQS VSSQ VDDQ
C
VDDQ DQ2 DQS DQ1 DQ3 VSSQ
D
VSSQ DQ6 DQS# VDD VSS VSSQ
E VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ
1
F
NC VSS RAS# CK VSS NC
G
ODT VDD CAS# CK# VDD CKE
H
NC CS# WE# A10/AP ZQ NC
J
VSS BA0 BA2 NC(A15) VREFCA VSS
K
VDD A3 A0 A12/BC# BA1 VDD
L
VSS A5 A2 A1 A4 VSS
M
VDD A7 A9 A11 A6 VDD
N
VSS RESET# A13 A14 A8 VSS
Note:
NC balls have no internal connection. NC(A15) is one of NC pins and reserved for higher densities.
Integrated Silicon Solution, Inc. www.issi.com 2
Rev. E
06/12/2017