DHG60C600HB IXYS

DHG60C600HB preliminary V = 600 V RRM Sonic Fast Recovery Diode I = 2x 30 A FAV t = 40 ns rr High Performance Fast Recovery Diode Low Loss and Soft Recovery Common Cathode Part number DHG60C600HB Backside: cathode 1 2 3 Features / Advantages: Applications: Package: TO-247 Planar passivated chips Antiparallel diode for high frequency Industry standard outline Very low leakage current switching devices RoHS compliant Very short recovery time Antisaturation diode Epoxy meets UL 94V-0 Improved thermal behaviour Snubber diode Very low Irm-values Free wheeling diode Very soft recovery behaviour Rectifiers in switch mode power Avalanche voltage rated for reliable supplies (SMPS) operation Uninterruptible power supplies (UPS) Soft reverse recovery for low EMI/RFI Low Irm reduces: - Power dissipation within the diode - Turn-on loss in the commutating switch Disclaimer Notice Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20200213b 2020 IXYS all rights reservedDHG60C600HB preliminary Ratings Fast Diode Symbol Definition Conditions min. typ. max. Unit T = 25C 600 V V max. non-repetitive reverse blocking voltage RSM VJ T = 25C 600 V V max. repetitive reverse blocking voltage RRM VJ reverse current, drain current I V = 6 0 0 V T = 25C 30 A R R VJ V = 6 0 0 V T = 1 2 5 C 2 mA R VJ forward voltage drop V I = 3 0 A T = 25C 2.26 V F F VJ I = 6 0 A 3.11 V F T = C 2.21 V I = 3 0 A 125 F VJ I = 6 0 A 3.17 V F average forward current T = 8 5 C T = 1 5 0 C 30 A I FAV C VJ rectangular d = 0.5 V T = 1 5 0 C 1.17 V threshold voltage F0 VJ for power loss calculation only slope resistance r 31 m F thermal resistance junction to case 0.7 K/W R thJC thermal resistance case to heatsink K/W R 0.3 thCH P total power dissipation T = 25C 180 W tot C max. forward surge current t = 10 ms (50 Hz), sine V = 0 V T = 45C 200 A I R FSM VJ junction capacitance V = 4 0 0 V f = 1 MHz T = 25C 16 pF C J R VJ I max. reverse recovery current T = 25 C 13 A RM VJ I = 30 A V = 300 V T = 125C 17 A F R VJ reverse recovery time -di /dt = 600A/s T = 25 C 40 ns t rr F VJ T = 125C 60 ns VJ IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20200213b 2020 IXYS all rights reserved