IXA12IF1200HB IXYS

IXA12IF1200HB preliminary V= 1200V CES XPT IGBT I= 20A C25 VV= 1.8 CE(sat) Copack Part number IXA12IF1200HB Backside: collector 2(C) (G) 1 3(E) Features / Advantages: Applications: Package: TO-247 Easy paralleling due to the positive temperature AC motor drives Industry standard outline coefficient of the on-state voltage Solar inverter RoHS compliant Rugged XPT design (Xtreme light Punch Through) Medical equipment Epoxy meets UL 94V-0 results in: Uninterruptible power supply - short circuit rated for 10 sec. Air-conditioning systems - very low gate charge Welding equipment - low EMI Switched-mode and resonant-mode - square RBSOA 3x Ic power supplies Thin wafer technology combined with the XPT design Inductive heating, cookers results in a competitive low VCE(sat) Pumps, Fans SONIC diode - fast and soft reverse recovery - low operating forward voltage IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20110330a 2011 IXYS all rights reservedIXA12IF1200HB preliminary Ratings IGBT Symbol Definition Conditions min. typ. max. Unit collector emitter voltage V T = 25C 1200 V VJ CES max. DC gate voltage V 20 V GES max. transient gate emitter voltage V 30 V GEM collector current I T = 25C 20 A C25 C I T = 100 C 13 A C C100 total power dissipation P T = 25C 85 W tot C collector emitter saturation voltage V I = A V = 15 V10 T = 25C 1.8 2.1 V CE(sat) CGE VJ T = 125 C 2.1 V VJ gate emitter threshold voltage V I = 0.3 mA V = V T = 25C 5.4 5.9 6.5 V VJ GE(th) CGECE collector emitter leakage current I V = V V = 0 V T = 25C 0.1 mA CES CE CES GE VJ T = 125 C 0.1 mA VJ gate emitter leakage current I V = 20 V 500 nA GES GE total gate charge Q V = 60 0 V V = 15 V I = 10 A 27 nC G(on) CE GE C turn-on delay time t 70 ns d(on) current rise time t 40 ns r inductive load T = 125 C VJ turn-off delay time t 250 ns d(off) V = 600 V I = 10 A CE C current fall time t 100 ns f V = 15 V R = 10 0 GE G turn-on energy per pulse E 1.1 mJ on turn-off energy per pulse E 1.1 mJ off reverse bias safe operating area RBSOA V = 15 V R = 10 0 T = 125 C GE G VJ A I V = 1200 V 30 CM CEmax short circuit safe operating area SCSOA V = 900 V CEmax short circuit duration t SC V = 900 V V = 15 V T = 125 C 10 s CE GE VJ short circuit current I R = 100 non-repetitive 40 A SC G thermal resistance junction to case R 1.5 K/W thJC thermal resistance case to heatsink K/W R 0.25 thCH Diode max. repetitive reverse voltage V T = 25C 1200 V VJ RRM forward current A I T = 25C 22 F25 C I T = 10 0C 14 A F 100 C forward voltage V I = 10 A T = 25C 2.20 V F F VJ T = 125C 1.95 V VJ reverse current V = V mA I T = 25C * R R RRM VJ * not applicable, see Ices value above T = 125C * mA VJ reverse recovery charge Q 1.3 C rr V = 600 V R max. reverse recovery current I 10.5 A RM -di /dt = -25 0 A/s T = 125C F VJ reverse recovery time t 350 ns rr I = 10 A V = 0 V FGE reverse recovery energy E 0.35 mJ rec thermal resistance junction to case R 1.8 K/W thJC thermal resistance case to heatsink R K/W 0.25 thCH IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20110330a 2011 IXYS all rights reserved