X-On Electronics has gained recognition as a prominent supplier of IXFN73N30 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. IXFN73N30 Discrete Semiconductor Modules are a product manufactured by IXYS. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

IXFN73N30 IXYS

IXFN73N30 electronic component of IXYS
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See Product Specifications
Part No.IXFN73N30
Manufacturer: IXYS
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules 300V 73A
Datasheet: IXFN73N30 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 94.4244 ea
Line Total: USD 94.42 
Availability - 5
Ship by Thu. 22 Aug to Wed. 28 Aug
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5
Ship by Thu. 22 Aug to Wed. 28 Aug
MOQ : 1
Multiples : 1
1 : USD 93.675
100 : USD 20.3
250 : USD 18.5125
500 : USD 17.3125
1000 : USD 15.8875

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Vgs - Gate-Source Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Technology
Configuration
Brand
Forward Transconductance - Min
Transistor Polarity
Channel Mode
Fall Time
Id - Continuous Drain Current
Pd - Power Dissipation
Rds On - Drain-Source Resistance
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Vds - Drain-Source Breakdown Voltage
Vgs - Gate-Source Breakdown Voltage
Height
Length
Transistor Type
Width
Number Of Channels
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Tradename
Typical Turn-On Delay Time
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We are delighted to provide the IXFN73N30 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IXFN73N30 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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TM V I R HiPerFET DSS D25 DS(on) IXFK 73 N 30 300 V 73 A 45 m Power MOSFETs IXFN 73 N 30 300 V 73 A 45 m t 200 ns rr N-Channel Enhancement Mode Avalanche Rated, High dv/dt, Low t rr TO-264 AA (IXFK)TO-264 AA (IXFK)TO-264 AA (IXFK)TO-264 AA (IXFK)TO-264 AA (IXFK) Symbol Test Conditions Maximum Ratings IXFK IXFN V T = 25C to 150C 300 300 V DSS J V T = 25C to 150C R = 1 M 300 300 V (TAB) DGR J GS G D V Continuous 20 20 V S GS V Transient 30 30 V GSM miniBLOC, SOT-227 B (IXFN)miniBLOC, SOT-227 B (IXFN) miniBLOC, SOT-227 B (IXFN)miniBLOC, SOT-227 B (IXFN)miniBLOC, SOT-227 B (IXFN) E153432 E153432 E153432 I T = 25C 73 73 A E153432 E153432 D25 C S I T = 25C, pulse width limited by T 292 292 A DM C JM G I T = 25C 40 40 A AR C E T = 25C 30 30 mJ AR C S dv/dt I I , di/dt 100 A/ s, V V , 5 5 V/ns S DM DD DSS D T 150C, R = 2 W J G P T = 25C 500 520 W G = Gate D = Drain D C S = Source TAB = Drain T -55 ... +150 C J Either Source terminal at miniBLOC can be used T 150 C JM as Main or Kelvin Source T -55 ... +150 C stg Features International standard packages T 1.6 mm (0.063 in) from case for 10 s 300 - C L JEDEC TO-264 AA, epoxy meet V 50/60 Hz, RMS t = 1 min - 2500 V~ ISOL UL 94 V-0, flammability classification I 1 mA t = 1 s - 3000 V~ ISOL miniBLOC with Aluminium nitride isolation M Mounting torque 0.9/6 1.5/13 Nm/lb.in. d TM Low R HDMOS process Terminal connection torque - 1.5/13 Nm/lb.in. DS (on) Rugged polysilicon gate cell structure Weight 10 30 g Unclamped Inductive Switching (UIS) rated Low package inductance Fast intrinsic Rectifier Applications Symbol Test Conditions Characteristic Values DC-DC converters (T = 25C, unless otherwise specified) J Synchronous rectification min. typ. max. Battery chargers Switched-mode and resonant-mode V V = 0 V, I = 1 mA 300 V DSS GS D power supplies V V = V , I = 8 mA 2 4 V GS(th) DS GS D DC choppers Temperature and lighting controls I V = 20 V , V = 0 200 nA GSS GS DC DS Low voltage relays I V = 0.8 V T = 25C 400 uA DSS DS DSS J V = 0 V T = 125C 2 mA Advantages GS J Easy to mount R V = 10 V, I = 0.5 I 45 m DS(on) GS D D25 Space savings Pulse test, t 300 s, duty cycle d 2 % High power density 2001 IXYS All rights reserved 92805J (11/01)IXFK 73N30 IXFN 73N30 TO-264 AA Outline Symbol Test Conditions Characteristic Values (T = 25C, unless otherwise specified) J min. typ. max. g V = 10 V I = 0.5 I , pulse test 50 S fs DS D D25 C 9000 pF iss C V = 0 V, V = 25 V, f = 1 MHz 1500 pF oss GS DS C 580 pF rss t 30 ns d(on) t V = 10 V, V = 0.5 V , I = 0.5 I 80 ns r GS DS DSS D D25 Dim. Millimeter Inches Min. Max. Min. Max. t R = 1 (External), 100 ns d(off) G A 4.82 5.13 .190 .202 A1 2.54 2.89 .100 .114 t 50 ns f A2 2.00 2.10 .079 .083 b 1.12 1.42 .044 .056 Q 360 nC b1 2.39 2.69 .094 .106 g(on) b2 2.90 3.09 .114 .122 Q V = 10 V, V = 0.5 V , I = 0.5 I 60 nC c 0.53 0.83 .021 .033 gs GS DS DSS D D25 D 25.91 26.16 1.020 1.030 Q 180 nC gd E 19.81 19.96 .780 .786 e 5.46 BSC .215 BSC J 0.00 0.25 .000 .010 R TO-264 AA 0.25 K/W thJC K 0.00 0.25 .000 .010 R TO-264 AA 0.15 K/W L 20.32 20.83 .800 .820 thCK L1 2.29 2.59 .090 .102 P 3.17 3.66 .125 .144 R miniBLOC, SOT-227 B 0.24 K/W thJC Q 6.07 6.27 .239 .247 Q1 8.38 8.69 .330 .342 R miniBLOC, SOT-227 B 0.05 K/W thCK R 3.81 4.32 .150 .170 R1 1.78 2.29 .070 .090 S6.04 6.30 .238 .248 T 1.57 1.83 .062 .072 Source-Drain Diode Characteristic Values miniBLOC, SOT-227 B (T = 25C, unless otherwise specified) J Symbol Test Conditions min. typ. max. I V = 0 V 73 A S GS I Repetitive pulse width limited by T 292 A SM JM V I = 100 A, V = 0 V, 1.5 V SD F GS Pulse test, t 300 s, duty cycle d 2 % t 200 ns rr Q I = I , -di/dt = 100 A/ s, V = 100 V 2 C RM F S R I 40 A M4 screws (4x) supplied RM Dim. Millimeter Inches Min. Max. Min. Max. A 31.50 31.88 1.240 1.255 B 7.80 8.20 0.307 0.323 C 4.09 4.29 0.161 0.169 D 4.09 4.29 0.161 0.169 E 4.09 4.29 0.161 0.169 F 14.91 15.11 0.587 0.595 G 30.12 30.30 1.186 1.193 H 38.00 38.23 1.496 1.505 J 11.68 12.22 0.460 0.481 K 8.92 9.60 0.351 0.378 L 0.76 0.84 0.030 0.033 M 12.60 12.85 0.496 0.506 N 25.15 25.42 0.990 1.001 O 1.98 2.13 0.078 0.084 P 4.95 5.97 0.195 0.235 Q 26.54 26.90 1.045 1.059 R 3.94 4.42 0.155 0.174 S4.72 4.85 0.186 0.191 T 24.59 25.07 0.968 0.987 U -0.05 0.1 -0.002 0.004 IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
IXS
IXYS
IXYS CORP
Ixys Corporation
IXYS INTEG.CIRCUITS DIV(CLARE)
IXYS Integrated Circuits
IXYS Integrated Circuits / Clare
IXYS Integrated Circuits Division
IXYS Integrated Circuits/Clare
IXYS RF
IXYS SEMICONDUCTOR
Littelfuse/IXYS

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