NEW PRODUCT BRIEF SMPD... Power meets SMD (Surface Mount Power Device) May 2016 Overview: The demand for higher power density in system design is continually driving innovation in semiconductor packaging technology. IXYS continues to be at the forefront of this development with its new isolated package family SMPD (Surface Mount Power Device). The IXYS design cornerstone of MORE POWER LESS PACKAGE has resulted in the SMPD module range which efficiently provides solutions for applications where traditional offerings create problems such as larger module footprints, higher cost and longer cycle times in assembly and the problem that catalogue items rarely provide the best silicon content. IXYS ISOPLUS isolation technology has for many years provided a UL recognized rugged isolation platform for a wide range of leading power modules. The SMPD range now extends its ISOPLUS portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on customers existing SMD assembly lines. The ISOPLUS advantage also includes: Isolated package using IXYS own Direct Copper Very small coupling capacitance -> Reduced EMI Bonded (DCB) substrates Reduced parasitic inductance -> Optimized Voltage isolation up to 2500V (UL Recognized) Switching Performance Lower junction-to-heat sink thermal resistance Replacement of multiple discrete reduces system size Improved temperature and power cycling performance Shorter time to market in providing optimized silicon die content Higher reliability than copper based modules The IXYS SMPD range provides not only a large array of standard options in terms of topology or silicon varieties. Its simplicity by design and optimized manufacturing process can allow fast time to market for custo- mers that require differing die and circuit combinations effectively fast tracking product development. IXYS removes the need for more expensive competitive solutions and can successfully combine numerous discrete devices in one high reliability package that can then be easily assembled on current SMD assembly lines. Added to this the IXYS SMPD provides the ideal modular circuit building blocks so that the designer can select the ideal solution. For instance one SMPD can provide a solution for each stage of a Motor Inverter 1x SMPD for the three phase diode input rectifier, 1xSMPD for the Brake or PFC stage and 3xSMPD for the 3 phase IGBT inverter. The customer can then select where to position each stage to optimize his heat sink or cooling solution often downsizing materials. The IXYS SMPD range provides a solution-scale package reducing material waste and lowering power footprint for all the power electronic applications of today and those of the future. Its platform flexibility and ease in assembly provides cost efficiency not just in terms of module cost but in the important processes of system design, time to market and product assembly. WWW .IXYS .COMSMPD NEW PRODUCT BRIEF SUMMARY TABLE SMPD DIODE Part Number Pack. V I Techn. Config. Part Number Pack. V I Techn. Config. Part Number Pack. V I Techn. Config. RRM DAV RRM DAV RRM DAV (V) (A) (V) (A) (V) (A) DPG60B600LB B 600 60 DHG60U1200LB B 1200 62 CLA 60MU1200LB B 1200 2x30 DCG20B650LB B 650 21 DMA90U1800LB B 1800 99 DLA100B800LB B 800 124 CMA 50P1600LB B 2x1600 50 DCG20B1200LB B 1200 22 DHG40B1200LB B 1200 40 DSA120X150LB B 150 75 DHG50B1200LB B 1200 50 DSA120X200LB B 200 75 4) DLA100B1200LB B 1200 124 DSA240X200LB B 200 120 MMJX 1H40N150 X 1500 15.5 kA* MMIX 1H60N150V1 X 1500 32.0 kA* * ITSM Tc=25C, 1s IGBT Part Number Pack. V I Techn. Config. Part Number Pack. V I Techn. Config. Part Number Pack. V I Techn. Config. CES C25 CES C25 CES C25 (V) (A) (V) (A) (V) (A) 3) MMIX1X200N60B3 X 600 175 MMIX2S50N60B4D1 X 600 50 IXA20RG1200DHGLB B 1200 32 3) MMIX1G320N60B3 X 600 400 IXA30RG1200DHGLB B 1200 43 3) MMIX1G75N250 X 2500 110 IXA40RG1200DHGLB B 1200 61 3) MMIX1X100N60B3H1 X 600 105 IXA20PG1200DHGLB B 1200 32 3) MMIX1X200N60B3H1 X 600 175 IXA30PG1200DHGLB B 1200 43 3) MMIX1Y82N120C3H1 X 1200 78 IXA40PG1200DHGLB B 1200 61 IXA20PT1200LB B 1200 32 2) MMIX1Y100N120C3H1 X 1200 92 ITF40PF1200DHGTLB B 1200 56 1) 3) MMIX1B15N300C X 3000 37 ITF40PG1200DHGLB B 1200 56 1) MMIX1B20N300C X 3000 50 MOSFET HV-IGBT/BIMOSFET Part Number Pack. V I Techn. Config. Part Number Pack. V I Techn. Config. Part Number Pack. V I Techn. Config. DS D25 DS D25 DS C25 (V) (A) (V) (A) (V) (A) 4) MMIX1T600N04T2 X 40 600 MKE38P600LB B 600 50 MMIX4G20N250 X 2500 23 MMIX1T550N055T2 X 55 550 MKH22P650LB B 650 30 MMIX4B12N300 X 3000 26 MMIX1F520N075T2 X 75 500 MKH40P650LB B 650 54 MMIX4B20N300 X 3000 34 MMIX1F420N10T X 100 334 MCB40P1200LB B 1200 58 MMIX4B22N300 X 3000 38 MMIX1F360N15T2 X 150 235 MMIX1F230N20T X 200 168 MMIX1F180N25T X 250 130 MKE38RK600DFELB B 600 50 MMIX1F160N30T X 300 102 MKG40RK600LB B 600 54 5) MMIX1F210N30P3 X 300 108 MKH17RP650DCGLB B 650 2x22 MMIX1F132N50P3 X 500 63 MMIX1F44N100Q3 X 1000 24 MMIX1F40N110P X 1100 30 1) BIMOS Technology: 2) with NTC Rectifier FRED (fast) HiPerFRED (fast) SONIC (fast, soft) Schottky SiC (ultra fast) 3) internal Vsat detection diode Thyristor PT-IGBT XPT (SC rated) XPT (fast) Trench IGBT HV BIMOS HV IGBT Triac MOS- Gated Thyr. 4) without diode HiPerFET Q3 Polar Polar3 Trench MOSFET Trench2 CoolMOS CP CoolMOS C6 CoolMOS CFD SIC MOS 5) double SiC boost CoolMOS is a trademark of Infineon Technologies AG. PACKAGE X PACKAGE B 5,5 25 5,5 23 23 32,7 32,8 25 SMPD More details about physical dimension see package outlines in the data sheets. improved creepage and clearance distance Pin Heat Sink: 4,0 mm min Pin Pin: 7,0 mm min WWW .IXYS .COM New New New New New New New New New