X-On Electronics has gained recognition as a prominent supplier of MEA250-12DA Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. MEA250-12DA Discrete Semiconductor Modules are a product manufactured by IXYS. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

MEA250-12DA IXYS

MEA250-12DA electronic component of IXYS
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Part No.MEA250-12DA
Manufacturer: IXYS
Category: Discrete Semiconductor Modules
Description: IXYS Discrete Semiconductor Modules 500 Amps 1200V
Datasheet: MEA250-12DA Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 72.501 ea
Line Total: USD 72.5 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 03 Dec to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 72.501
12 : USD 69.696
30 : USD 68.156

0
Ship by Tue. 03 Dec to Thu. 05 Dec
MOQ : 1
Multiples : 1
1 : USD 93.5327

   
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We are delighted to provide the MEA250-12DA from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MEA250-12DA and other electronic components in the Discrete Semiconductor Modules category and beyond.

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MEA 250-12 DA V = 1200 V Fast Recovery RRM MEK 250-12 DA I = 260 A Epitaxial Diode FAVM MEE 250-12 DA t = 450 ns rr (FRED) Module Preliminary data 3 2 V V Type 1 RSM RRM MEA 250-12DA MEK 250-12DA MEE 250-012DA V V 12 3 1 2 3 1 2 3 1200 1200 Symbol Test Conditions Maximum Ratings Features I T = 75 CA367 FRMS C International standard package 75 260 I T = C rectangular, d = 0.5 A FAVM C I t < 10 s rep. rating, pulse width limited by T 1480 A with DCB ceramic base plate FRM P VJM Planar passivated chips I T = 45 C t = 10 ms (50 Hz), sine 2400 A FSM VJ Short recovery time t = 8.3 ms (60 Hz), sine 2640 A Low switching losses T = 150 C t = 10 ms (50 Hz), sine 2160 A VJ Soft recovery behaviour 2380 t = 8.3 ms (60 Hz), sine A Isolation voltage 3600 V~ 2 2 I t T = 45 C t = 10 ms (50 Hz), sine 28800 A s VJ UL registered E 72873 2 29300 t = 8.3 ms (60 Hz), sine A s 2 T = 150 C t = 10 ms (50 Hz), sine 23300 A s Applications VJ 2 t = 8.3 ms (60 Hz), sine 23800 A s Antiparallel diode for high frequency switching devices -40...+150 T C VJ T -40...+125 C Free wheeling diode in converters stg 110 T C and motor control circuits Smax Inductive heating and melting P T = 25 CW875 tot c Uninterruptible power supplies (UPS) V 50/60 Hz, RMS t = 1 min 3000 V~ ISOL Ultrasonic cleaners and welders I 1 mA t = 1 s 3600 V~ ISOL M Mounting torque (M6) 2.25-2.75/20-25 Nm/lb.in. Advantages d Terminal connection torque (M6) 4.50-5.50/40-48 Nm/lb.in. High reliability circuit operation d Creeping distance on surface 12.7 mm Low voltage peaks for reduced S d Strike distance through air 9.6 mm protection circuits A 2 a Maximum allowable acceleration 50 m/s Low noise switching Weight 150 g Low losses Symbol Test Conditions Characteristic Values (per diode) typ. max. Dimensions in mm (1 mm = 0.0394 ) I T = 25 CV = V 12 mA R VJ R RRM T = 25 CV = 0.8 V mA 3 VJ R RRM T = 125 CV = 0.8 V 60 mA VJ R RRM V I = A 150 T = 125 CV1.38 F F VJ T =25 CV1.69 VJ 260 1.54 I = A T = 125 CV F VJ T =25 CV1.80 VJ V For power-loss calculations only 1.16 V T0 r 1.46 m T R DC current 0.228 K/W thJH R DC current 0.143 K/W thJC t I = A300 T = 100 Cn450 500s rr F VJ 600 55 I V = V T = 25 CA RM R VJ -di/dt = A/400 sT = 100 CA83 VJ I rating includes reverse blocking losses at T , V = 0.6 V , duty cycle d = 0.5 FAVM VJM R RRM Data according to IEC 60747 IXYS reserves the right to change limits, test conditions and dimensions 2000 IXYS All rights reserved 1 - 2 749MEA 250-12 DA MEE 250-12 DA MEK 250-12 DA 500 80 200 T = 100C T = 100C A VJ A C VJ 450 V = 600V 180 V = 600V R R 70 400 160 I I = 300A max. Q RM 60 F r I = 300A max. I F I = 300A typ. F 350 140 F I = 300A typ. I = 250A typ. F F 50 300 I = 250A typ. 120 F I = 125A typ. F I = 125A typ. T =125C F VJ 250 40 100 T = 25C VJ 200 80 30 150 60 20 100 40 10 50 20 0 0 0 0.00.5 1.01.5 2.02V.5 100 A/ms 1000 0 200 400 600 A/800ms 1000 -di /dt -di /dt V F F F Fig. 1 Forward current I versus Fig. 2 Reverse recovery charge Q Fig. 3 Peak reverse current I F r RM voltage drop V per leg versus -di /dt versus -di /dt F F F 1.4 1200 100 2.5 T = 125C T = 100C A V VJ VJ ns 90 I = 260A V = 600V s F R 1.2 1000 K 80 2.0 f V t t FR fr V rr t FR fr 70 I = 300A max. 1.0 800 F I = 300A typ. F 60 1.5 I = 250A typ. F 0.8 600 I = 125A typ. 50 F I RM 40 1.0 0.6 400 Q 30 r 20 0.5 0.4 200 10 0.2 0 0 0.0 0 40 80 120 C 160 0 200 400 600 800 1000 0 400 800 1200 A/ms A/ms -di /dt di /dt T F F VJ Fig. 4 Dynamic parameters Q , I Fig. 5 Recovery time t versus -di /dt Fig. 6 Peak forward voltage V and t r RM rr F FR fr versus junction temperature T versus di /dt VJ F Constants for Z calculation: 0.25 thJS K/W iR (K/W) t (s) thi i 0.20 1 0.002 0.08 Z Z thJH 2 0.008 0.024 thJS 3 0.054 0.112 0.15 4 0.164 0.464 0.10 0.05 0.00 0.001 0.01 0.1 1 10 s t Fig. 7 Transient thermal impedance junction to heatsink 2000 IXYS All rights reserved 2 - 2

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8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
IXS
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