X-On Electronics has gained recognition as a prominent supplier of MII100-12A3 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. MII100-12A3 Discrete Semiconductor Modules are a product manufactured by IXYS. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

MII100-12A3 IXYS

MII100-12A3 electronic component of IXYS
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Part No.MII100-12A3
Manufacturer: IXYS
Category: Discrete Semiconductor Modules
Description: IXYS Discrete Semiconductor Modules IGBT MODULE 1200V, 100A
Datasheet: MII100-12A3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 72.2274
12 : USD 68.7479
30 : USD 65.7797
102 : USD 61.2373
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 84.5986
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Type
Vf - Forward Voltage
Vr - Reverse Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Configuration
Operating Temperature Range
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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We are delighted to provide the MII100-12A3 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MII100-12A3 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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MII100-12A3 V= 2x 1200V CES IGBT (NPT) Module I= 135A C25 VV= 2.2 CE(sat) Phase leg Part number MII100-12A3 Backside: isolated 1 7 6 3 4 5 2 Features / Advantages: Applications: Package: Y4 NPT IGBT technology AC motor drives Isolation Voltage: V~ 3600 low saturation voltage Solar inverter Industry standard outline low switching losses Medical equipment RoHS compliant switching frequency up to 30 kHz Uninterruptible power supply Soldering pins for PCB mounting square RBSOA, no latch up Air-conditioning systems Base plate: DCB ceramic high short circuit capability Welding equipment Reduced weight positive temperature coefficient for Switched-mode and resonant-mode Advanced power cycling easy parallelling power supplies MOS input, voltage controlled Inductive heating, cookers ultra fast free wheeling diodes Pumps, Fans IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20131206a 2013 IXYS all rights reservedMII100-12A3 Ratings IGBT Symbol Definition Conditions min. typ. max. Unit collector emitter voltage V T = 25C 1200 V VJ CES max. DC gate voltage V 20 V GES max. transient gate emitter voltage V 30 V GEM collector current I T = 25C 135 A C25 C I T = 80 C 90 A C C80 total power dissipation P T = 25C 560 W tot C collector emitter saturation voltage V I = A V = 15 V75 T = 25C 2.2 2.7 V CE(sat) CGE VJ T = 125 C 2.7 V VJ gate emitter threshold voltage V I = 3mA V = V T = 25C 4.5 5.5 6.5 V VJ GE(th) CGECE collector emitter leakage current I V = V V = 0 V T = 25C 5 mA CES CE CES GE VJ T = 125 C 7.5 mA VJ gate emitter leakage current I V = 20 V 300 nA GES GE total gate charge Q V = 60 0 V V = 15 V I = 75 A 350 nC G(on) CE GE C turn-on delay time t 100 ns d(on) current rise time t 50 ns r inductive load T = 125 C VJ turn-off delay time t 650 ns d(off) V = 600 V I = 75 A CE C current fall time t 50 ns f V = 15 V R = 15 GE G turn-on energy per pulse E 12.1 mJ on turn-off energy per pulse E 10.5 mJ off reverse bias safe operating area RBSOA V = 15 V R = 15 T = 125 C GE G VJ A I V = 1200 V 150 CM CEmax short circuit safe operating area SCSOA V = 12 00 V CEmax short circuit duration t SC V = 12 0 0 V V = 15 V T = 125 C 10 s CE GE VJ short circuit current I R = 15 non-repetitive 270 A SC G thermal resistance junction to case R 0.22 K/W thJC thermal resistance case to heatsink K/W R 0.22 thCH Diode max. repetitive reverse voltage V T = 25C 1200 V VJ RRM forward current A I T = 25C 150 F25 C I T = 80 C 95 A F 80 C forward voltage V I = 75 A T = 25C 2.50 V F F VJ T = 125C 1.70 V VJ reverse current V = V mA I T = 25C 1 R R RRM VJ T = 125C 1.5 mA VJ reverse recovery charge Q 7 C rr V = 600 V R max. reverse recovery current I 62 A RM -di /dt = 60 0 A/s T = 125C F VJ reverse recovery time t 200 ns rr I = 75 A V = 0 V FGE reverse recovery energy E 1.2 mJ rec thermal resistance junction to case R 0.45 K/W thJC thermal resistance case to heatsink R 0.45 K/W thCH IXYS reserves the right to change limits, conditions and dimensions. Data according to IEC 60747and per semiconductor unless otherwise specified 20131206a 2013 IXYS all rights reserved

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
IXS
IXYS
IXYS CORP
Ixys Corporation
IXYS INTEG.CIRCUITS DIV(CLARE)
IXYS Integrated Circuits
IXYS Integrated Circuits / Clare
IXYS Integrated Circuits Division
IXYS Integrated Circuits/Clare
IXYS RF
IXYS SEMICONDUCTOR
Littelfuse/IXYS
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