X-On Electronics has gained recognition as a prominent supplier of MTC120W55GC-SMD Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. MTC120W55GC-SMD Discrete Semiconductor Modules are a product manufactured by IXYS. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

MTC120W55GC-SMD IXYS

MTC120W55GC-SMD electronic component of IXYS
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Part No.MTC120W55GC-SMD
Manufacturer: IXYS
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules MSFT MODULE - 6PACK ISO PLUG
Datasheet: MTC120W55GC-SMD Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 28.578 ea
Line Total: USD 28.58 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 02 Dec to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 28.578
10 : USD 25.828
26 : USD 24.343
52 : USD 23.584
104 : USD 23.199
260 : USD 21.648
507 : USD 21.285
1001 : USD 20.79
2509 : USD 20.779

   
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We are delighted to provide the MTC120W55GC-SMD from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MTC120W55GC-SMD and other electronic components in the Discrete Semiconductor Modules category and beyond.

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MTC120W55GC V = 55 V DSS Three phase full Bridge I = 150 A with Trench MOSFETs D25 R = 2.2 mW in DCB-isolated high-current package DSon typ. Part number MTC120W55GC L+ G3 G5 G1 S3 S5 S1 L1 L2 L3 G4 G6 G2 S4 S6 S2 L Features / Advantages: Applications: Package: ISOPLUS-DIL MOSFETs in trench technology: AC drives High level of integration low R in automobiles RoHS compliant DSon optimized intrinsic reverse diode electric power steering High current capability Package: starter generator Aux. Terminals high level of integration in industrial vehicles for MOSFET control high current capability propulsion drives Terminals for soldering or welding aux. terminals for MOSFET control fork lift drives connections terminals for soldering or welding in battery supplied equipment Space and weight savings connections isolated DCB ceramic base plate with optimized heat transfer Space and weight savings Terms & Conditions of usage The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of your product, please contact your local sales office. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office. Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend - to perform joint risk and quality assessments - the conclusion of quality agreements - to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures. IXYS reserves the right to change limits, test conditions and dimensions. 20170529 2017 IXYS All rights reserved 1 - 4 t e n t a t i v eMTC120W55GC MOSFETs Ratings Symbol Definitions Conditions min. typ. max. Unit drain source breakdown voltage V T = 25C to 150C 55 V DSS VJ V gate source voltage 15 V GS V max. transient gate source voltage 20 V GSM I continuous drain current T = 25C 150 A D25 C I T = 80C 120 A D80 C I T = 100C 106 A D100 C 1) static drain source on resistance R on chip level at T = 25C 2.2 3.1 mW DS(on) VJ I = 100 A V = 10 V T = 125C 3.7 5.3 mW D GS VJ gate threshold voltage V I = 1 mA V = V T = 25C 3.0 4.0 V GS(th) D DS GS VJ drain source leakage current I V = V V = 0 V T = 25C 1 A DSS DS DSS GS VJ T = 125C 50 A VJ I gate source leakage current V = 20 V V = 0 V 500 nA GSS GS DS R gate resistance on chip level W G C input capacitance 6.97 nF iss output capacitance C V = 0 V V = 25 V f = 1 Mhz 1.03 nF oss GS DS reverse transfer capacitance C 230 pF rss total gate charge Q 100 nC g gate source charge Q V = 10 V V = 28 V I = 100 A 35 nC gs GS DS D Q gate drain (Miller) charge 25 nC gd t turn-on delay time 100 ns d(on) t current rise time 110 ns r turn-off delay time t 500 ns d(off) inductive load T = 125C VJ current fall time t 100 ns f V = 10 V V = 24 V GS DS I = 100 A R = 39 W E turn-on energy per pulse D G 0.12 mJ on E turn-off energy per pulse 0.53 mJ off turn-off reverse recovery losses E 0.01 mJ rec(off) thermal resistance junction to case R 1.0 K/W thJC thermal resistance junction to heatsink R with heat transfer paste (IXYS test setup) 1.3 K/W thJH 1) V = I (R + 2R ) DS D DS(on) Pin to Chip Source-Drain Diode forward current I V = 0 V T = 25C 140 A F25 GS C I T = 80C 95 A F80 C I T = 100C 80 A F100 C source drain voltage V I = 100 A V = 0 V T = 25C 0.9 1.2 V SD F GS VJ reverse recovery charge Q 0.45 C RM V = 24 V I = 100 A T = 125C R F VJ max. reverse recovery current I 22 A RM di/dt = 800 A/s reverse recovery time t 38 ns rr IXYS reserves the right to change limits, test conditions and dimensions. 20170529 2017 IXYS All rights reserved 2 - 4 t e n t a t i v e

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
IXS
IXYS
IXYS CORP
Ixys Corporation
IXYS INTEG.CIRCUITS DIV(CLARE)
IXYS Integrated Circuits
IXYS Integrated Circuits / Clare
IXYS Integrated Circuits Division
IXYS Integrated Circuits/Clare
IXYS RF
IXYS SEMICONDUCTOR
Littelfuse/IXYS
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