HX316C10FK2/8 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-1600 CL10 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 10 cycles Row Cycle Time (tRCmin) 48.125ns (min.) Refresh to Active/Refresh 260ns (min.) Command Time (tRFCmin) Row Active Time (tRASmin) 37.5ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V - 0 o o Operating Temperature 0 C to 85 C o o Storage Temperature -55 C to +100 C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX316C10FK2/8 is a kit of two 512M x 64-bit (4GB) JEDEC standard 1.5V (1.425V ~1.575V) Power Supply DDR3-1600 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory VDDQ = 1.5V (1.425V ~ 1.575V) modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has 800MHz fCK for 1600Mb/sec/pin been tested to run at DDR3-1600 at a low latency timing of 8 independent internal bank 10-10-10 at 1.5V. Additional timing parameters are shown in Programmable CAS Latency: 11, 10, 9, 8, 7, 6 the PnP Timing Parameters section below. The JEDEC stan- dard electrical and mechanical specifications are as follows: Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Note: The PnP feature offers a range of speed and timing options to support Burst Length: 8 (Interleave without any limit, sequential with the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS. starting address 000 only), 4 with tCCD = 4 which does not allow seamless read or write either on the fly using A12 or MRS PnP JEDEC TIMING PARAMETERS: Bi-directional Differential Data Strobe DDR3-1600 CL10-10-10 1.5V Internal(self) calibration : Internal self calibration through ZQ DDR3-1333 CL9-9-9 1.5V pin (RZQ : 240 ohm 1%) DDR3-1066 CL7-7-7 1.5V On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C Asynchronous Reset Height 1.291 (32.80mm) w/heatsink, single sided component Continued >> kingston.com/hyperx Document No. 4807011-001.B00 04/23/15 Page 1continued HyperX MODULE WITH HEAT SPREADER 7.08 mm 133.35 mm MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. kingston.com/hyperx Document No. 4807011-001.B00 Page 2 32.8 mm