X-On Electronics has gained recognition as a prominent supplier of HX318C10FWK2/8 DRAM across the USA, India, Europe, Australia, and various other global locations. HX318C10FWK2/8 DRAM are a product manufactured by Kingston. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

HX318C10FWK2/8 Kingston

HX318C10FWK2/8 electronic component of Kingston
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Part No.HX318C10FWK2/8
Manufacturer: Kingston
Category: DRAM
Description: DRAM Module DDR3 SDRAM 8Gbyte 240DIMM
Datasheet: HX318C10FWK2/8 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
180: USD 1.1601 ea
Line Total: USD 208.82 
Availability - 0
MOQ: 180  Multiples: 180
Pack Size: 180
Availability Price Quantity
0
Ship by Thu. 05 Dec to Wed. 11 Dec
MOQ : 21
Multiples : 1
21 : USD 1.4566

0
Ship by Thu. 05 Dec to Wed. 11 Dec
MOQ : 180
Multiples : 180
180 : USD 1.1601

   
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We are delighted to provide the HX318C10FWK2/8 from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HX318C10FWK2/8 and other electronic components in the DRAM category and beyond.

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HX318C10FWK2/8 8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-1866 CL10 240-Pin DIMM Kit SPECIFICATIONS CL(IDD) 10 cycles Row Cycle Time (tRCmin) 44.75ns (min.) Refresh to Active/Refresh 260ns (min.) Command Time (tRFCmin) Row Active Time (tRASmin) 32.125ns (min.) Maximum Operating Power TBD W* (per module) UL Rating 94 V - 0 o o Operating Temperature 0 C to 85 C o o Storage Temperature -55 C to +100 C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX318C10FWK2/8 is a kit of two 512M x 64-bit (4GB) JEDEC standard 1.5V (1.425V ~1.575V) Power Supply DDR3-1866 CL10 SDRAM (Synchronous DRAM) 1Rx8 memory VDDQ = 1.5V (1.425V ~ 1.575V) modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has 933MHz fCK for 1866Mb/sec/pin been tested to run at DDR3-1866 at a low latency timing of 8 independent internal bank 10-11-10 at 1.5V. Additional timing parameters are shown in Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6 the PnP Timing Parameters section below. The JEDEC stan- dard electrical and mechanical specifications are as follows: Programmable Additive Latency: 0, CL - 2, or CL - 1 clock 8-bit pre-fetch Note: The PnP feature offers a range of speed and timing options to support Burst Length: 8 (Interleave without any limit, sequential with the widest variety of processors and chipsets. Your maximum speed will starting address 000 only), 4 with tCCD = 4 which does not be determined by your BIOS. allow seamless read or write either on the fly using A12 or MRS PnP JEDEC TIMING PARAMETERS: Bi-directional Differential Data Strobe DDR3-1866 CL10-11-10 1.5V Internal(self) calibration : Internal self calibration through ZQ DDR3-1600 CL9-10-9 1.5V pin (RZQ : 240 ohm 1%) DDR3-1333 CL8-9-8 1.5V On Die Termination using ODT pin Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C Asynchronous Reset Height 1.291 (32.80mm) w/heatsink, single sided component Continued >> kingston.com/hyperx Document No. 4807035-001.B00 04/23/15 Page 1continued HyperX MODULE WITH HEAT SPREADER 7.08 mm 133.35 mm MODULE DIMENSIONS FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. kingston.com/hyperx Document No. 4807035-001.B00 Page 2 32.8 mm

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Kingston Technology
KINGSTON TECHNOLOGY COMPANY
KNG
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