ICE40LP8K-CM225 Lattice

iCE40 LP/HX Family Data Sheet FPGA-DS-02029-3.5 September 2018 iCE40 LP/HX Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. General Description ...................................................................................................................................................... 6 1.1. Features ............................................................................................................................................................... 6 2. Product Family .............................................................................................................................................................. 7 3. Architecture .................................................................................................................................................................. 8 3.1. Architecture Overview ........................................................................................................................................ 8 3.1.1. PLB Blocks ....................................................................................................................................................... 9 3.1.2. Routing .......................................................................................................................................................... 10 3.1.3. Clock/Control Distribution Network ............................................................................................................. 10 3.1.4. sysCLOCK Phase Locked Loops (PLLs) ........................................................................................................... 11 3.1.5. sysMEM Embedded Block RAM Memory ..................................................................................................... 12 3.1.6. sysI/O ............................................................................................................................................................ 14 3.1.7. sysI/O Buffer ................................................................................................................................................. 17 3.1.8. Non-Volatile Configuration Memory ............................................................................................................ 18 3.1.9. Power On Reset ............................................................................................................................................ 18 3.2. Programming and Configuration ....................................................................................................................... 18 3.2.1. Power Saving Options ................................................................................................................................... 18 4. DC and Switching Characteristics ................................................................................................................................ 19 4.1. Absolute Maximum Ratings .............................................................................................................................. 19 4.2. Recommended Operating Conditions ............................................................................................................... 19 4.3. Power Supply Ramp Rates ................................................................................................................................. 20 4.4. Power-On-Reset Voltage Levels ........................................................................................................................ 20 4.5. ESD Performance ............................................................................................................................................... 20 4.6. DC Electrical Characteristics .............................................................................................................................. 21 4.7. Static Supply Current LP Devices .................................................................................................................... 21 4.8. Static Supply Current HX Devices ................................................................................................................... 22 4.9. Programming NVCM Supply Current LP Devices ............................................................................................ 22 4.10. Programming NVCM Supply Current HX Devices ........................................................................................... 23 4.11. Peak Startup Supply Current LP Devices ........................................................................................................ 23 4.12. Peak Startup Supply Current HX Devices ........................................................................................................ 24 4.13. sysI/O Recommended Operating Conditions .................................................................................................... 24 4.14. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 24 4.15. sysI/O Differential Electrical Characteristics ..................................................................................................... 25 4.15.1. LVDS25 ...................................................................................................................................................... 25 4.15.2. subLVDS .................................................................................................................................................... 25 4.16. LVDS25E Emulation ........................................................................................................................................... 26 4.17. SubLVDS Emulation ........................................................................................................................................... 27 4.18. Typical Building Block Function Performance LP Devices* ............................................................................ 28 4.18.1. Pin-to-Pin Performance (LVCMOS25) LP Devices .................................................................................. 28 4.18.2. Register-to-Register Performance LP Devices ....................................................................................... 28 4.19. Typical Building Block Function Performance HX Devices* ............................................................................ 28 4.19.1. Pin-to-Pin Performance (LVCMOS25) HX Devices ................................................................................. 28 4.19.2. Register-to-Register Performance HX Devices ...................................................................................... 29 4.20. Derating Logic Timing ........................................................................................................................................ 29 4.21. Maximum sysI/O Buffer Performance ............................................................................................................... 29 4.22. Timing Adders ................................................................................................................................................... 30 4.23. External Switching Characteristics LP Devices ................................................................................................ 31 4.24. External Switching Characteristics HX Devices ............................................................................................... 33 4.25. sysClock PLL Timing ........................................................................................................................................... 34 4.26. SPI Master or NVCM Configuration Time .......................................................................................................... 35 4.27. sysCONFIG Port Timing Specifications ............................................................................................................... 36 4.28. Switching Test Conditions ................................................................................................................................. 37 2011-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02029-3.5