LCMXO3L-1300E-5UWG36CTR1K Lattice

MachXO3 Family Data Sheet FPGA-DS-02032-2.1 March 2018 MachXO3 Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 6 1. Introduction .................................................................................................................................................................. 7 Features ............................................................................................................................................................... 8 1.1.1. Solutions ......................................................................................................................................................... 8 1.1.2. Flexible Architecture ....................................................................................................................................... 8 1.1.3. Advanced Packaging ....................................................................................................................................... 8 1.1.4. Pre-Engineered Source Synchronous I/O ........................................................................................................ 8 1.1.5. High Performance, Flexible I/O Buffer ............................................................................................................ 8 1.1.6. Flexible On-Chip Clocking ................................................................................................................................ 8 1.1.7. Non-volatile, Multi-time Programmable ......................................................................................................... 8 1.1.8. TransFR Reconfiguration ................................................................................................................................. 8 1.1.9. Enhanced System Level Support ..................................................................................................................... 8 1.1.10. Applications ................................................................................................................................................ 8 1.1.11. Low Cost Migration Path ............................................................................................................................ 8 2. Architecture ................................................................................................................................................................ 10 Architecture Overview ...................................................................................................................................... 10 PFU Blocks ......................................................................................................................................................... 12 2.2.1. Slices ............................................................................................................................................................. 12 2.2.2. Modes of Operation ...................................................................................................................................... 14 2.2.3. RAM Mode .................................................................................................................................................... 14 2.2.4. ROM Mode .................................................................................................................................................... 14 Routing .............................................................................................................................................................. 15 Clock/Control Distribution Network................................................................................................................... 15 2.4.1. sysCLOCK Phase Locked Loops (PLLs)............................................................................................................ 17 sysMEM Embedded Block RAM Memory .......................................................................................................... 20 2.5.1. sysMEM Memory Block ................................................................................................................................ 20 2.5.2. Bus Size Matching ......................................................................................................................................... 20 2.5.3. RAM Initialization and ROM Operation ........................................................................................................ 20 2.5.4. Memory Cascading ....................................................................................................................................... 20 2.5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes .......................................................................................... 21 2.5.6. FIFO Configuration ........................................................................................................................................ 22 2.5.7. Memory Core Reset ...................................................................................................................................... 22 2.5.8. EBR Asynchronous Reset .............................................................................................................................. 23 Programmable I/O Cells (PIC) ............................................................................................................................ 24 PIO ..................................................................................................................................................................... 26 2.7.1. Input Register Block ...................................................................................................................................... 26 2.7.2. Output Register Block ................................................................................................................................... 26 2.7.3. Tri-state Register Block ................................................................................................................................. 27 Input Gearbox ................................................................................................................................................... 27 Output Gearbox................................................................................................................................................. 29 sysIO Buffer ....................................................................................................................................................... 31 2.10.1. Typical I/O Behavior during Power-up...................................................................................................... 31 2.10.2. Supported Standards ................................................................................................................................ 31 2.10.3. sysIO Buffer Banks .................................................................................................................................... 33 Hot Socketing .................................................................................................................................................... 34 On-chip Oscillator .............................................................................................................................................. 34 Embedded Hardened IP Functions .................................................................................................................... 34 2 2.13.1. Hardened I C IP Core ................................................................................................................................ 35 2.13.2. Hardened SPI IP Core ................................................................................................................................ 36 2.13.3. Hardened Timer/Counter ......................................................................................................................... 38 User Flash Memory (UFM) ................................................................................................................................ 39 Standby Mode and Power Saving Options ........................................................................................................ 39 2014-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02032-2.1