X-On Electronics has gained recognition as a prominent supplier of LCMXO3L-4300E-5UWG81ITR50 FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. LCMXO3L-4300E-5UWG81ITR50 FPGA - Field Programmable Gate Array are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

LCMXO3L-4300E-5UWG81ITR50 Lattice

Name: LCMXO3L-4300E-5UWG81ITR50
Brand: Lattice
SKU: LCMXO3L4300E5UWG81ITR50_Lattice
Availability: OutOfStock
Rating: 5 (11 reviews)

LCMXO3L-4300E-5UWG81ITR50 electronic component of Lattice

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Part No.	LCMXO3L-4300E-5UWG81ITR50
Manufacturer:	Lattice
Category:	FPGA - Field Programmable Gate Array
Description:	FPGA - Field Programmable Gate Array MachXO3, 4320 LUTs 1.2V
Datasheet:	LCMXO3L-4300E-5UWG81ITR50 Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

LCMXO3L-4300E-5UWG81ITR50 More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 4.7365 25 : USD 4.7365 100 : USD 4.5437		N/A Obsolete

We are delighted to provide the LCMXO3L-4300E-5UWG81ITR50 from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LCMXO3L-4300E-5UWG81ITR50 and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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Additional Infomation About Product

MachXO3 Family Data Sheet FPGA-DS-02032-2.3 November 2018 MachXO3 Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 6 1. Introduction .................................................................................................................................................................. 7 1.1. Features ............................................................................................................................................................... 8 1.1.1. Solutions ......................................................................................................................................................... 8 1.1.2. Flexible Architecture ....................................................................................................................................... 8 1.1.3. Advanced Packaging ....................................................................................................................................... 8 1.1.4. Pre-Engineered Source Synchronous I/O ........................................................................................................ 8 1.1.5. High Performance, Flexible I/O Buffer ............................................................................................................ 8 1.1.6. Flexible On-Chip Clocking ................................................................................................................................ 8 1.1.7. Non-volatile, Multi-time Programmable ......................................................................................................... 8 1.1.8. TransFR Reconfiguration ................................................................................................................................. 8 1.1.9. Enhanced System Level Support ..................................................................................................................... 8 1.1.10. Applications ................................................................................................................................................ 8 1.1.11. Low Cost Migration Path ............................................................................................................................ 8 2. Architecture ................................................................................................................................................................ 10 2.1. Architecture Overview ...................................................................................................................................... 10 2.2. PFU Blocks ......................................................................................................................................................... 12 2.2.1. Slices ............................................................................................................................................................. 12 2.2.2. Modes of Operation ...................................................................................................................................... 14 2.2.3. RAM Mode .................................................................................................................................................... 14 2.2.4. ROM Mode .................................................................................................................................................... 14 2.3. Routing .............................................................................................................................................................. 15 2.4. Clock/Control Distribution Network................................................................................................................... 15 2.4.1. sysCLOCK Phase Locked Loops (PLLs) ........................................................................................................... 17 2.5. sysMEM Embedded Block RAM Memory .......................................................................................................... 20 2.5.1. sysMEM Memory Block ................................................................................................................................ 20 2.5.2. Bus Size Matching ......................................................................................................................................... 20 2.5.3. RAM Initialization and ROM Operation ........................................................................................................ 20 2.5.4. Memory Cascading ....................................................................................................................................... 20 2.5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes .......................................................................................... 21 2.5.6. FIFO Configuration ........................................................................................................................................ 22 2.5.7. Memory Core Reset ...................................................................................................................................... 22 2.5.8. EBR Asynchronous Reset .............................................................................................................................. 23 2.6. Programmable I/O Cells (PIC) ............................................................................................................................ 24 2.7. PIO ..................................................................................................................................................................... 26 2.7.1. Input Register Block ...................................................................................................................................... 26 2.7.2. Output Register Block ................................................................................................................................... 26 2.7.3. Tri-state Register Block ................................................................................................................................. 27 2.8. Input Gearbox ................................................................................................................................................... 27 2.9. Output Gearbox ................................................................................................................................................. 29 2.10. sysI/O Buffer ...................................................................................................................................................... 31 2.10.1. Typical I/O Behavior during Power-up ..................................................................................................... 31 2.10.2. Supported Standards ................................................................................................................................ 31 2.10.3. sysI/O Buffer Banks ................................................................................................................................... 33 2.11. Hot Socketing .................................................................................................................................................... 34 2.12. On-chip Oscillator .............................................................................................................................................. 34 2.13. Embedded Hardened IP Functions .................................................................................................................... 35 2 2.13.1. Hardened I C IP Core ................................................................................................................................ 35 2.13.2. Hardened SPI IP Core ................................................................................................................................ 36 2.13.3. Hardened Timer/Counter ......................................................................................................................... 38 2.14. User Flash Memory (UFM) ................................................................................................................................ 39 2.15. Standby Mode and Power Saving Options ........................................................................................................ 39 2014-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02032-2.3

HS Compliance

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:

LA4 may also be referenced as

LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
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Manufacturer Lattice Lattice
Product Category FPGA - Field Programmable Gate Array FPGA - Field Programmable Gate Array
RoHS - XON Y Y
Product Machxo3l Machxo3l
Series Machxo3 Machxo3
Number of Logic Elements 4320 4320
Number of I/Os 63 I/O 63 I/O
Operating Supply Voltage 1.2 V 1.2 V
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 100 C + 100 C
Mounting Style Smd/Smt Smd/Smt
Package / Case WLCSP - 81 WLCSP - 81
Packaging Tube Tube
Data Rate 900 Mb/S 900 Mb/S
Brand Lattice Lattice
Distributed Ram 34 Kbit 34 Kbit
Embedded Block Ram - Ebr 92 Kbit 92 Kbit
Maximum Operating Frequency 400 MHz 400 MHz
Number Of Logic Array Blocks - Labs 540 540
Product Type Fpga - Field Programmable Gate Array Fpga - Field Programmable Gate Array
Factory Pack Quantity : 50 50
Subcategory Programmable Logic Ics Programmable Logic Ics
Tradename Machxo3 Machxo3
Cnhts 8542390000 8542390000
Hts Code 8542310001 8542310001
Mxhts 85423901 85423901