X-On Electronics has gained recognition as a prominent supplier of LCMXO3LF-9400E-6BG256I FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. LCMXO3LF-9400E-6BG256I FPGA - Field Programmable Gate Array are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

LCMXO3LF-9400E-6BG256I Lattice

LCMXO3LF-9400E-6BG256I electronic component of Lattice
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Part No.LCMXO3LF-9400E-6BG256I
Manufacturer: Lattice
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array MachXO3LF; 9400 LUTs; 1.2V
Datasheet: LCMXO3LF-9400E-6BG256I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 29.843 ea
Line Total: USD 29.84 
Availability - 274
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
274
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ : 1
Multiples : 1
1 : USD 29.843
25 : USD 26.29
119 : USD 26.279

   
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We are delighted to provide the LCMXO3LF-9400E-6BG256I from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LCMXO3LF-9400E-6BG256I and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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MachXO3 Family Data Sheet FPGA-DS-02032-2.3 November 2018 MachXO3 Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 6 1. Introduction .................................................................................................................................................................. 7 1.1. Features ............................................................................................................................................................... 8 1.1.1. Solutions ......................................................................................................................................................... 8 1.1.2. Flexible Architecture ....................................................................................................................................... 8 1.1.3. Advanced Packaging ....................................................................................................................................... 8 1.1.4. Pre-Engineered Source Synchronous I/O ........................................................................................................ 8 1.1.5. High Performance, Flexible I/O Buffer ............................................................................................................ 8 1.1.6. Flexible On-Chip Clocking ................................................................................................................................ 8 1.1.7. Non-volatile, Multi-time Programmable ......................................................................................................... 8 1.1.8. TransFR Reconfiguration ................................................................................................................................. 8 1.1.9. Enhanced System Level Support ..................................................................................................................... 8 1.1.10. Applications ................................................................................................................................................ 8 1.1.11. Low Cost Migration Path ............................................................................................................................ 8 2. Architecture ................................................................................................................................................................ 10 2.1. Architecture Overview ...................................................................................................................................... 10 2.2. PFU Blocks ......................................................................................................................................................... 12 2.2.1. Slices ............................................................................................................................................................. 12 2.2.2. Modes of Operation ...................................................................................................................................... 14 2.2.3. RAM Mode .................................................................................................................................................... 14 2.2.4. ROM Mode .................................................................................................................................................... 14 2.3. Routing .............................................................................................................................................................. 15 2.4. Clock/Control Distribution Network................................................................................................................... 15 2.4.1. sysCLOCK Phase Locked Loops (PLLs) ........................................................................................................... 17 2.5. sysMEM Embedded Block RAM Memory .......................................................................................................... 20 2.5.1. sysMEM Memory Block ................................................................................................................................ 20 2.5.2. Bus Size Matching ......................................................................................................................................... 20 2.5.3. RAM Initialization and ROM Operation ........................................................................................................ 20 2.5.4. Memory Cascading ....................................................................................................................................... 20 2.5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes .......................................................................................... 21 2.5.6. FIFO Configuration ........................................................................................................................................ 22 2.5.7. Memory Core Reset ...................................................................................................................................... 22 2.5.8. EBR Asynchronous Reset .............................................................................................................................. 23 2.6. Programmable I/O Cells (PIC) ............................................................................................................................ 24 2.7. PIO ..................................................................................................................................................................... 26 2.7.1. Input Register Block ...................................................................................................................................... 26 2.7.2. Output Register Block ................................................................................................................................... 26 2.7.3. Tri-state Register Block ................................................................................................................................. 27 2.8. Input Gearbox ................................................................................................................................................... 27 2.9. Output Gearbox ................................................................................................................................................. 29 2.10. sysI/O Buffer ...................................................................................................................................................... 31 2.10.1. Typical I/O Behavior during Power-up ..................................................................................................... 31 2.10.2. Supported Standards ................................................................................................................................ 31 2.10.3. sysI/O Buffer Banks ................................................................................................................................... 33 2.11. Hot Socketing .................................................................................................................................................... 34 2.12. On-chip Oscillator .............................................................................................................................................. 34 2.13. Embedded Hardened IP Functions .................................................................................................................... 35 2 2.13.1. Hardened I C IP Core ................................................................................................................................ 35 2.13.2. Hardened SPI IP Core ................................................................................................................................ 36 2.13.3. Hardened Timer/Counter ......................................................................................................................... 38 2.14. User Flash Memory (UFM) ................................................................................................................................ 39 2.15. Standby Mode and Power Saving Options ........................................................................................................ 39 2014-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02032-2.3

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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LATTICE SEMI
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Lattice Semiconductor Corporation
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