X-On Electronics has gained recognition as a prominent supplier of LIF-MD6000-6UWG36ITR50 FPGA - Field Programmable Gate Array across the USA, India, Europe, Australia, and various other global locations. LIF-MD6000-6UWG36ITR50 FPGA - Field Programmable Gate Array are a product manufactured by Lattice. We provide cost-effective solutions for FPGA - Field Programmable Gate Array, ensuring timely deliveries around the world.

LIF-MD6000-6UWG36ITR50 Lattice

LIF-MD6000-6UWG36ITR50 electronic component of Lattice
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Part No.LIF-MD6000-6UWG36ITR50
Manufacturer: Lattice
Category: FPGA - Field Programmable Gate Array
Description: FPGA - Field Programmable Gate Array Crosslink Interface MIPI D-Phy Bridge
Datasheet: LIF-MD6000-6UWG36ITR50 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 9.3343
25 : USD 6.2571
100 : USD 6.0164
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Obsolete
   
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Distributed Ram
Embedded Block Ram - Ebr
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We are delighted to provide the LIF-MD6000-6UWG36ITR50 from our FPGA - Field Programmable Gate Array category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LIF-MD6000-6UWG36ITR50 and other electronic components in the FPGA - Field Programmable Gate Array category and beyond.

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CrossLink Family Data Sheet FPGA-DS-02007 Version 1.5 July 2018 CrossLink Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. General Description ...................................................................................................................................................... 6 1.1. Features ............................................................................................................................................................... 6 2. Product Feature Summary ............................................................................................................................................ 7 3. Architecture Overview .................................................................................................................................................. 8 3.1. MIPI D-PHY Blocks ............................................................................................................................................... 9 3.2. Programmable I/O Banks .................................................................................................................................. 14 3.3. sysI/O Buffers .................................................................................................................................................... 15 3.3.1. Programmable PULLMODE Settings ............................................................................................................. 15 3.3.2. Output Drive Strength ................................................................................................................................... 15 3.3.3. On-Chip Termination .................................................................................................................................... 15 3.4. Programmable FPGA Fabric .............................................................................................................................. 16 3.4.1. PFU Blocks ..................................................................................................................................................... 16 3.4.2. Slice ............................................................................................................................................................... 17 3.5. Clocking Structure ............................................................................................................................................. 19 3.5.1. sysCLK PLL ..................................................................................................................................................... 19 3.5.2. Primary Clocks ............................................................................................................................................... 20 3.5.3. Edge Clocks ................................................................................................................................................... 20 3.5.4. Dynamic Clock Enables ................................................................................................................................. 21 3.5.5. Internal Oscillator (OSCI) ............................................................................................................................... 21 3.6. Embedded Block RAM Overview ....................................................................................................................... 22 3.7. Power Management Unit .................................................................................................................................. 23 3.7.1. PMU State Machine ...................................................................................................................................... 23 2 3.8. User I C IP .......................................................................................................................................................... 24 3.9. Programming and Configuration ....................................................................................................................... 25 4. DC and Switching Characteristics ................................................................................................................................ 26 4.1. Absolute Maximum Ratings .............................................................................................................................. 26 4.2. Recommended Operating Conditions ............................................................................................................... 26 4.3. Power Supply Ramp Rates ................................................................................................................................. 27 4.4. Power-On-Reset Voltage Levels ........................................................................................................................ 27 4.5. ESD Performance ............................................................................................................................................... 27 4.6. DC Electrical Characteristics .............................................................................................................................. 28 4.7. CrossLink Supply Current................................................................................................................................... 29 4.8. Power Management Unit (PMU) Timing ........................................................................................................... 30 4.9. sysI/O Recommended Operating Conditions .................................................................................................... 30 4.10. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 31 4.11. sysI/O Differential Electrical Characteristics ..................................................................................................... 31 4.11.1. LVDS/subLVDS/SLVS200 ........................................................................................................................... 31 4.11.2. Hardened MIPI D-PHY I/Os ....................................................................................................................... 32 4.12. CrossLink Maximum General Purpose I/O Buffer Speed ................................................................................... 33 4.13. CrossLink External Switching Characteristics .................................................................................................... 34 4.14. sysCLOCK PLL Timing ......................................................................................................................................... 40 4.15. Hardened MIPI D-PHY Performance.................................................................................................................. 41 4.16. Internal Oscillators (HFOSC, LFOSC) .................................................................................................................. 41 2 4.17. User I C .............................................................................................................................................................. 41 4.18. CrossLink sysCONFIG Port Timing Specifications .............................................................................................. 42 4.19. SRAM Configuration Time from NVCM ............................................................................................................. 42 4.20. Switching Test Conditions ................................................................................................................................. 43 5. Pinout Information ..................................................................................................................................................... 44 5.1. WLCSP36 Pinout ................................................................................................................................................ 44 5.2. ucfBGA64 Pinout ............................................................................................................................................... 45 5.3. ctfBGA80/cktBGA80 Pinout ............................................................................................................................... 47 2015-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02007-1.5

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
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LATTICE SEMI
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