MA4Mxxxx Series MNS Microwave Chip Capacitors Rev. V6 Features Case Style Excellent Repeatability ( Wafer-to-Wafer and Lot-to-Lot) Small Size Low Loss, High Q Available with Round or Square Bond Pads Description and Applications The 4M series of MNS (metal-nitride-silicon) chip capacitors is designed specifically for high reliability and repeatable performance in microwave circuit applications. These ca- pacitors are made using a low pressure chemical vapor deposition (LPCVD) that results in dense, uniform nitride layers. These devices exhibit higher capacitance per unit area (resulting in smaller chip size) and improved rugged- ness over similar MOS, MIS and ceramic capacitors. Evaporated gold contacts are used to provide an easily bondable metal pad on the capacitor chip. M/A-Com MNS capacitors have shown no measurable capacitance change when subjected to the rated standoff voltage at 150 Degrees C. The MA4M series of chip capacitors is an excellent choice for use in hybrid microwave circuits up through Ku-band, where low loss, high reliability, small size and temperature stability are prime concerns. These chip capacitors are suited for applications requiring DC blocks, coupling capacitors, bypass capacitors, capaci- tive loads and tuning elements in oscillators, multipliers and filters. Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors Characteristics Compared MNS Ceramic Operating Temperature Range -55 Deg C. to + 200 Deg. C. -55 Deg C. to + 200 Deg. C. Temperature Coefficient 180 PPM 1000 PPM Insertion Loss of a 20 pf Capacitor in a 50 Ohm .1 dB .2 dB Line 15 GHz Chip Size 200 pF, 100V 40 x 40 mils 70 x 70 mils 20 pF, 100V 22 x 22 mils 50 x 50 mils 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MA4Mxxxx Series MNS Microwave Chip Capacitors Rev. V6 Specifications Chip Capacitors with Round Bonding Pads Maximum Nominal Top Model Number Capacitance (pF) Standoff Chip Style Contact Diameter Voltage Rating ( mils ) ( Volts ) MA4M2020 20 200 132 13 MA4M1050 50 100 132 11 MA4M1100 100 100 199 20 Chip Capacitors with Square Bonding Pads Maximum Model Number Capacitance (pF) Standoff Chip Style Voltage Rating ( Volts ) MA4M3010 10 200 350 MA4M3030 30 200 352 MA4M3050 50 200 354 MA4M3100 100 50 358 MA4M3150 150 50 359 Notes : 1. Capacitance is measured 1 MHz. 2. Temperature coefficient of capacitance is nominally 180 PPM/Degrees C. 4. Device failure may occur is standoff voltage rating is exceeded. 5. Other capacitance and standoff voltage values are avail- able on request. Maximum Ratings Specified standoff voltage Applied Voltage -55 Deg.C to + 200 Deg. C Operating Temperature -55 Deg.C to + 200 Deg. C Storage Temperature 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: