MADP-042XX5-13060 Series TM SURMOUNT PIN Diodes: Rev. V8 RoHS 1,2,3 Features Package Dimensions ODS-1306 Style Surface Mount No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling RoHS Compliant Description This device is a silicon, glass PIN diode surmount TM chip fabricated with MACOMs patented HMIC process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The G diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls D E F electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for moisture, scratch and INCHES MM impact protection. These protective coatings prevent DIM MIN MAX MIN MAX damage to the junction and the anode air-bridge during handling and assembly. A 0.040 0.042 1.025 1.075 B 0.021 0.023 0.525 0.575 Applications These packageless devices are suitable for C 0.004 0.008 0.102 0.203 moderate incident power applications, 10 W CW or D 0.013 0.015 0.325 0.375 where the peak power is 50 W, pulse width is 1 s, and duty cycle is 0.01 %. Their low parasitic E 0.011 0.013 0.275 0.325 inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher F 0.013 0.015 0.325 0.375 frequency switch elements when compared to their G 0.019 0.021 0.475 0.525 plastic package counterparts. 1. Backside metal: 0.1 m thick. 2. Yellow hatched areas indicate backside ohmic gold contacts. Ordering Information 3. All devices have the same outline dimensions (A to G). Tape and Reel, Gel Pack Pocket Tape MADP-042305-130600 MADP-042305-13060P MADP-042405-130600 MADP-042405-13060P MADP-042505-130600 MADP-042505-13060P MADP-042905-130600 MADP-042905-13060P 11 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: MADP-042XX5-13060 Series TM SURMOUNT PIN Diodes: Rev. V8 RoHS 4,5,6,7 Electrical Specifications T = +25C AMB MADP-042305-13060 MADP-042505-13060 Symbol Parameter Conditions Units Min. Typ. Max. Min. Typ. Max. -10 V, 1 MHz 0.14 0.22 0.28 0.40 -10 V, 1 GHz 0.15 0.28 C Capacitance pF T -40 V, 1 MHz 0.13 0.22 0.27 0.40 -40 V, 1 GHz 0.14 0.27 +20 mA, 1 GHz 1.32 0.83 R Resistance S +50 mA, 1 GHz 1.18 0.76 V Forward Voltage +10 mA V 0.87 1.00 0.84 1.00 F I Reverse Leakage Current -80 V A 10 10 R F1 = 1000 MHz Input Third Order F2 = 1010 MHz IIP3 dBm 72 76 Intercept Point Input Power = +20 dBm I = +20 mA BIAS CW Thermal Resistance C/W 145 115 +10 mA / -6 mA T Lifetime ns 180 210 L ( 50% - 90% V ) MADP-042405-13060 MADP-042905-13060 Symbol Parameter Conditions Units Min. Typ. Max. Min. Typ. Max. -10 V, 1 MHz 0.61 0.75 0.18 -10 V, 1 GHz 0.61 C Capacitance pF 0.06 T -40 V, 1 MHz 0.57 0.75 0.18 -40 V, 1 GHz 0.58 +20 mA, 1 GHz 0.62 3.14 R Resistance S +50 mA, 1 GHz 0.58 2.60 V Forward Voltage +10 mA V 0.82 1.00 0.93 1.00 F I Reverse Leakage Current -80 V A 10 10 R F1 = 1000 MHz Input Third Order F2 = 1010 MHz IIP3 dBm 80 65 Intercept Point Input Power = +20 dBm I = +20 mA BIAS CW Thermal Resistance C/W 100 185 +10 mA / -6 mA T Lifetime ns 255 140 L ( 50% - 90% V ) 4. Total capacitance (CT) is equivalent to the sum of junction capacitance (CJ) and parasitic capacitance (Cpar). 5. Series resistance (RS) is equivalent to the total diode resistance: RS = RJ (Junction Resistance) + RC ( Ohmic Resistance) 6. RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package. 7. Theta () is measured with the die mounted in an ODS-1134 package. 22 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: