CMBA021919 Series Model : BGA Heat Sink For 19x19 Chip set CMBA021919 Series Specification 1.Material : Al 6063 2.Dimension : Foot print : 19x19mm Height : 12,15,18,21,23,28,33 mm Base (thickness) : 2.6mm 3.Finish: Black Anodize 4.Chip set package thickness and clip color 3.3+/-0.25mm - Yellow clip 1.7+/-0.25mm - Blue clip 0.8+/-0.25mm - Orange clip 5.Accessory : Clip : Plastic (UL94-V0) Thermal pad : T710 or others Performance Heat Source (LxW) 15x15 7.0 0.20 6.5 0.18 6.0 0.16 H=25 5.5 0.14 5.0 0.12 H=20 4.5 0.10 4.0 0.08 H=12 3.5 0.06 H=25 3.0 0.04 2.5 0.02 2.0 0.00 0 100 200 300 400 500 600 700 800 Air Velocity (LFM) No.5, Ming Lung Road ,Yang Mei , Taiwan 32663 website : X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for malico manufacturer: Other Similar products are found below : MBH30001-13L/2.0 CMBA024949 MBH375002-12P/2.6 CEBF0145451601-00 CL-Y-35X35 MBH42.5002-12P/2.6