TH71101ENE-CAA-000-RE Melexis

TH71101 315/433MHz FSK/ASK Receiver Features Single-conversion superhet architecture for low external component count FSK demodulation with phase-coincidence demodulator Low current consumption in active mode and very low standby current Switchable LNA gain for improved dynamic range RSSI allows signal strength indication and ASK detection 32-pin Low profile Quad Flat Package (LQFP) Application Examples Pin Description General digital data transmission Tire Pressure Monitoring Systems (TPMS) Remote Keyless Entry (RKE) 24 17 Wireless access control 25 16 VEE RO Alarm and security systems RO OUT IFA VCC PLL VCC IF Garage door openers ENRX FBC2 LF TH71101 FBC1 Remote Controls VEE LNA IN IFA IN LNA VEE IF Home and building automation VCC LNA OUT MIX2 32 9 Low-power telemetry systems 1 8 Ordering information Product Code Temperature Code Package Code Option Code Packing Form Code TH71101 E NE CAA-000 RE TH71101 E NE CAA-000 TR Legend: Temperature Code: E for Temperature Range -40C to 85C Package Code: NE for LQFP Packing Form: RE for Reel, TR for Tray Ordering example: TH71101ENE-CAA-000-RE General Description The TH71101 FSK/ASK single-conversion superheterodyne receiver IC is designed for applications in the European 433MHz industrial-scientific-medical (ISM) band, according to the EN 300 220 telecommunications standard. It can also be used for any other system with carrier frequencies ranging from 300MHz to 450MHz (e.g. for applications according to FCC part 15 and ARIB STD-T67). REVISION 018 - JUNE 29, 2017 Page 1 of 20 3901071101 VEE LNAC GAIN LNA OUTP VEE BIAS OUT LNA IN MIX1 RSSI VEE MIX OAP IF 1P OAN OUT OA IF 1N VCC MIX VCC BIASTH71101 315/433MHz FSK/ASK Receiver Contents 1. Theory of Operation ............................................................................................................................................. 3 1.1. General ........................................................................................................................................................ 3 1.2. Technical Data Overview.............................................................................................................................. 3 1.3. Block Diagram .............................................................................................................................................. 4 1.4. Mode Configurations ................................................................................................................................... 4 1.5. LNA GAIN Control......................................................................................................................................... 4 1.6. Frequency Planning...................................................................................................................................... 4 1.6.1. Selected Frequency Plans ...................................................................................................................... 5 1.6.2. Maximum Frequency Coverage ............................................................................................................. 5 2. Pin Definitions and Descriptions ........................................................................................................................... 6 3. Technical Data ...................................................................................................................................................... 9 3.1. Absolute Maximum Ratings ......................................................................................................................... 9 3.2. Normal Operating Conditions ...................................................................................................................... 9 3.3. Crystal Parameters ....................................................................................................................................... 9 3.4. DC Characteristics ...................................................................................................................................... 10 3.5. AC System Characteristics .......................................................................................................................... 11 4. Test Circuits ........................................................................................................................................................ 12 4.1. Standard FSK Reception ............................................................................................................................. 12 4.1.1. Standard FSK Application Circuit .......................................................................................................... 12 4.1.2. Standard FSK Component List .............................................................................................................. 13 4.2. Narrow Band FSK Reception ...................................................................................................................... 14 4.2.1. Narrow Band FSK Application Circuit ................................................................................................... 14 4.2.2. Narrow Band FSK Component List ....................................................................................................... 15 4.3. ASK Reception ............................................................................................................................................ 16 4.3.1. ASK Application Circuit ......................................................................................................................... 16 4.3.2. ASK Component List ............................................................................................................................. 17 5. Package Description............................................................................................................................................ 18 5.1. Soldering Information ................................................................................................................................ 18 6. Standard information regarding manufacturability of Melexis products with different soldering processes .......................................................................................................................................................... 19 7. ESD Precautions .................................................................................................................................................. 19 8. Contact ............................................................................................................................................................... 20 9. Disclaimer ........................................................................................................................................................... 20 REVISION 018 - JUNE 29, 2017 Page 2 of 20 3901071101