8329TCM Heatsink Adhesive 8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark grey, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS. Features & Benefits Cured Properties 12 Resistivity 9 x 10 cm High thermal conductivity Hardness 77 D 1:1 mix ratio 2 Tensile Strength 10 N/mm Provides strong electrical insulation 2 Compressive Strength 34 N/mm Bonds well to a wide variety of substances 2 Lap Shear (stainless steel) 6.4 N/mm Strong resistance to humidity, salt water, mild 2 (aluminum) 6.1 N/mm bases, and aliphatic hydrocarbons Glass Transition Temperature (T ) 46 C g CTE Prior T 71 ppm / C g CTE After T 131 ppm / C g Thermal Conductivity 25 C 1.4 W/(mK ) Service Temperature Range - 40 150 C Available Packaging Cat. No. Packaging Net Vol. Net Wt. 8329TCM-6ML 2 Syringe Kit 6 mL 14.8 g Usage Parameters 8329TCM-50ML 2 Jar Kit 50 mL 121 g Working Time 45 min 8329TCM-200ML 2 Can Kit 200 mL 494 g Service Cure 5 h 2 2 C Mix Ratio by Volume 1:1 Mix Ratio by Weight 0.93:1 Contact Information MG Chemicals, 1210 Corporate Drive Burlington, Ontario, Canada L7L 5R6 Uncured Properties Email: support mgchemicals.com Mixed Density 2.41 g/mL Phone: Nor th America: +(1)80 0 -3 40 - 0772 V isc o sit y 25 C (A) 780 Pas International: +(1) 905-331-1396 (B) 810 Pas Europe: +(44)1663 362888 Shelf Life >3 y ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 02 February 2021 / Ver. 4.0 18329TCM Application Instructions Cure Instructions Read the product SDS and Application Guide for Allow to cure at room temperature for 24 hours, more detailed instructions before using this product or cure the adhesive in an oven at one of these (downloadable at www.mgchemicals.com). time/temperature options: Temperature 65 C 80 C 100 C Recommended Preparation Time 1 hour 45 minutes 20 minutes Clean the substrate with Isopropyl Alcohol, MG 824, so the surface is free of oils, dust, and other residues. Storage and Handling Sto re b et ween 16 and 27 C in a dr y area, away f ro m Syringe sunlight (see SDS). To maximize shelf life, recap 1. Twist and remove the cap from the syringe. Do not pro duc t fi r mly w hen not in use. discard cap. 2. Measure 1 part by volume of A. 3. Measure 1 part by volume of B. 4. Dispense material on a mixing surface or container, and thoroughly mix parts A and B together. 5. To sto p t he fl ow, pull bac k o n t he plung er. 6. Clean nozzle to prevent contamination and material buildup. 7. Replace the cap on the syringe. Can or Jar 1. Stir each part individually to re-incorporate material that may have separated during storage. 2. Measure 0.93 part by weight of A. 3. Measure 1 part by weight of B. 4. Thoroughly mix parts A and B together. 5. Apply adhesive to the application area. Disclaimer T his info r mat i o n is b e l i eve d to b e ac c ur ate. It is intende d fo r profe s si o nal end - user s w ho have t he sk i l l s re quire d to eval uate and use t he dat a pro p er ly. M .G . Chemic al s Ltd. do e s not guar antee t he ac c ur acy of t he dat a and as sume s no l iabi l it y in c o nne c t i o n w it h damage s inc ur re d w hi l e using it . ISO 9001:2015 Quality Management System. Burlington, Ontario, Canada SAI Global File: 004008 02 February 2021 / Ver. 4.0 2